MSB12M

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  • Manufacturer or author: Diodes Incorporated
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Document number: DS37025 Rev. 6 - 4 1 of 5 www.diodes.com December 2021 © Diodes Incorporated MSB12M OBSOLETE – PART DISCONTINUED 1.2A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Product Summary (@TA = +25°C) VRRM (V) IO (A) VF (V) IR (µA) 1,000 1.2 1.1 5 Description and Applications Suitable for AC to DC bridge full-wave rectification for SMPS ; LED lighting, adapters, battery charger s, home appliances, office equipment, and telecommunications applications. Features and Benefits  Glass Passivated Die Construction  Compact, Thin Profile Package Design  Reliable Robust Construction  Ideal for SMT Manufacturing  Lead Free Finish; RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Mechanical Data  Package: MSB  Package Material: Molded Plastic; UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Finish – Matte Tin Annealed over Copper Leadframe; Solderable per MIL-STD-202, Method 208  Polarity: As Marked on Body  Weight: 0.09 grams (Approximate) MSB Ordering Information (Note 4) Part Number Package Packing Qty. Carrier MSB12M-13 MSB 3,000 Tape & Reel Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Marking Information MSB Green Top View Internal Schematic MXX = Product Type Marking Code (XX = 12) = Manufacturers’ Code Marking YWW = Date Code Marking Y = Last Digit of Year (ex: 6 = 2016) WW = Week Code (01 to 53) _ + ~ ~ YWW M12 _ Pin Diagram Pin 1 PART OBSOLETE - USE ABS10B

Document number: DS37025 Rev. 6 - 4 2 of 5 www.diodes.com December 2021 © Diodes Incorporated MSB12M OBSOLETE – PART DISCONTINUED Maximum Ratings (@TA = +25°C, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 1,000 V RMS Reverse Voltage VR(RMS) 700 V Average Rectified Output Current @TC = +120°C IO 1.2 A Non-Repetitive Peak Forward Surge Current, 8.3ms Single Half Sine-Wave Superimposed on Rated Load IFSM 45 A Thermal Characteristics Characteristic Symbol Value Unit Typical Thermal Resistance, Junction to Ambient (Note 5) RθJA 70 °C/W Typical Thermal Resistance, Junction to Case RθJC 10 °C/W Typical Thermal Resistance, Junction to Lead RθJL 30 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 6) V(BR)R 1,000 — — V IR = 5μA Forward Voltage VF — 0.9 1.0 1.1 1.2 V IF = 0.6A IF = 1.2A Leakage Current (Note 6) IR — 500 μA VR = 1,000V, TA = +25°C VR = 1,000V, TA = +125°C Typical Total Capacitance CT — 30 — pF VR = 4V, f = 1.0MHz Notes: 5. Device mounted on glass-epoxy substrate with 1 oz 20mm x 20mm Cu pad per pin. 6. Short duration pulse test used to minimize self-heating effect.

Document number: DS37025 Rev. 6 - 4 4 of 5 www.diodes.com December 2021 © Diodes Incorporated MSB12M OBSOLETE – PART DISCONTINUED Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. MSB Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. MSB MSB Dim Min Max Typ A 1.10 1.30 1.20 A1 0.00 0.05 0.02 A4 0.05 0.08 - A5 0.03 0.08 0.05 b 0.55 0.70 0.60 c 0.12 0.18 0.15 D 4.40 4.60 4.50 E 4.90 5.10 5.00 E1 5.60 5.80 5.70 E3 2.95 3.05 3.00 e 3.45 3.55 3.50 L 0.65 0.75 0.70 x 0.60 0.70 0.65 y 0.60 0.70 0.65 All Dimensions in mm Dimensions Value (in mm) C 3.55 X 0.90 Y 1.05 Y1 6.10 EE1 e D y x Pin#1 L b c 10° A Seating Plane X Y C

Document number: DS37025 Rev. 6 - 4 5 of 5 www.diodes.com December 2021 © Diodes Incorporated MSB12M OBSOLETE – PART DISCONTINUED IMPORTANT NOTICE 1. DIODES INCORPORATED AND ITS SUBSIDIARIES (“DIODES”) MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTIC ULAR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operati on of Diodes products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engi neering customers and users who design with Diodes products. Diodes products may be used to facilitate safety -related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their ap plications, (b) evaluating the suitability of the Diodes products for their intended applications, (c) ensuring their applications, which incorporate Diodes products, comply the applicable legal and regulatory requirements as well as safety and functional -safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality control techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risk s associated with their applications. 3. Diodes assumes no liability for any application -related information, support, assistance or feedback that may be provided by Diodes from time to time. 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