MS8607-02BA01 TEC | Alldatasheet

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SENSOR SOLUTIONS ///MS8607-02BA01 Page 1 09/2015 MS8607-02BA01 PHT Combination Sensor SPECIFICATIONS  Integrated pressure, humidity and temperature sensor  QFN package 5 x 3 x 1 mm3  Operating range: 10 to 2000 mbar, 0%RH to 100%RH, -40 to 85 °C  High-resolution module: 0.016 mbar, 0.04%RH, 0.01°C  Supply voltage: 1.5 to 3.6 V  Fully factory calibrated sensor  I2C interface The MS8607 is the novel digital combination sensor of MEAS providing 3 environmental physical measurements all- in-one: pressure, humidity and temperature (PHT). This product is optimal for applications in which key requirements such as ultra low power consumption, high PHT accuracy and compactness are critical. High pressure resolution combined with high PHT linearity makes the MS8607 an ideal candidate for environmental monitoring and altimeter in smart phones and tablet PC, as well as PHT applications such as HVAC and weather stations. This new sensor module generation is based on leading MEMS technologies and latest benefits from Measurement Specialties proven experience and know-how in high volume manufacturing of sensor modules, which has been widely used for over a decade.

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 2

FEATURES

 Smart phones and Tablet PCs  HVAC applications  Weather station  Printers  Home Appliance and humidifiers TECHNICAL DATA Sensor Performances (VDD = 3 V) Characteristics Pressure [mbar] Relative Humidity [%RH] Temperature [°C] Min Typ Max Min Typ Max Min Typ Max Max. Operating Range 10 2000 0 100 -40 +85 Absolute Accuracy @25°C 300…1100mbar 20…80%RH @ 25°C -2 2 -3 3 -1 1 Resolution (highest mode) 0.016 0.04 0.01

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 3 PERFORMANCE SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Min. Typ. Max. Unit Supply voltage VDD -0.3 3.6 V Storage temperature TS -20 85 °C Overpressure Pmax 6 bar Maximum Soldering Temperature Tmax 40 sec max 250 °C ESD rating Human Body Model -2 2 kV Latch up JEDEC standard No 78 -100 100 mA

ELECTRICAL CHARACTERISTICS

Parameter General electrical characteristics Symbol Condition Min. Typ. Max. Unit Operating Supply voltage VDD 1.5 3.0 3.6 V Operating Temperature T -40 +25 +85 °C VDD to GND Capacitor 220 470 nF Supply current P or T (1 Pressure or temperature conversion per sec.) IPT OSR 8192 4096 2048 1024 512 256 20.09 10.05 5.02 2.51 1.26 0.63 µA Supply current H (1 humidity conversion per sec.) IH OSR 8192 4096 2048 1024 6.22 3.11 1.56 0.78 µA Peak supply current (during P or T conversion) 1.25 mA Peak supply current (during humidity conversion) 0.45 mA Standby supply current @ 25°C, VDD = 3V 0.03 0.24 µA Pressure and temperature Relative humidity ADC Output Word 24 16 bit ADC Conversion time(3) OSR 8192 4096 2048 1024 512 256 16.44 8.22 4.13 2.08 1.06 0.54 17.2 8.61 4.32 2.17 1.10 0.56 13.82 6.98 3.55 1.84 15.89 8.03 4.08 2.12 ms Heater: power dissipation and temperature increase over humidity sensor 2 - 13 0.5 - 1.5 mW Low battery indicator accuracy ±50 (Typ.) mV (3): Maximum values must be applied to determine waiting times in I2C communication

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 4 PERFORMANCE SPECIFICATIONS (CONTINUED) PHT CHARACTERISTICS (VDD = 3.0 V, T = 25 °C UNLESS OTHERWISE NOTED) Pressure [mbar] Relative Humidity [%RH] Temperature [°C] Operating Range Extended Range (4) 300 10 1200 2000 0 100 -40 85 Absolute Accuracy @25°C 300…1100 mbar 20 …80%RH @25°C -2 2 -3 3 -1 1 -4 4 -5 5 -2 2 Relative Accuracy @25°C Resolution RMS(7) OSR 8192 4096 2048 1024 512 256 0.016 0.021 0.028 0.039 0.062 0.11 0.04 0.7 0.002 0.003 0.004 0.006 0.009 0.012 Maximum error with supply voltage (Condition) ±0.5 ±0.25 ±0.3 Long-term stability ±1 / year ±0.5 / year ±0.3 / year Reflow soldering impact -0.6 2 Recovering time after reflow (8) 5 days 5 days Response Time (Condition) < 5ms 5 sec. (at 63% of signal recovery, From 33%RH to 75%RH, At 3m/s air flow) (4): Linear range of ADC (5): Auto-zero at one pressure point (6): Characterized value performed on qualification devices (7): Characterization performed sequentially (P&T conversion followed by H conversion) (8): Recovering time at least 66% of the reflow impact DIGITAL INPUTS (SDA, SCL) Parameter Symbol Conditions Min. Typ. Max. Unit Serial data clock SCL 400 kHz Input high voltage VIH 80% VDD 100% VDD V Input low voltage VIL 0% VDD 20% VDD V DIGITAL OUTPUTS (SDA) Parameter Symbol Conditions Min. Typ. Max. Unit Output high voltage VOH Isource = 1 mA 80% VDD 100% VDD V Output low voltage VOL Isink = 1 mA 0% VDD 20% VDD V Load Capacitance CLOAD 16 pF

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 5 PERFORMANCE CHARACTERISTICS PHT ACCURACY AND PHT ERROR VERSUS SUPPLY VOLTAGE (TYPICAL)

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 8 USER REGISTER The user register is used to configure several operating modes of the humidity sensor (resolution measurements, heater) and monitor the battery state. The possible configurations of the user register are described in the table below. User register Bit Bit Configuration/Coding Default value bit 7, bit 0 Measurement resolution Bit 7 Bit 0 OSR Resolution 0 0 4096 Highest 0 1 2048 1 0 1024 1 1 256 Lowest ‘00’ bit 6 Battery state: ‘0’ VDD>2.25V ‘1’ VDD<2.25V ‘0’ bit 3,4,5 Reserved ‘000’ bit 2 on-chip heater: ‘0’ heater disabled ‘1’ heater enabled ‘0’ bit 1 Reserved ‘0’ Figure 5: description of the user register  Bit 7 and bit 0 configure the measurement resolution (highest resolution OSR 4096, lowest OSR 256).  Bit 6 refers to the “Battery state”, which can be monitored.  Bits 1,3,4,5 are reserved bits, which must not be changed and default values of respective reserved bits may change over time without prior notice. Therefore, for any writing to user register, d efault values of reserved bits must be read first.  Bit 2 configures the heater. It can be used for functionality diagnosis : relative humidity drops upon rising temperature. The heater consumes about 5.5mW and provides a temperature increase of approximatively 0.5-1.5°C over the humidity sensor.

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 9 PRESSURE AND TEMPERATURE CALCULATION Figure 6: Flow chart for pressure and temperature reading and software compensation. Size [1] [bit] min Pressure sensitivity | SENS unsigned int 16 65535 46372 Pressure offset | OFF unsigned int 16 65535 43981 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 65535 29059 Temperature coefficient of pressure offset | TCO unsigned int 16 65535 27842 Reference temperature | T REF unsigned int 16 65535 31553 Temperature coefficient of the temperature | TEMPSENS unsigned int 16 65535 28165 Digital pressure value unsigned int 32 16777215 6465444 Digital temperature value unsigned int 32 16777215 8077636 dT Difference between actual and reference temperature [2] dT = D2 - T REF C5 * 2 signed int 32 -16776960 16777215 2000 = 20.00 °C OFF Offset at actual temperature [3] OFF OFF TCO dT = (C4 dT signed int 64 -17179344900 25769410560 5764707214 SENS Sensitivity at actual temperature [4] SENS SENS TCS dT C1 * 2 dT signed int 64 -8589672450 12884705280 3039050829 110002 = 1100.02 mbar Notes [1] [2] [3] [4] min and max have to be defined min and max have to be defined Maximal size of intermediate result during evaluation of variable 120000 1000 P Recommended variable type Description | Equation signed int 32 Actual temperature (-40…85°C with 0.01°C resolution) TEMP 20°C dT TEMPSENS 2000 dT Read digital pressure and temperature data signed int 32 Temperature compensated pressure (10…1200mbar with 0.01mbar resolution) P = D1 * SENS - OFF = (D1 * SENS / 2 - OFF) / 2 min and max have to be defined Convert calibration data into coefficients (see bit pattern of W1 to W4) Variable Example / Typical Value Calculate temperature compensated pressure 8500 -4000 TEMP Start Maximum values for calculation results: P MIN = 10mbar P MAX = 2000mbar T MIN = -40°C T MAX = 85°C T REF = 20°C Read calibration data (factory calibrated) from PROM Read digital pressure and temperature data Calculate temperature Calculate temperature compensated pressure Pressure and temperature value first order max

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 10 PRESSURE COMPENSATION (SECOND ORDER OVER TEMPERATURE) In order to optimize the accuracy over temperature range at low temperature, i t is recommended to compensate the pressure non-linearity over the temperature. This can be achieved by correc ting the calculated temperature, offset and sensitivity by a second-order correction factor. The second-order factors are calculated as f ollows: Figure 7: Flow chart for pressure and temperature to the optimum accuracy. Yes No SENS2 = 29  (TEMP – 2000)2/ 24 SENS2 = 0 SENS = SENS - SENS2 TEMP<20°C Low temperature T2 = 3  dT OFF2 = 0 T2 = T2 = 5  dT / 2 OFF2 = 61  (TEMP – 2000)2 / 24 OFF = OFF - OFF2 TEMP = TEMP - T2 Low temperature High temperature Calculate pressure and temperature TEMP<-15°C No Yes SENS2 = SENS2 + 9  (TEMP + 1500)2 Low temperature OFF2 = OFF2 + 17  (TEMP + 1500)2 Very low temperature

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 11 RELATIVE HUMIDITY CALCULATION Figure 8: Flow chart for humidity reading. To accommodate any process variation (nominal capacitance value of the humidity sensor), tolerances of the sensor above 100%RH and below 0%RH must be considered. As a consequence:  118%RH corresponds to 0xFF which is the maximum RH digital output that can be sent out from the ASIC. RH output can reach 118%RH and above this value, there will have a clamp of the RH output to this value.  -6%RH corresponds to 0x00 which is the minimum RH digital output that can be sent out from the ASIC. RH output can reach -6%RH and below this value, there will have a clamp of the RH output to this value. The relative humidity is obtained by the following formula (result in %RH):

31256 DRH

As example, the transferred 16-bit relative humidity data 0x7C80: 31872 corresponds to a relative humidity of 54.8%RH. Finally, 1st order temperature compensation is computed for optimal accuracy over [0…+85° C] temperature range. The final compensated relative humidity value RHcompensated is calculated as:   coeffdcompensate TTEMPRHRH  20 TEMP Temperature calculated on p.9 unit [°C] Tcoeff Temperature correction coefficient unit [%RH / °C] Optimal relative humidity accuracy over [0…+85°C] temperature range is obtained with Tcoeff = -0.18 Digital relative humidity value unsigned int 16 65535 31872 RH Actual relative humidity (-6 %RH…118%RH RH = - 600 + 12500 * D3 / 2 signed int 16 - 600 11900 = 54.8 %RH Notes [1] Maximal size of intermediate result during evaluation of variable Read digital pressure and temperature data Start Maximum values for calculation results: RH MIN = -6 %RH RH MAX = 118 %RH Read digital relative humidity data Calculate relative humidity Display relative humidity value Description | Equation Recommended variable type Size[1] Value min max [bit] Variable Example / Typical 5480 with 0.01 %RH resolution)

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 12 APPLICATION CIRCUIT The MS8607 is a circuit that can be used in conjunction with a microcontrolle r by I2C protocol interface. It is designed for low-voltage systems with a supply voltage of 3 V and can be used in industrial pressure / humidity / temperature applications. Figure 9: Typical application circuit

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 18 Address (Hex.) Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit 0xA0 Factory defined 0xA2 Factory defined 0xA4 Factory defined 0xA6 Factory defined 0xA8 Factory defined 0xAA Factory defined 0xAC Factory defined CRC Figure 23: RH Memory PROM mapping for relative humidity A 4-bit CRC has been implemented to check the data integrity in both PROM memo ries. The C code below describes the CRC calculation for P&T Memory PROM and for RH Memory PROM. C CODE EXAMPLE FOR CRC-4 CALCULATION (P&T MEMORY PROM) unsigned char crc4_PT(unsigned int n_prom[]) // n_prom defined as 8x unsigned int (n_prom[8]) int cnt; // simple counter unsigned int n_rem=0; // crc remainder unsigned char n_bit; n_prom[0]=((n_prom[0]) & 0x0FFF); // CRC byte is replaced by 0 n_prom[7]=0; // Subsidiary value, set to 0 for (cnt = 0; cnt < 16; cnt++) // operation is performed on bytes { // choose LSB or MSB if (cnt%2==1) n_rem ^= (unsigned short) ((n_prom[cnt>>1]) & 0x00FF); else n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8); for (n_bit = 8; n_bit > 0; n_bit--) if (n_rem & (0x8000)) n_rem = (n_rem << 1) ^ 0x3000; else n_rem = (n_rem << 1); n_rem= ((n_rem >> 12) & 0x000F); // final 4-bit remainder is CRC code return (n_rem ^ 0x00); C CODE EXAMPLE FOR CRC-4 CALCULATION (RH MEMORY PROM) unsigned char crc4_RH(unsigned int n_prom[]) // n_prom defined as 8x unsigned int (n_prom[8]) int cnt; // simple counter unsigned int n_rem=0; // crc remainder unsigned char n_bit; n_prom[6]=((n_prom[6]) & 0xFFF0); // CRC byte is replaced by 0 n_prom[7]=0; // Subsidiary value, set to 0 for (cnt = 0; cnt < 16; cnt++) // operation is performed on bytes { // choose LSB or MSB if (cnt%2==1) n_rem ^= (unsigned short) ((n_prom[cnt>>1]) & 0x00FF); else n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8); for (n_bit = 8; n_bit > 0; n_bit--) if (n_rem & (0x8000)) n_rem = (n_rem << 1) ^ 0x3000; else n_rem = (n_rem << 1); n_rem= ((n_rem >> 12) & 0x000F); // final 4-bit remainder is CRC code return (n_rem ^ 0x00);

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 19 PIN CONFIGURATION Pin Nam e Type Function

1 VDD P Positive supply voltage

3 GND G Ground

7 SDA IO I2C data IO

8 SCL

2,4,5,6 NC DEVICE PACKAGE OUTLINE

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 20 RECOMMENDED PAD LAYOUT Pad layout for bottom side of the MS8607-02BA01 soldered onto printed circuit board. SHIPPING PACKAGE Reserved area: Please do not route tracks between pads

SENSOR SOLUTIONS ///MS8607-02BA01 09/2015 Page 21 MOUNTING AND ASSEMBLY CONSIDERATIONS SOLDERING Please refer to the application note AN808 available on our website for all soldering issues. MOUNTING The MS8607 can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important to solder all contact pads. CONNECTION TO PCB The package outline of the module allows the use of a flexible PCB for interco nnection. This can be important for applications in watches and other special devices. CLEANING The MS8607 has been manufactured under cleanroom conditions. It is therefore recommen ded to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cl eaning of the PCB, solder paste of type “no-clean” shall be used. Cleaning might damage the sensor! ESD PRECAUTIONS The electrical contact pads are protected against ESD up to 2 kV HBM (human body mod el). It is therefore essential to ground machines and personnel properly during assembly and handling of the dev ice. The MS8607 is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. DECOUPLING CAPACITOR Particular care must be taken when connecting the device to the power supply. A mini mum 220nF ceramic capacitor must be placed as close as possible to the MS8607 VDD pin. T his capacitor will stabilize the power supply during data conversion and thus, provide the highest possible accuracy.

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ORDERING INFORMATION

Part Number / Art. Number Product Delivery Form MS860702BA01-50 PHT Combination Sensor Module 5x3mm Tape & Reel TE.com/sensorsolutions Measurement Specialties, Inc., a TE Connectivity company. Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/o r company names referred to herein might be trademarks of their respective owners. The information given herein, including drawings, illustrations an d schematics which are intended for illustration purposes only, is believe d to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s ob ligations shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no cas e will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. © 2015 TE Connectivity Ltd. family of companies All Rights Reserved. DA8607-02BA01_003

000086072885 ECN2515

Measurement Specialties, Inc., a TE Connectivity Company

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Fremont, CA 94538 Tel: +1 800 767 1888 Fax: +1 510 498 1578 e-mail: pfg.cs.amer@meas-spec.com Website: www.meas-spec.com EUROPE Measurement Specialties (Europe), Ltd., a TE Connectivity Company Switzerland Sàrl Ch. Chapons-des-Prés 11 CH-2022 Bevaix Tel: +41 32 847 9550 Fax: + 41 32 847 9569 e-mail: sales.ch@meas-spec.com Website: www.meas-spec.com ASIA Measurement Specialties (China), Ltd., a TE Connectivity Company No. 26 Langshan Road Shenzhen High-Tech Park (North) Nanshan District, Shenzhen, 518057 China Tel: +86 755 3330 5088 Fax: +86 755 3330 5099 e-mail: pfg.cs.asia@meas-spec.com Website: www.meas-spec.com