MS5806-02BA TEC | Alldatasheet
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SENSOR SOLUTIONS ///MS5806-02BA Page 1 09/2015 MS5806-02BA Miniature Altimeter Module SPECIFICATIONS High resolution module, 20cm Fast conversion down to 1 ms Low power, 1 µA (standby < 0.15 µA) Integrated digital pressure sensor (24 bit ΔΣ ADC) Supply voltage 1.8 to 3.6 V Operating range: 300 to 1100 mbar, -40 to +85 °C Extended Pressure Range: 10 to 2000mbar I2C or SPI interface (Mode 0, 3) No external components (Internal oscillator) Excellent long term stability Hermetically sealable for outdoor devices The MS5806-02BA is a new generation of high resolution altimeter sensors from MEAS Switzerland with SPI and I 2C bus interface. It is optimized for altimeters and variometers with an altitude resolution of 20cm. The sensor module includes a high linearity pressure sensor and an ultra low power 24 bit ΔΣ ADC with internal factory calibrated coefficients. It provides a precise digital 24 Bit pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. A high resolution temperature output allows the implementation of an altimeter/thermometer function without any additional sensor. The MS5806-02BA can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device. The gel protection and antimagnetic stainless steel cap allows the use in 100m water resistant altimeter/compass watches. This new sensor module generation is based on leading MEMS technology and latest benefits from MEAS Switzerland proven experience and know-how in high volume manufacturing of altimeter modules, which has been widely used for over a decade. The sensing principle employed leads to very low hysteresis and high stability of both pressure and temperature signal.
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 2
FEATURES
Mobile altimeter / barometer systems Bike computers Adventure or multi-mode watches Variometers Dataloggers TECHNICAL DATA Sensor Performances (VDD = 3 V) Pressure Min Typ Max Unit Range 10 2000 mbar ADC 24 bit Resolution (1) 0.13 / 0.084 / 0.054 / 0.036 / 0.024 mbar Accuracy 25°C, 750 to 1100 mbar -1.5 +1.5 mbar Accuracy -20°C to + 85°C, 300 to 1100 mbar (2) -2.5 +2.5 mbar Response time 0.5 / 1.1 / 2.1 / 4.1 / 8.22 ms Long term stability +1 mbar/yr Temperature Min Typ Max Unit Range -40 +85 °C Resolution <0.01 °C Accuracy at 25°C -0.8 +0.8 °C Notes: (1) Oversampling Ratio: 256 / 512 / 1024 / 2048 / 4096 (2) With autozero at one pressure point FUNCTIONAL BLOCK DIAGRAM Note: the communication protocol is defined by hardware (I2c: version 52 and SPI: version 42) VDD GND SCLK SDO SDI/SDA Meas. MUX ADC Digital Interface Memory (PROM) 128 bits SENSOR SGND +IN -IN dig. Filter Sensor Interface IC PGA CSB
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 3 PERFORMANCE SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min. Typ. Max Unit Supply voltage VDD -0.3 +3.6 V Storage temperature TS -40 +85 °C Overpressure Pmax ISO 2281 10 bar Maximum Soldering Temperature Tmax 40 sec max 250 °C ESD rating Human Body Model -4 +4 kV Latch up JEDEC standard No 78 -100 +100 mA
ELECTRICAL CHARACTERISTICS
Parameter Symbol Conditions Min. Typ. Max Unit Operating Supply voltage VDD 1.8 3.0 3.6 V Operating Temperature T -40 +25 +85 °C Supply current (1 sample per sec.) IDD OSR 4096 2048 1024 512 256 12.5 6.3 3.2 1.7 0.9 µA Peak supply current during conversion 1.4 mA Standby supply current at 25°C 0.02 0.14 µA VDD Capacitor From VDD to GND 100 nF ANALOG DIGITAL CONVERTER (ADC) Parameter Symbol Conditions Min. Typ. Max Unit Output Word 24 bit Conversion time tc OSR 4096 2048 1024 512 256 7.40 3.72 1.88 0.95 0.48 8.22 4.13 2.08 1.06 0.54 9.04 4.54 2.28 1.17 0.60 ms
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 4 PERFORMANCE SPECIFICATIONS (CONTINUED) PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED) Parameter Conditions Min. Typ. Max Unit Operating Pressure Range Prange Full Accuracy 300 1100 mbar Extended Pressure Range Pext Linear Range of ADC 10 2000 mbar Absolute Accuracy, no autozero at 25°C, 700..1100 mbar at 0..50°C, 300..1100 mbar at -20..85°C, 300..1100 mbar -1.5 -2.0 -3.5 +1.5 +2.0 +3.5 mbar Absolute Accuracy, autozero at one pressure point at 25°C, 700..1100 mbar at 0..50°C, 300..1100 mbar at -20..85°C, 300..1100 mbar -0.5 -1.0 -2.5 +0.5 +1.0 +2.5 mbar Maximum error with supply voltage (1) VDD = 1.8 V … 3.6 V +/- 3 mbar Maximum error with supply voltage compensation (1) (2) VDD = 2.2 V … 3.0 V +/-0.6 mbar Long-term stability +1 mbar/yr Resolution RMS OSR 4096 2048 1024 512 256 0.024 0.036 0.054 0.084 0.130 mbar (1) With autozero at 3V point (2) With voltage compensation for accumulator application TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED) Parameter Conditions Min. Typ. Max Unit Absolute Accuracy 700 ... 1100mbar -20..85°C -0.8 -2.0 +0.8 +2.0 °C Maximum error with supply voltage(1) Resolution RMS OSR 4096 2048 1024 512 256 0.002 0.003 0.005 0.008 0.012 (1) With autozero at 3V point
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 5 PERFORMANCE SPECIFICATIONS (CONTINUED) DIGITAL INPUTS (CSB, DIN, SCLK, SDA, SCL) Parameter Symbol Conditions Min. Typ. Max Unit Serial data clock SCLK SPI protocol 10 MHz Input high voltage VIH Pins CSB 80% VDD 100% VDD V Input low voltage VIL 0% VDD 20% VDD V Input leakage current Ileak25°C at 25°c 0.15 µA Load capacitance CIN 8 pF DIGITAL OUTPUTS (DOUT, SDA, SCL) Parameter Symbol Conditions Min. Typ. Max Unit Output high voltage VOH Isource = 0.6 mA 80% VDD 100% VDD V Output low voltage VOL Isink = 0.6 mA 0% VDD 20% VDD V Load capacitance CLOAD 16 pF
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 6 PERFORMANCE CHARACTERISTICS PRESSURE ERROR VS PRESSURE AND TEMPERATURE TEMPERATURE ERROR VS TEMPERATURE AND EXTENDED PRESSURE RANGE (TY PICAL ERROR) PRESSURE AND PSRR TEMPERATURE VS SUPPLY VOLTAGE -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 0 200 400 600 800 1000 1200 Pressure error [mbar] Pressure [mbar] Absolute pressure accuracy with 2nd order compensation Typical 85°C 25°C 0°C -20°C -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 -20 0 20 40 60 80 Pressure error [mbar] Temperature [°C] Pressure accuracy vs temperature Typical 1200mbar 2nd order 900 mbar 2nd order 600mbar 2nd order 1200mbar 1st order 900mbar 1st order 600mbar 1st order -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 -40 -20 0 20 40 60 80 Temperature error [°C] Temperature [°C] Temperature accuracy vs temperature Typical 900mbar 2nd order 900mbar 1st order -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 0 200 400 600 800 1000 1200 1400 1600 1800 2000 Pressure error [mbar] Pressure [mbar] Absolute pressure accuracy with 2nd order compensation Typical in extended pressure range -25 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 Pressure error [mbar] Supply voltage [V] Pressure error vs supply voltage at 25°C Typical 1000 mbar compensation
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 7 FUNCTIONAL DESCRIPTION Figure 1: Block diagram of MS5806-02BA GENERAL The MS5806-02BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5806- 02BA is to convert the uncompensated analogue output voltage from the piezo-resis tive pressure sensor to a 24- bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. FACTORY CALIBRATION Every module is individually factory calibrated at two temperatures and t wo pressures. As a result, 6 coefficients necessary to compensate for process variations and temperature variations are calc ulated and stored in the 128- bit PROM of each module. These bits (partitioned into 6 coefficients W1 to W6) must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. The 2 coefficients W0 and W7 are for factory configuration and CRC. SERIAL INTERFACE The MS5806-02BA has built in two types of serial interfaces: SPI and I2C. The pin PS is factory connected to GND or VCC to define the Protocol Select: Module ref Mode Pins used MS5806-02BA52 I2C SDA, SCL, CSB MS5806-02BA42 SPI SDI, SDO, SCLK, CSB SPI MODE The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data In). In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phas e. The sensor responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used t o enable/disable the interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the command is sent or after the end of the command execution (for example end of conversion). The best noise perform ance from the module is obtained when the SPI bus is quiet and without communication to other devices duri ng the ADC conversion in progress. VDD GND SCLK SDO SDI/SDA Meas. MUX ADC Digital Interface Memory (PROM) 128 bits SENSOR SGND +IN -IN dig. Filter Sensor Interface IC PGA CSB
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 9 PRESSURE AND TEMPERATURE CALCULATION Figure 3: Flow chart for pressure and temperature reading and software compensation. Size [1] [bit] min max C1 Pressure sensitivity | SENST1 unsigned int 16 16 0 65535 46372 C2 Pressure offset | OFFT1 unsigned int 16 16 0 65535 43981 C3 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 16 0 65535 29059 C4 Temperature coefficient of pressure offset | TCO unsigned int 16 16 0 65535 27842 C5 Reference temperature | TREF unsigned int 16 16 0 65535 31553 C6 Temperature coefficient of the temperature | TEMPSENS unsigned int 16 16 0 65535 28165 D1 Digital pressure value unsigned int 32 24 0 16777216 6465444 D2 Digital temperature value unsigned int 32 24 0 16777216 8077636 dT Difference between actual and reference temperature [2] dT = D2 - TREF = D2 - C5 * 2 8 signed int 32 25 -16776960 16777216 68 2000 = 20.00 °C OFF Offset at actual temperature [3] OFF = OFFT1 + TCO * dT = C2 * 217 + (C4 * dT ) / 26 signed int 64 41 -17179344900 25769410560 5764707214 SENS Sensitivity at actual temperature [4] SENS = SENST1 + TCS * dT = C1 * 2 16 + (C3 * dT ) / 27 signed int 64 41 -8589672450 12884705280 3039050829 110002 = 1100.02 mbar Notes [1] [2] [3] [4] min and max have to be defined min and max have to be defined Maximal size of intermediate result during evaluation of variable 120000100058P Recommended variable typeDescription | Equation signed int 32Actual temperature (-40…85°C with 0.01°C resolution) TEMP = 20°C + dT * TEMPSENS = 2000 + dT * C6 / 223 Read digital pressure and temperature data signed int 32 Temperature compensated pressure (10…1200mbar with 0.01mbar resolution) P = D1 * SENS - OFF = (D1 * SENS / 2 21 - OFF) / 2 15 min and max have to be defined Convert calibration data into coefficients (see bit pattern of W1 to W4) Variable Example / Typical Value Calculate temperature compensated pressure 8500-4000TEMP 41 Start Maximum values for calculation results: PMIN = 10mbar PMAX = 2000mbar TMIN = -40°C TMAX = 85°C TREF = 20°C Read calibration data (factory calibrated) from PROM Read digital pressure and temperature data Calculate temperature Calculate temperature compensated pressure Display pressure and temperature value
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 14 PROM READ SEQUENCE The PROM Read command consists of two parts. First command sets up the system into PROM read mode. The second part gets the data from the system. Figure 14: I2C Command to read memory address= 011 (Coefficient 3) Figure 15: I2C answer from MS5806-02BA CYCLIC REDUNDANCY CHECK (CRC) MS5806-02BA contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data validity in memory. The application note AN520 describes in detail CRC-4 code used. A d d D B D B D B D B D B D B D B D B D B D B D B D B D B D B D B D B 0 16 bit reserved for manufacturer
1 Coefficient 1 (16 bit unsigned)
2 Coefficient 2 (16 bit unsigned)
3 Coefficient 3 (16 bit unsigned)
4 Coefficient 4 (16 bit unsigned)
5 Coefficient 5 (16 bit unsigned)
6 Coefficient 6 (16 bit unsigned)
(8 bit unsigned) CRC Figure 16: Memory PROM mapping 1 1 1 0 1 1 CSB 0 0 1 0 1 0 0 1 1 0 0 S W A A P From Master S = Start Condition W = Write A = Acknowledge From Slave P = Stop Condition R = Read N = Not Acknowledge commandDevice Address Device Address cmd byte
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 15 APPLICATION CIRCUIT The MS5806-02BA is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications. It is designed for low-voltage systems with a supply voltage of 3 V. SPI protocol communication I2C protocol communication Figure 17: Typical application circuit with SPI / I2C protocol communication
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 16 PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE Figure 18: Pin configuration and package outlines, recommended PCB footprint PIN NAME: I2C - SPI TYPE FUNCTION
1 SDI – SDA I Serial Data Input
2 CSB I Chip Select (Active low)
3 VDD P Positive Supply Voltage
4 GND G Ground
5 SCLK – SCL I Serial Data Clock
6 SDO - NU O Serial Data Out
Figure 19: Pin configuration and package outlines, recommended PCB footprint
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 17 SHIPPING PACKAGE Figure 20: Tape & reel
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 18 MOUNTING AND ASSEMBLY CONSIDERATIONS SOLDERING Please refer to the application note AN808 available on our website for all soldering issues. MOUNTING The MS5806-02BA can be placed with automatic Pick & Place equipment usin g vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important to solder all contact pads. CONNECTION TO PCB The package outline of the module allows the use of a flexible PCB for interco nnection. This can be important for applications in watches and other special devices. SEALING WITH O-RINGS In products like outdoor watches the electronics must be protected against direct water or humidity. For those products the MS5806-02BA provides the possibility to seal with an O-ring. The protective cap of the MS5806-02BA is made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5806-02BA is filled with silicone gel covering the sensor and the bonding wires. The O-ring ( or O-rings) shall be placed at the outer diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical direction. CLEANING The MS5806-02BA has been manufactured under cleanroom conditions. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cl eaning of the PCB, solder paste of type “no-clean” shall be used. Cleaning might damage the sensor! ESD PRECAUTIONS The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore essential to ground machines and personnel properly during assembly and handling of the devic e. The MS5806-02BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. DECOUPLING CAPACITOR Particular care must be taken when connecting the device to the power supply. A 100 nF ceramic capacitor must be placed as close as possible to the MS5806-02BA VDD pin. This capacitor will stab ilize the power supply during data conversion and thus, provide the highest possible accuracy.
Miniature Altimeter Module SENSOR SOLUTIONS ///MS5806-02BA 09/2015 Page 19
ORDERING INFORMATION
Product Code Product Art. No Delivery Form MS5806-02BA52 MS5806-02BA I2C Miniature Altimeter Module MS580602BA52-51 Tape& reel TOP-UP MS5806-02BA42 MS5806-02BA SPI Miniature Altimeter Module MS580602BA42-51 Tape& reel TOP-UP TE.com/sensorsolutions Measurement Specialties, Inc., a TE Connectivity company. Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. The information given herein, including drawings, illustrations an d schematics which are intended for illustration purposes only, is believe d to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s ob ligations shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. © 2015 TE Connectivity Ltd. family of companies All Rights Reserved. DA5806-02BAxx_007
000058061951 ECN2205
Measurement Specialties, Inc., a TE Connectivity Company
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