MSB710QT1 MOTOROLA | Alldatasheet

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1Motorola Small–Signal Transistors, FETs and Diodes Device Data /C0080/C0078/C0080 /C0071/C0101/C0110/C0101/C0114/C0097/C0108 /C0080/C0117/C0114/C0112/C0111/C0115/C0101 /C0065/C0109/C0112/C0108/C0105/C0102/C0105/C0101/C0114 /C0084/C0114/C0097/C0110/C0115/C0105/C0115/C0116/C0111/C0114/C0115 /C0083/C0117/C0114/C0102/C0097/C0099/C0101 /C0077/C0111/C0117/C0110/C0116 MAXIMUM RATINGS (TA = 25°C) Rating Symbol Value Unit Collector–Base Voltage V(BR)CBO –60 Vdc Collector–Emitter Voltage V(BR)CEO –50 Vdc Emitter–Base Voltage V(BR)EBO –7.0 Vdc Collector Current — Continuous IC –500 mAdc Collector Current — Peak IC(P) –1.0 Adc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Power Dissipation PD 200 mW Junction Temperature TJ 150 °C Storage Temperature Tstg –55 ~ +150 °C DEVICE MARKING Marking Symbol CQ X MSB710–QT1 CR X MSB710–RT1 The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month in which the part was manufactured. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Order this document by MSB710–QT1/D /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA  Motorola, Inc. 1996 /C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0081/C0084/C0049 /C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0082/C0084/C0049 *Motorola Preferred Device /C0042 CASE 318D–03, STYLE 1 SC–59 COLLECTOR BASE EMITTER REV 1

/C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0081/C0084/C0049 /C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0082/C0084/C0049

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Symbol Min Max Unit Collector–Emitter Breakdown Voltage (IC = –10 mAdc, IB = 0) V(BR)CEO –50 — Vdc Collector–Base Breakdown Voltage (IC = –10 µAdc, IE = 0) V(BR)CBO –60 — Vdc Emitter–Base Breakdown Voltage (IE = –10 µAdc, IC = 0) V(BR)EBO –7.0 — Vdc Collector–Base Cutoff Current (VCB = –20 Vdc, IE = 0) ICBO — –0.1 µAdc DC Current Gain(1) (VCE = –10 Vdc, IC = –150 mAdc) MSB710–QT1 MSB710–RT1 (VCE = –10 Vdc, IC = 500 mAdc) hFE1 hFE2 120 170 240 Collector–Emitter Saturation Voltage (IC = –300 mAdc, IB = –30 mAdc) VCE(sat) — –0.6 Vdc Collector–Base Saturation Voltage (IC = –300 mAdc, IB = –30 mAdc) VBE(sat) — –1.5 Vdc Output Capacitance (VCB = –10 Vdc, IE = 0, f = 1.0 MHz) C ob — 15 pF 1. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.

/C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0081/C0084/C0049 /C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0082/C0084/C0049 3Motorola Small–Signal Transistors, FETs and Diodes Device Data MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. mm inches 2.5–3.0 0.039 1.0 0.094 0.8 0.098–0.118 2.4 0.031 0.95 0.037 0.95 0.037 SC–59 POWER DISSIPATION The power dissipation of the SC–59 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface m ount device is determined by TJ(max), the maximum rated junction temperature of the die, R θJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA . Using the values provided on the data sheet, PD can be calculated as follows: PD = TJ(max) – TA R θJA The values for the equation are found in the m aximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 200 milliwatts. PD = 150°C – 25°C 625°C/W = 200 milliwatts The 625°C/W a ssume s the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board m aterial such as Thermal Clad, a power dissipation of 400 milliwatts can be achieved using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the therma l stress to which the devices are subjected.

  • Always preheat the device.
  • The delta temperature between the preheat and soldering should be 100°C or less.*
  • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
  • The soldering temperature and time should not exceed 260°C for more than 10 seconds.
  • When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less.
  • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
  • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.

4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

or stainless steel with a typical thickness of 0.008 inches. make up a heating “profile” for that particular circuit board. soldering a surface mount device to a printed circuit board. profiles are based on a high density and a low density board. degrees cooler than the adjacent solder joints.

40 TO 80 SECONDS

Figure 1. Typical Solder Heating Profile

/C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0081/C0084/C0049 /C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0082/C0084/C0049 5Motorola Small–Signal Transistors, FETs and Diodes Device Data PACKAGE DIMENSIONS CASE 318D–03 ISSUE E STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR S G H D C B L A J K DIM A MIN MAX MIN MAX INCHES 2.70 3.10 0.1063 0.1220 MILLIMETERS B 1.30 1.70 0.0512 0.0669 C 1.00 1.30 0.0394 0.0511 D 0.35 0.50 0.0138 0.0196 G 1.70 2.10 0.0670 0.0826 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.65 0.0493 0.0649 S 2.50 3.00 0.0985 0.1181 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. SC–59

/C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0081/C0084/C0049 /C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0082/C0084/C0049

6 Motorola Small–Signal Transistors, FETs and Diodes Device Data

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;JAPAN : Nippon Motorola Ltd.; T atsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P .O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 T atsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 INTERNET : http://Design–NET .com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MSB710–QT1/D /C0042/C0077/C0083/C0066/C0055/C0049/C0048/C0045/C0081/C0084/C0049/C0047/C0068/C0042