MS5525DSO

MS5525DSO TEC | Alldatasheet

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SENSOR SOLUTIONS ///MS5525DSO Page 1 09/2016 MS5525DSO (Digital Small Outline) SPECIFICATIONS  Integrated Digital Pressure Sensor (24-bit ∆Σ ADC)  Fast Conversion Down to 1 ms  Low Power, 1 µA (standby < 0.15 µA)  Supply Voltage: 1.8 to 3.6V  Pressure Range: 1 to 30 PSI  I2C and SPI Interface The MS5525DSO is a new generation of Digital Small Outline pressure sensors from MEAS with SPI and I 2C bus interface designed for high volume OEM users. The sensor module includes a pressure s ensor and an ultra low power 24 -bit ∆Σ ADC with internal factory calibrated coefficients. It provides a 24-bit digital pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. The MS5525DSO can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device . This new sensor module generation is based on leading MEMS technology and latest benefits from TE proven experience and know -how in high volume manufacturing of pressure modules, which have been widely used for over a decade. The rugged engineered thermoplastic transducer is available in single and dual port configurations, and can measure absolute, gauge, compound, and differential pressure from 1 to 30psi.

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 2

FEATURES

 Small Outline IC Package  Barbed Pressure Ports  Low Power, High Resolution ADC  Digital Pressure and Temperature Outputs

APPLICATIONS

 Factory Automation  Altitude and Airspeed Measurements  Medical Instruments  Leak Detection STANDARD RANGES (PSI) FS Pressure Absolute Gauge Differential

1 DB, SB, ST, DH,FT DB, SB,ST, DH

2 DB, SB, ST, DH,FT DB, SB,ST, DH

5 DB, SB, ST, DH,FT DB, SB,ST ,DH

15 DB, DH,FT DB, SB, ST, DH,FT DB, DH

30 DB, DH,FT DB, SB, ST, DH,FT DB, DH

See Package Configurations: DB= Dual Barb, DH= Dual Hole, SB=Single Barb, ST=Single Tube, FT=Front Side Tube

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 3 ABSOLUTE MAXIMUM RATING Parameter Conditions Min Max Unit Symbol/Notes Supply Voltage TA = 25°C -0.3 3.6 V VDD Storage Temperature -40 125 °C Overpressure TA = 25 °C, both Ports 60 psi Burst Pressure TA = 25 °C, Port 1 psi See Table 1 ESD HBM -4 +4 kV EN 61000-4-2 Solder Temperature 250°C, 5 sec max. Table 1- BURST PRESSURE BY RANGE AND PORT DESIGNATION. Range Port 1 Port 2 Unit 001 10 10 psi 002 20 20 psi 005 50 15 psi 015 120 60 psi 030 120 120 psi ENVIRONMENTAL SPECIFICATIONS Parameter Conditions Mechanical Shock Mil Spec 202F, Method 213B, Condition C, 3 Drops Mechanical Vibration Mil Spec 202F, Method 214A, Condition 1E, 1Hr Each Axis Thermal Shock 100 Cycles over Storage Temperature, 30 minute dwell Life 1 Million FS Cycles MTTF >10Yrs, 70 ºC, 1 Million Pressure Cycles, 120%FS Pressure

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 4 PERFORMANCE SPECIFICATIONS Supply Voltage1 3.0 Vdc Reference Temperature: 25°C (unless otherwise specified) PARAMETERS MIN TYP MAX UNITS NOTES Operating Voltage 1.8 3.6 ADC 24 bits Pressure Accuracy See Table 2 Below %FS 2,5 Total Error Band (TEB) -2.5 2.5 %FS 3 Temperature Accuracy (Reference Temperature) ±1.5 ºC 4,5 Temperature Accuracy ±2.5 ºC 4,5 Supply Current See OSR Table Below mA Compensated Temperature 0 85 ºC Operating Temperature -40 +125 ºC Conversion Time See OSR Table Below mS Weight 3 grams Media Non-Corrosive Dry Gases Compatible with Silicon, Glass, LCP, RTV, Gold, Thermo-Epoxy, Silicone Gel, Aluminum and Epoxy. See “Wetted Material by Port Designation” chart. Notes 1. Proper operation requires an external capacitor placed as shown in Application Circuit. Output is not ratiometric to supply voltage. 2. The maximum deviation from a best fit straight line(BFSL) fitted to the output measured over the pressure range at 25°C. Includes all errors due to pressure non linearity, hysteresis, and non repeatability. 3. The maximum deviation from ideal output with respect to input pressure and temperature over the compensated temperature range. Total error band (TEB) includes all accuracy errors, thermal errors over the compensated temperature range, span and offset calibration tolerances. TEB values are valid only at the calibrated supply voltage. 4. The deviation from a best fit straight line (BFSL) from 25°C. to 85°C. 5. Six coefficients must be read by microcontroller software and are used in a mathematical calculation for converting D1 and D2 into compensated pressure and temperature values. Table 2- TYPICAL ACCURACY SPECIFICATION BY PRESSURE RANGE Range Port 1 Port 2 Unit 015 ±0.25 ±0.25 %FSS 030 ±0.25 ±0.25 %FSS

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 5 OVERSAMPLNG RATIO (OSR) PERFORMANCE CHARACTERISTICS SUPPLY CURRENT CHARACTERISTICS Parameter Symbol Conditions Min. Typ. Max Unit Supply current (1 sample per sec.) IDD OSR 4096 2048 1024 512 256 12.5 6.3 3.2 1.7 0.9 µA Peak supply current during conversion 1.4 mA Standby supply current at 25°C 0.02 0.14 µA ANALOG DIGITAL CONVERTER (ADC) Parameter Symbol Conditions Min. Typ. Max Unit Conversion time tc OSR 4096 2048 1024 512 256 7.40 3.72 1.88 0.95 0.48 8.22 4.13 2.08 1.06 0.54 9.04 4.54 2.28 1.17 0.60 ms INPUT/OUTPUT SPECIFICATIONS DIGITAL INPUTS (CSB, I2C, DIN, SCLK) Parameter Symbol Conditions Min. Typ. Max Unit Serial data clock SCLK SPI protocol 20 MHz Serial data clock SCL I2C protocol 400 kHz Input high voltage VIH Pins CSB 80% VDD 100% VDD V Input low voltage VIL 0% VDD 20% VDD V Input leakage current Ileak25°C Ileak85°C at 25°C 0.15 µA Input capacitance CIN 6 pF PRESSURE OUTPUTS (I2C, DOUT) Parameter Symbol Conditions Min. Typ. Max Unit Output high voltage VOH Isource = 0.6 mA 80% VDD 100% VDD V Output low voltage VOL Isink = 0.6 mA 0% VDD 20% VDD V Load capacitance CLOAD 16 pF

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 6 FUNCTIONAL DESCRIPTION Figure 1: Block diagram of MS5525DSO GENERAL The MS5525DSO consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5525DSO is to convert the uncompensated analog output voltage from the piezo-resistive pressure sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. FACTORY CALIBRATION Every module is individually factory calibrated at two temperatures and three pressures. As a result, six coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 128-bit PROM of each module. These bits, partitioned into six coefficients, C1 through C6, must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. The coefficients C0 and C7 are for factory calibration and CRC. SERIAL INTERFACE The MS5525DSO has built in two types of serial interfaces: SPI and I2C. Pulling the Protocol Select pin PS to low selects the SPI protocol, pulling PS to high activates the I2C bus protocol. Pin PS Mode Pins used High I C SDA, SCL CSB Low SPI SDI, SDO, SCLK, CSB SPI MODE The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data In). In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the command is sent or after the end of the command execution (for example end of conversion). The best noise performance from the module is obtained when the SPI bus is idle and without communication to other devices during the ADC conversion. BLOCK DIAGRAM

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 7 I2C MODE & ADDRESSING The external microcontroller clocks in the data through the input SCL (Serial CLoc k) and SDA (Serial DAta). The sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. So this interface type uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space. In I2C -Mode the complement of the pin CSB (Chip Select) represents the LSB of the I2C address. It is possible to use two sensors with two different addresses on the I2C bus. The pin CSB must be connected to VDD or GND do not leave these pins unconnected. Pin CSB Address (7 bits) High 0x76 Low 0x77 COMMANDS The MS5525DSO has only five basic commands: 1. Reset 2. Read PROM (128 bit of calibration words) 3. D1 conversion 4. D2 conversion 5. Read ADC result (24 bit pressure / temperature) Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands the device will return 24 bit result and after the PROM read 16bit result. The address of the PROM is embedded inside of the PROM read command using the Ad2, Ad1 and Ad0 bits. Command byte hex value Bit number 0 1 2 3 4 5 6 7 Bit name PRM COV - Typ Ad2/ Os2 Ad1/ Os1 Ad0/ Os0 Stop Command Reset 0 0 0 1 1 1 1 0 0x1E Convert D1 (OSR=256) 0 1 0 0 0 0 0 0 0x40 Convert D1 (OSR=512) 0 1 0 0 0 0 1 0 0x42 Convert D1 (OSR=1024) 0 1 0 0 0 1 0 0 0x44 Convert D1 (OSR=2048) 0 1 0 0 0 1 1 0 0x46 Convert D1 (OSR=4096) 0 1 0 0 1 0 0 0 0x48 Convert D2 (OSR=256) 0 1 0 1 0 0 0 0 0x50 Convert D2 (OSR=512) 0 1 0 1 0 0 1 0 0x52 Convert D2 (OSR=1024) 0 1 0 1 0 1 0 0 0x54 Convert D2 (OSR=2048) 0 1 0 1 0 1 1 0 0x56 Convert D2 (OSR=4096) 0 1 0 1 1 0 0 0 0x58 ADC Read 0 0 0 0 0 0 0 0 0x00 PROM Read 1 0 1 0 Ad2 Ad1 Ad0 0 0xA0 to 0xAE Figure 4: Command structure

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 8 Start 5525DSO-pp005GS Example Tmin=-40°C , Tmax=125°C Read Calibration Data from PROM Read Digital Pressure and Temperature Data D1 Digital Pressure Value unsigned int 32 24 0 16777216 5240585 D2 Digital Temperature Value unsigned int 32 24 0 16777216 3869265 Calculate Temperature dT Difference between actual and reference temperature dT = D2 - TRE F = D2 - C5 * 2Q5 signed int 32 25 -16776960 16777216 47953 TEMP Measured temperature TEMP=20°C+dT*TEMPSENS=2000+dT*C6/2Q6 signed int 32 41 -4000 12500 2501 =25.01°C Calculate Temperature Compensated Pressure OFF Offset at actual temperature OFF=OFFT1+TCO * dT=C2*2Q2+(C4*dT)/2Q4 signed int 64 41 5218046194 SENS Sensitivity at actual temperature SENS=SENST1+TCS*dT=C1*2Q1+(C3*dT)/2Q3 signed int 64 41 2415906558 P Temperature Compensated Pressure P=D1*SENS-OFF=(D1*SENS/221-OFF)/215 signed int 32 61 24996 =2.4996psi Figure 1: Flow chart for pressure and temperature reading and software compensation. Variable Coefficient Description Recommended Variable Type Size [1] Value Example/ Typical [Bit] Min Max C1 Pressure Sensitivity, SENST1 unsigned int 16 16 0 65535 36402 C2 Pressure Offset, OFFT1 unsigned int 16 16 0 65535 39473 C3 Temperature Coefficient, Pressure Sensitivity, TCS unsigned int 16 16 0 65535 40393 C4 Temperature Coefficient, Pressure Offset, TCO unsigned int 16 16 0 65535 29523 C5 Reference Temperature, TREF unsigned int 16 16 0 65535 29854 C6 Temperature Coefficient Temperature, TEMPSENS unsigned int 16 16 0 65535 21917 Display Pressure and Temperature Value

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 9 Qx Coefficients Matrix by Pressure Range Part Number Pmin Pmax Q1 Q2 Q3 Q4 Q5 Q6 TRES (°C) PRES (PSI) 5525DSO-pp001GS 0 1 14 16 7 5 7 21 0.01 0.0001 5525DSO-pp001DS -1 1 15 17 7 5 7 21 0.01 0.0001 5525DSO-pp002GS 0 2 14 15 8 6 7 22 0.01 0.0001 5525DSO-pp002DS -2 2 16 18 6 4 7 22 0.01 0.0001 5525DSO-pp005GS 0 5 16 17 6 5 7 21 0.01 0.0001 5525DSO-pp005DS -5 5 17 19 5 3 7 22 0.01 0.0001 5525DSO-pp0015AS 0 15 16 17 6 5 7 22 0.01 0.0001 5525DSO-pp0015GS 0 15 16 17 6 5 7 22 0.01 0.0001 5525DSO-pp0015DS -15 15 17 19 5 3 7 22 0.01 0.0001 5525DSO-pp0030AS 0 30 17 18 5 4 7 22 0.01 0.0001 5525DSO-pp0030GS 0 30 17 18 5 4 7 22 0.01 0.0001 5525DSO-pp0030DS -30 30 18 20 4 1 7 22 0.01 0.0001 MEMORY MAPPING Memory Mapping Address 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

0 Reserved for Manufacturer

1 Coefficient 1 (C1)

2 Coefficient 2 (C2)

3 Coefficient 3 (C3)

4 Coefficient 4 (C4)

5 Coefficient 5 (C5)

6 Coefficient 6 (C6)

7 CRC

Figure 2: Memory PROM Mapping Notes [1] Maximal size of intermediate result during evaluation of variable.

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 10 SPI INTERFACE RESET SEQUENCE The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device ROM from an unknown condition

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 11 CONVERSION SEQUENCE The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. The chip select can be disabled during this time to communicate with other devices. After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and the final result will be wrong. Conversion sequence sent during the already started conversion process will yield incorrect result as well. PROM READ SEQUENCE The read command for PROM shall be executed once after reset by the user to read the content of the calibration PROM and to calculate the calibration coefficients. There are in total 8 addresses resulting in a total memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and address 7 contains the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is clocked with the MSB first.

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 14 PINOUT, MARKING, AND PRESSURE TYPE CONFIGURATION Pressure Type Pmin Pmax Description Absolute 0psiA +Prange Output is proportional to the difference between 0psiA (Pmin) and pressure applied to Port 1. Differential/ Bidirectional -Prange +Prange Output is proportional to the difference between Port 1 and Port 2. Output swings positive when Port 2> Port 1. Output is 50% of total counts when Port 1=Port 2. Gauge 0psiG +Prange Output is proportional to the difference between 0psiG (Pmin) and Port 1. Output swings positive when Port 2> Port 1. Pin Name Pin Function I2C SPI SGND 1,3 Sensor Ground SOUT- 2,4 Sensor Outputs, Negative SDO 5 Serial Data Output SDA/SDI 6 I2C Data Input and Output SPI Serial Data Input SCL/SCLK 7 I2C Clock SPI Clock CSB 8 Defines I2C Address Chip Select (Active Low) GND 9 Ground PS 10 Protocol Select PS = (VDD) PS = (GND) I2C Protocol Selected SPI Protocol Selected CSB= (VDD) I2C Address =1110110X (0xEC, 0xED) CSB= (GND) I2C Address=1110111X (0xEE, 0xEF) Supply+ 11,13 Positive Supply Voltage SOUT+ 12,14 Sensor Outputs, Positive WETTED MATERIAL BY PORT DESIGNATION Material Style Port LCP Thermo-Epoxy Resin Epoxy RTV Glass Silicon Silicone Gel All Port 1 X X X X Port 2 X X X X X X "X" Indicates Wetted Materials

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 15 RECOMMEND PCB LAYOUT

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 16 APPLICATION CIRCUIT The MS5525DSO is a circuit that can be used in conjunction with a microcontroller. It is designed for low- voltage systems with a supply voltage of 3 V. Figure 17: Typical application circuit with SPI / I2C protocol communication Note 1. Place 100nF capacitor between Supply and GND to within 2 cm of sensor.

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 17 DIMENSIONS MS5525DSO-DBxxxyS

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 18 MS5525DSO-STxxxyS

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 19 MS5525DSO-SBxxxyS

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 20 MS5525DSO-DHxxxyS

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 21 MS5525DSO-FTxxxyS

(Digital Small Outline) SENSOR SOLUTIONS ///MS5525DSO 09/2016 Page 22

ORDERING INFORMATION

Model - Package Style Pressure Range Pressure Type Pin Style MS5525DSO DB = Dual Barb SB = Single Barb ST = Single Tube DH = Dual Hole FT = Front Tube 001 002 005 015 030 A = Absolute D = Differential G = Gauge S = Gull Wing NORTH AMERICA EUROPE ASIA Measurement Specialties, Inc., a TE Connectivity company

45738 Northport Loop West

Fremont, CA 94538 Tel: +1 800 767 1888 Fax: +1 510 498 1578 customercare.frmt@te.com MEAS Switzerland Sarl, a TE Connectivity company Ch. Chapons-des-Prés 11 CH-2022 Bevaix Tel: +41 32 847 9550 Fax: +41 32 847 9569 customercare.bevx@te.com Measurement Specialties (China) Ltd., a TE Connectivity company No. 26 Langshan Road Shenzhen High-Tech Park (North) Nanshan District, Shenzhen, 518057 China Tel: +86 755 3330 5088 Fax: +86 755 3330 5099 customercare.shzn@te.com TE.com/sensorsolutions Measurement Specialties, Inc., a TE Connectivity company. Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s ob ligations shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. © 2015 TE Connectivity Ltd. family of companies All Rights Reserved.