MSB601 BYTESONIC | Alldatasheet
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The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 Idea for printed circuit board Glass passivated Junction chip Low reverse leakage High forward surge current capability High temperature soldering guaranteed Mechanical Data Maximum Ratings And Electrical Characteristics Dimensions in inches and (millimeters) 1.10 MSB607 1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. I tRating for fusing (t=8.3ms, Ta=25 C) 127 A s MSB603 100 100 MSB602 MSB601Parameter .339(8.60) .311(7.90) 05(5.20) 97(5.00) 256(6.70) 264(6.50) .291(7.40) .283(7.20) 059(1.50) 051(1.30) 016(0.40) 005(0.15) 045(1.15) 037(0.95) MSB601 THRU MSB607 o MIL-STD-750,Method 2026 Lead Free Finish/RoHS 2.0 Compliant Version 1.1 2018/2/27 http://www.bytesonic.com. tw/ SINGLE PHASE 6.0 AMP SURFACE MOUNT BRIDGE RECTIFIERS A ll data sheet.com
FIG. 3-TYPICAL FORWARD VOLTAGE CHARACTERISTICS Number of cycles FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT PERLEGFIG. 1- DERATING CURVE OUTPUT RECTIFIED CURRENT Average Forward Rectified Current Amperes Instantneous Forward Current Peak Forward Surage Current Instantaneou Foward Voltage 1 100 100 0.1 Percent Of Rated Peak Reverse Voltage(%) FIG. 4-TYPICAL REVERSE LEAKAGE CHARACTERISTICS Instantaneous Reverse Leakage Current Micro Amperes Lead Temperature 1Cycle f=60Hz TJ=25 Pulse Width=300us 1% Duty Cycle 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0.0 0 20 40 60 80 100 120 140 160 Amperes Amperes Volts 0.01 0.1 1.0 100 20 40 60 80 100 120 140 T = 25 Cj ° T = 125 Cj ° Suggested Pad Layout 0.360 0.102 0.289 S ymbol Unit (mm) A 1.8 0.071 C5 .50 D 0.078 F 2.6 9.15 E B Unit (inch) 0.216 2.0 7.35 RATING AND CHARACTERISTIC CURVES (MSB601 THRU MSB607 ) Version 1.1 2018/2/27 http://www.bytesonic.com. tw/ MSB601~MSB607 A ll data sheet.com
Suggested Soldering Temperature Profile Recommended reflow methods: IR, vapor phase oven, hot air oven, wave solder. The device can be exposed to a maximum temperature of 265°C for 10 seconds. Devices can be cleaned using standard industry methods and solvents. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Note
Package Information
Carrier Dimension(mm) A0 B0 K0 D0 6.90 4.0 8.60 12.0 1.65 2.0 1.55 0.30 1.75 E F 7.50 P0 P1 P2 T W 0.1 Tolerance Package Specifications Package Reel Size Q'TY/Reel Box Size MSBL 13' 3 338 6 QTY/Box Carton Size 365*365*360 Reel DIA. 330 (mm) (Kpcs) Q'TY/Carton (mm) (mm)(Kpcs) (Kpcs) MSB601~MSB607 Version 1.1 2018/2/27 http://www.bytesonic.com. tw/ A ll data sheet.com