MS5561C

MS5561C TEC | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 21

Technical content

SENSOR SOLUTIONS ///MS5561C Page 1 09/2015 MS5561C Micro Altimeter SPECIFICATIONS  10 - 1100 mbar / 1 – 110 kPa absolute pressure range  High accuracy temperature measurement  Integrated miniature pressure sensor 4.75 x 4.25 mm  Thin design of 1.6 mm  Piezoresistive silicon micromachined sensor  6 coefficients for software compensation stored on-chip  16 Bit ADC, sigma delta converter  3-wire serial interface  1 system clock line (32.768 kHz)  Low voltage and low power consumption The MS5561C is a SMD-hybrid device including a precision piezo-resistive pressure sensor and an ADC-Interface IC. It uses a three-wire serial interface for communication. The module dimensions of 4.75 mm x 4.25 mm and a height of only 1.6 mm allows for up- to-date SMD design. It provides a 16 bit data word from a pressure and temperature dependent voltage. The MS5561C is a low power, low voltage device with automatic power down (ON/OFF) switching. A 3-wire interface is used for all communications with a micro-controller.

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 2

FEATURES

 Pressure resolution 0.1 mbar  Operating temperature -40°C to +85°C  Supply voltage 2.2 V to 3.6 V  Low supply current, typ. 4 µA  Standby current < 0.1 µA  Calibrated temperature and pressure sensor for 2nd order compensation  ESD protected, HBM 4 kV

APPLICATIONS

 Mobile phones  GPS receivers  Altimeter applications  Personal Navigation Devices (PND)  Digital cameras with altimeter function BLOCK DIAGRAM VDD GND MCLK SCLK DOUT DIN Input MUX ADC Digital Interface Memory (PROM) 64 bits SENSOR SGND +IN -IN dig. Filter Sensor Interface IC Fig. 1: Block diagram MS5561C

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 3 PIN CONFIGURATION Fig. 2: Pin configuration of MS5561C Pin Name Pin Type Function SCLK 1 I Serial data clock GND 2 G Ground PV (1) 3 N Negative programming voltage PEN (1) 4 I Programming enable VDD 5 P Positive supply voltage MCLK 6 I Master clock (32.768 kHz) DIN 7 I Serial data input DOUT 8 O Serial data output NOTE 1) Pin 3 (PV) and Pin 4 (PEN) are only used by the manufacturer for calibration purpo ses and should not be connected. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min Max Unit Notes Supply voltage VDD Ta = 25 °C -0.3 4 V Storage temperature TS -40 +85 °C 1 Overpressure P Ta = 25 °C 5 bar NOTE 1) Storage and operation in an environment of dry and non-corrosive gases.

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 4 RECOMMENDED OPERATING CONDITIONS (Ta = 25 °C, VDD = 3.0 V unless noted otherwise) Parameter Symbol Conditions Min Typ Max Unit Operating pressure range p 10 1100 mbar abs. Supply voltage VDD 2.2 3.0 3.6 V Supply current, average (1) during conversion (2) standby (no conversion) Iavg Isc Iss VDD = 3.0 V 0.1 µA mA µA Current consumption into MCLK (3) MCLK = 32.768 kHz 0.5 µA Operating temperature range T -40 +25 +85 °C Conversion time tconv MCLK = 32.768 kHz 35 ms External clock signal (4) MCLK 30.000 32.768 35.000 kHz Duty cycle of MCLK 40/60 50/50 60/40 % Serial data clock SCLK 500 kHz NOTES 1) Under the assumption of one conversion every second. Conversion means either a pressure or a temperature measurement started by a command to the serial interface of MS5561C. 2) During conversion the sensor will be switched on and off in order to reduce power consumption; th e total on time within a conversion is about 2 ms. 3) This value can be reduced by switching off MCLK while MS5561C is in standby mode. 4) It is strongly recommended that a crystal oscillator be used because the device is sensi tive to clock jitter. A square-wave form of the clock signal is a must.

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 5

ELECTRICAL CHARACTERISTICS

Parameter Symbol Conditions Min Typ Max Unit Input High Voltage VIH 80% VDD 100% VDD V Input Low Voltage VIL 0% VDD 20% VDD V Signal Rise Time tr 200 ns Signal Fall Time tf 200 ns DIGITAL OUTPUTS Parameter Symbol Conditions Min Typ Max Unit Output High Voltage VOH Isource = 0.6 mA 80% VDD 100% VDD V Output Low Voltage VOL Isink = 0.6 mA 0% VDD 20% VDD V Signal Rise Time tr 200 ns Signal Fall Time tf 200 ns AD-CONVERTER Parameter Symbol Conditions Min Typ Max Unit Resolution 16 Bit Linear Range 4'000 40'000 LSB Conversion Time MCLK = 32.768 kHz 35 ms INL Within linear range -5 +5 LSB

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 6 PRESSURE OUTPUT CHARACTERISTICS With the calibration data stored in the interface IC of the MS5561C, the following characteristics can be achieved: (VDD = 3.0 V unless noted otherwise) Parameter Conditions Min Typ Max Unit Notes Resolution p = 300 .. 1000 mbar Ta = 25°C 0.1 mbar 1 Absolute Pressure Accuracy p = 750 .. 1100 mbar Ta = 25°C -1.5 +1.5 mbar 2 Relative Pressure Accuracy p = 750 .. 1100 mbar Ta = 25°C -0.5 +0.5 mbar 3 Relative Pressure Error over Temperature T = 0 .. +50°C p = 300 .. 1000 mbar -1 +1 mbar 4 T = -40 .. +85°C p = 300 .. 1000 mbar -2 +7 mbar 4 Long-term Stability 12 months -1 mbar 5 Maximum Error over Supply Voltage VDD = 2.2 .. 3.6 V p = const. -1.6 1.6 mbar NOTES 1) A stable pressure reading of the given resolution requires taking the average of 2 to 4 subsequent pr essure values due to noise of the ADC. 2) Maximum error of pressure reading over the pressure range. 3) Maximum error of pressure reading over the pressure range after offset adjustment at one pressure point. 4) With the second-order temperature compensation as described in Section "FUNCTION". See nex t section for typical operating curves. 5) The long-term stability is measured with non-soldered devices. TEMPERATURE OUTPUT CHARACTERISTICS This temperature information is not required for most applications, but it is necessary to allow for temperature compensation of the output. (VDD = 3.0 V unless noted otherwise) Parameter Conditions Min Typ Max Unit Notes Resolution 0.005 0.01 0.015 °C Accuracy T = 20 °C -0.8 0.8 °C Maximum Error over Supply Voltage NOTES 1) With the second-order temperature compensation as described in Section "FUNCTION". See ne xt section for typical operating curves. 2) At Ta = 25 °C.

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 7 TYPICAL PERFORMANCE CURVES ADC-value D1 vs Pressure (typical) 6000 8000 10000 12000 14000 16000 18000 20000 22000 0 100 200 300 400 500 600 700 800 900 1000 1100 Pressure (mbar) ADC-value D1 (LSB) -40°C 25°C 85°C ADC-value D2 vs Temperature (typical) 15000 20000 25000 30000 35000 40000 -40 -20 0 20 40 60 80 Temperature (°C) ADC-value D2 (LSB) Absolute Pressure Accuracy after Calibration, 2nd order compensation 0 100 200 300 400 500 600 700 800 900 1000 1100 Pressure (mbar) Pressure error (mbar) 85°C 60°C 25°C 0°C -40°C

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 8 Temperature Error Accuracy vs temperature (typical) -40 -20 0 20 40 60 80 Temperature (°C) Temperature error (°C) Temperature error (standard calculation) Temperature error (with 2nd order calculation) Pressure Error Accuracy vs temperature (typical) -40 -20 0 20 40 60 80 Temperature (°C) Pressure error (mbar) Perror(1000,1st order) Perror(1000,2nd order) Perror(800,1st order) Perror(800,2nd order) Perror(300,1st order) Perror(300,2nd order)

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 9 Pressure error vs supply voltage (typical) -0.8 -0.6 -0.4 -0.2 0.2 0.4 0.6 0.8 Voltage (V) Pressure error (mbar) 1000mbar 800mbar 300mbar Temperature error vs supply voltage (typical) -0.15 -0.1 -0.05 0.05 0.1 0.15 Voltage (V) Temperature error (°C)

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 10 FUNCTION GENERAL The MS5561C consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5561C is to convert the uncompensated analogue output voltage from the piezo-resistive pr essure sensor to a 16-bit digital value, as well as providing a 16-bit digital value for the temperature of the sensor. Measured pressure (16-bit) “D1” Measured temperature (16-bit) “D2” As the output voltage of a pressure sensor is strongly dependent on temperature and process tolerances, it is necessary to compensate for these effects. This compensation procedure must be performed by software using an external microcontroller. For both pressure and temperature measurement the same ADC is used (sigma delta converter):

• for the pressure measurement, the differential output voltage from the pressure sensor is converted
• for the temperature measurement, the sensor bridge resistor is sensed and converted During both measurements the sensor will only be switched on for a very short tim e in order to reduce power consumption. As both, the bridge bias and the reference voltage for the ADC are derived from VDD, the digital output data is independent of the supply voltage. FACTORY CALIBRATION Every module is individually factory calibrated at two temperatures and t wo pressures. As a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 64-bit PROM of each module. These 64-bit (partitioned into four words of 16-bit) must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. PRESSURE AND TEMPERATURE MEASUREMENT The sequence of reading pressure and temperature as well as of performing the software compensation is depicted in Fig. 3 and Fig. 5. First Word1 to Word4 have to be read through the serial interface. This can be done once after reset of the microcontroller that interfaces to the MS5561C. Next, the compensation coefficient s C1 to C6 are extracted using bit-wise logical- and shift-operations (refer to Fig. 4 for the bit-pattern of Word1 to Word4). For the pressure measurement, the microcontroller has to read the 16-bit values for pressure (D1) and temperature (D2) via the serial interface in a loop (for instance every second). Then, the c ompensated pressure is calculated out of D1, D2 and C1 to C6 according to the algorithm in Fig. 3 (possibly using quadratic temperature compensation according to Fig. 5). All calculations can be performed with signed 16-bit vari ables. Results of multiplications may be up to 32-bit long (+sign). In the flow according to Fig. 3 a division follow s each multiplication. This division can be performed by bit-wise shifting (divisors are to the power of 2). It is ensured that the results of these divisions are less than 65536 (16 bit). For the timing of signals to read out Word1 to Word4, D1, and D2 please refer to the paragraph “Serial Interface". Sensor Word 1..4 Calculation in external micro- controller Pressure Temperature

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 11 System initialisation Pressure and temperature measurement Example: Word1, Word2, Word3 and Word4 (4x16 Bit) D1 = 16460 D2 = 27856 Start Convert calibration data into coefficients: (see bit pattern of Word1-Word4) Read calibration data (factory calibrated) from PROM of MS5561C Read digital pressure value from MS5561C D1 (16 Bit) Read digital temperature value from MS5561C Display pressure and temperature value Basic equations: Calculate calibration temperature UT1 = 8*C5+20224 Calculate temperature compensated pressure Difference between actual temperature and reference temperature: dT = D2 - UT1 Actual temperature: TEMP = 200 + dT*(C6+50)/210 (0.1°C resolution) Calculate actual temperature D2 (16 Bit) SENST1 OFFT1 TCS TCO Tref TEMPSENS C1: Pressure sensitivity (15 Bit) C2: Pressure offset (12 Bit) C3: Temperature coefficient of pressure sensitivity (10 Bit) C4: Temperature coefficient of pressure offset (10 Bit) C5: Reference Temperature (11 Bit) C6: Temperature coefficient of the temperature (6 Bit) Word1 = 46940 Word2 = 40217 Word3 = 25172 Word4 = 47212 C1 = 23470 C2 = 1324 C3 = 737 C4 = 393 C5 = 628 C6 = 25 dT(D2) = D2 - Tref TEMP(D2) = 20°+dT(D2)*TEMPSENS Offset at actual temperature: Sensitivity at actual temperature: SENS = C1 + (C3*dT)/210 + 24576 X = (SENS * (D1-7168))/214 - OFF Temperature compensated pressure: P = X*10/25 + 250*10 (0.1 mbar resolutio n) OFF(D2) = OFFT1+TCO*dT(D2) SENS(D2) = SENST1+TCS*dT(D2) P(D1,D2) = D1*SENS(D2)-OFF(D2) dT = 2608 TEMP = 391 = 39.1 °C OFF = 5220 SENS = 49923 X = 23093 P = 9716 = 971.6 mbar UT1 = 25248 Fig. 3: Flow chart for pressure and temperature reading and software compensation

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 12 NOTES 1) Readings of D2 can be done less frequently, but the display w ill be less stable in this case. 2) For a stable display of 1 mbar resolution, it is recommended to display the average of 8 s ubsequent pressure values. C1 (15 Bit) C5/I

1 Bit

Word1 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB10 C5/II (10 Bit) C6 (6 Bit) Word2 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB5 DB4 DB3 DB2 DB1 DB0 C4 (10 Bit) C2/I (6 Bit) Word3 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB11 DB10 DB9 DB8 DB7 DB6 C3 (10 Bit) C2/II (6-Bit) Word4 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB5 DB4 DB3 DB2 DB1 DB0 Fig. 4: Arrangement (Bit-pattern) of calibration data in Word1 to Word4

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 13 SECOND-ORDER TEMPERATURE COMPENSATION In order to obtain full temperature accuracy over the whole temperature range, it is recomm ended to compensate for the non-linearity of the output of the temperature sensor. This can be achie ved by correcting the calculated temperature and pressure by a second order correction factor. The second-order factors are calculated as follows : Fig. 5: Flow chart for calculating the temperature and pressure to the optimum accuracy. No correction T2 = 0 P2 = 0 High Temperatures P2 = T2 * (P - 10000)/213 TEMP < 200 yes Calculate pressure and temperature TEMP = TEMP – T2 P = P – P2 Low Temperatures TEMP > 450 yes 200  TEMP  450 yes

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 14 SERIAL INTERFACE The MS5561C communicates with microprocessors and other digital systems via a 3-wire synchronous serial interface as shown in Fig. 1. The SCLK (Serial clock) signal initiates the communication and synchronizes the data transfer with each bit being sampled by the MS5561C on the rising edge of S CLK and each bit being sent by the MS5561C on the rising edge of SCLK. The data should thus be sampled by the microcontroll er on the falling edge of SCLK and sent to the MS5561C with the falling edge of SCLK. The SCLK-signal is generated by the microprocessor’s system. The digital data provided by the MS5561C on the DOUT pin is either the conversion result or the software calibration data. In addition, the signal DOUT (Data out) is also us ed to indicate the conversion status (conversion-ready signal, see below). The selection of the output data is done by sending the corresponding instruction on the pin DIN (Data input). Following is a list of possible output data instructions:  Conversion start for pressure measurement and ADC- data-out “D1” (Figure 6a)  Conversion start for temperature measurement and ADC- data-out “D2” (Figure 6b)  Calibration data read-out sequence for Word1 (Figure 6c)  Calibration data read-out sequence for Word2 (Figure 6d)  Calibration data read-out sequence for Word3 (Figure 6c)  Calibration data read-out sequence for Word4 (Figure 6d)  RESET sequence (Figure 6e) Every communication starts with an instruction sequence at pin DIN. Fig. 6 shows the timing diagrams for the MS5561C. The device does not need a ‘Chip select’ signal. Instead there is a START sequence (3-Bit high) before each SETUP sequence and STOP sequence (3-Bit low) after each SETUP s equence. The SETUP sequence consists in 4-Bit that select a reading of pressure, temperature or calibration data. In c ase of pressure- (D1) or temperature- (D2) reading the module acknowledges the start of a conversion by a l ow to high transition at pin DOUT. Two additional clocks at SCLK are required after the acknowledge signal. Then S CLK is to be held low by the microcontroller until a high to low transition on DOUT indicates the end of the conversion. This signal can be used to create an interrupt in the microcontroller. The mic rocontroller may now read out the 16 bit word by giving another 17 clocks on the SLCK pin. It is possible to interrup t the data READOUT sequence with a hold of the SCLK signal. It is important to always read out the last conversion result before starting a new conversion. The RESET sequence is special as the module in any state recognizes its unique pattern. By consequence, it can be used to restart if synchronization between the microcontroller and the MS5561C has been lost. This sequence is 21-bit long. The DOUT signal might change during that sequence (see Fig. 6e) . It is recommended to send the RESET sequence before each CONVERSION sequence to avoid hanging up the protocol perm anently in case of electrical interference. sequence: START+P-measurement SCLKDOUTDIN Bit7 Conversion start for pressure measurement and ADC-data-out "D1": end of conversion Bit6Bit5Bit4Bit3Bit2Bit1Bit0 conversion (33ms) DB7 ADC-data out MSB ADC-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 start of conversion Setup-bits Fig. 6a: D1 ACQUISITION sequence

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 15 sequence: START+T-measurement SCLKDOUTDIN Bit7 Conversion start for temperature measurement and ADC-data-out "D2": end of conversion Bit6Bit5Bit4Bit3Bit2Bit1Bit0 conversion (33ms) Bit8 Bit9 Start-bit Stop-bitSetup-bits start of conversion DB7 ADC-data out MSB ADC-data out LSB DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Fig. 6b: D2 ACQUISITION sequence sequence: coefficient read + address SCLKDOUTDIN Bit7 Calibration data read out sequence for word 1/ word 3: Bit6Bit5Bit4Bit3Bit2Bit1Bit0 DB7 coefficient-data out MSB coefficient-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Bit10Bit11 address word 1 address word 3 Setup-bits Fig. 6c: Word1, Word3 READING sequence address word 2 address word 4 sequence: coefficient read + address SCLKDOUTDIN Bit7 Calibration data read out sequence for word 2/ word 4: Bit6Bit5Bit4Bit3Bit2Bit1Bit0 DB7 coefficient-data out MSB coefficient-data out LSB Bit8 Bit9 Start-bit Stop-bit DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Bit10Bit11 Setup-bits Fig. 6d: W2, W4 READING sequence sequence: RESET SCLKDOUTDIN Bit7 RE SE T - sequence: Bit6Bit5Bit4Bit3Bit2Bit1Bit0 Bit8 Bit9Bit10Bit11 Bit12Bit13Bit14Bit15Bit16Bit17Bit18Bit19Bit20 Fig. 6e: RESET sequence (21 bit)

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 16

APPLICATION INFORMATION

The advantage of combining a pressure sensor with a directly adapted integrated circui t is to save other external components and to achieve very low power consumption. The main application field for this system includes portable devices with battery supply, but its high accuracy and resolution m ake it also suited for industrial and automotive applications. The possibility to compensate the sensor by software allow s the user to adapt it to his particular application. Communication between the MS5561C and the widely avai lable microcontrollers is realized over an easy- to-use 3-wire serial interface. Customers may select which microcontroller sy stem to be used, and there are no specific standard interface cells required, which may be of inte rest for specially designed 4 bit- microcontroller applications. For communication via SPI interface please refer to application note AN510 that may be downloaded from the MEAS Switzerland website. CALIBRATION The MS5561C is factory calibrated. The calibration data is stored inside the 64 bit PROM mem ory. SOLDERING Please refer to the application note AN808 for all soldering issues. HUMIDITY, WATER PROTECTION This module is designed for the integration into portable devices and suffici ently protected against humidity. A silicone gel for enhanced protection against humidity covers the membrane of the pressure transducer. The module must not be used for under water applications. LIGHT SENSITIVITY The MS5561C is protected against sunlight by a layer of white gel. It is, however, important to note that the sensor may still be slightly sensitive to sunlight, especially to infrared light sources. This is due to the strong photo effect of silicon. As the effect is reversible there will be no damage, but the user h as to take care that in the final product the sensor cannot be exposed to direct light during operation. DECOUPLING CAPACITOR Particular care must be taken when connecting the device to power supply. A 47 F tantalum capacitor must be placed as close as possible of the MS5561C's VDD pin. This capacitor will stabili ze the power supply during data conversion and thus, provide the highest possible accuracy.

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 17 APPLICATION EXAMPLE: ALTIMETER SYSTEM USING MS5561C MS5561C is a circuit that can be used in connection with a microcontrol ler in mobile altimeter applications. It is designed for low-voltage systems with a supply voltage of 3V, particularly i n battery applications. The MS5561C is optimised for low current consumption as the AD-converter clock (MCLK) can us e the 32.768 kHz frequency of a standard watch crystal, which is supplied in most portable watch systems. For applications in altimeter systems MEAS Switzerland can deliver a simple formula to calculate the altitude, based on a linear interpolation, where the number of interpolation points influences the accuracy of the formula. Figure 7: Demonstration of MS5561C in a mobile altimeter RECOMMENDED PAD LAYOUT Pad layout for bottom side of MS5561C soldered onto printed circuit board. Microcontroller LCD-Display EEPROM Keypad MS5561C SCLK DIN DOUT MCLK XTAL1 XTAL2 32.768 kHz optional VDD GND VDD GND 3V-Battery 47uF Tantal

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 18 DEVICE PACKAGE OUTLINES Fig. 8: Device package outlines of MS5561-C

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 19 ASSEMBLY MOUNTING The MS5561C can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important to solder all contact pads to avoid floating of the sensor during soldering. The pins PEN and PV shall be left open or connected to VDD. Do not connect the pins PEN and PV to GND! CLEANING The MS5561C has been manufactured under cleanroom conditions. Each device has b een inspected for the homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended t o protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “ no-clean” shall be used. Cleaning might damage the sensor! ESD PRECAUTIONS The electrical contacts except programming pads are protected against ESD up to 4 kV HBM (human body model). The MS5561C is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material.

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 20 SHIPPING PACKAGE Tape Units per reel 4’000 Minimum empty leader (right side of drawing) 250 mm Tape widths 12 mm Minimum empty trailer (left side of drawing, direction of unreeling) 250 mm Tape material Black Conductive Polystyrene Reel diameter 13” / 330 mm Fig, 9: Outline of tape for MS5561C Fig.10: Outline of reel for MS5561C

SENSOR SOLUTIONS ///MS5561C 09/2015 Page 21

ORDERING INFORMATION

Product Code Product Art. No Package Comments MS5561-C Micro Altimeter 325561000 Small Size SMD with metal lid Module height 1.6 mm TE.com/sensorsolutions Measurement Specialties, Inc., a TE Connectivity company. Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believe d to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligation s shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. © 2015 TE Connectivity Ltd. family of companies All Rights Reserved. DA5561C_005 0005561C1126 ECN1775 NORTH AMERICA Measurement Specialties, Inc., a TE Connectivity Company

45738 Northport Loop West

Fremont, CA 94538 Tel: +1 800 767 1888 Fax: +1 510 498 1578 e-mail: pfg.cs.amer@meas-spec.com Website: www.meas-spec.com EUROPE Measurement Specialties (Europe), Ltd., a TE Connectivity Company Switzerland Sàrl Ch. Chapons-des-Prés 11 CH-2022 Bevaix Tel: +41 32 847 9550 Fax: + 41 32 847 9569 e-mail: sales.ch@meas-spec.com Website: www.meas-spec.com ASIA Measurement Specialties (China), Ltd., a TE Connectivity Company No. 26 Langshan Road Shenzhen High-Tech Park (North) Nanshan District, Shenzhen, 518057 China Tel: +86 755 3330 5088 Fax: +86 755 3330 5099 e-mail: pfg.cs.asia@meas-spec.com Website: www.meas-spec.com