MSB301 BYTESONIC | Alldatasheet
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The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 Idea for printed circuit board Glass passivated Junction chip Low reverse leakage High forward surge current capability High temperature soldering guaranteed Mechanical Data Maximum Ratings And Electrical Characteristics Dimensions in inches and (millimeters) 1.0 MSB307 1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. I tRating for fusing (t=8.3ms, Ta=25 C) 33.6 A s MSB30 100 100 MSB30 MSB30 1Parameter .339(8.60) .311(7.90) 05(5.20) 97(5.00) 256(6.70) 264(6.50) .291(7.40) .283(7.20) 059(1.50) 051(1.30) 016(0.40) 005(0.15) 045(1.15) 037(0.95) o MIL-STD-750,Method 2026 Lead Free Finish/RoHS 2.0 Compliant Version 1.1 2020/5/8 http://www.bytesonic.com. tw/ MSB30 THR U MSB30 SINGLE PHASE 3.0 AMP SURFACE MOUNT BRIDGE RECTIFIERS A ll data sheet.com
RATING AND CHARACTERISTIC CURVES (MSB301 THRU MSB307 ) M SB301~MSB307 REV. 1, 18-Mar-2015 FIG. 1 – FORWARD CURRENT DERATING CURVE CASE TEMPERATURE,℃ AVER AGE FORWARD CURRENT AMPERES 2.0 3.0 1.0 0 50 150100 I NSTANTANEOUS REVERSE CURRENT,(µA) RATED PEAK REVERSE VOLTAGE, (V) FIG.4- TYPICAL REVERSE CHARACTERISTICS 140 0.01 0.1 0 20 40 60 80 1000 120 1.0 100 TJ=125 C TJ=25 TJ=75 NUMBER OF CYCLES AT 60Hz FIG. 2 – MAXIMUM NON-REPETITIVE SURGE CURRENT PEAK FO RWARD SURGE CURRENT AMPERES PULSE WIDTH 8.3ms SINGLE HALF-SINE- WAVE 120 25 10 20 50 100 1.0 0.1 FIG.3-TYPICAL FORWARD CHARACTERISTICS I NSTANTANEOUS FORWARD CURRENT AMPERES INSTANTANEOUS FORWARD VOLTAGE TJ = 25°C Suggested Pad Layout 0.360 0.102 0.289 Unit (mm)S ymbol 0.0711.8A 5.50C D 0.078 F 2.6 9.15 E B Unit (inch) 0.216 2.0 7.35 Version 1.1 2020/5/8 http://www.bytesonic.com. tw/ A ll data sheet.com
Suggested Soldering Temperature Profile Recommended reflow methods: IR, vapor phase oven, hot air oven, wave solder. The device can be exposed to a maximum temperature of 265°C for 10 seconds. Devices can be cleaned using standard industry methods and solvents. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Note
Package Information
Carrier Dimension(mm) A0 B0 K0 D0 6.90 4.0 8.60 12.0 1.65 2.0 1.55 0.30 1.75 E F 7.50 P0 P1 P2 T W 0.1 Tolerance Package Specifications Package Reel Size Q'TY/Reel Box Size MSBL 13' 3 338 6 QTY/Box Carton Size 365*365*360 Reel DIA. 330 (mm) (Kpcs) Q'TY/Carton (mm) (mm)(Kpcs) (Kpcs) MSB301~MSB307 Version 1.1 2020/5/8 http://www.bytesonic.com. tw/ A ll data sheet.com