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© Coilcraft, Inc. 2012

1102 Silver Lake Road

Cary, IL 60013 Phone 800-981-0363 Fax 847-639-1508 Email cps@coilcraft.com www.coilcraft-cps.com This product may not be used in medicalor high risk applicationswithoutprior Coilcraftapproval. Specificationssubjectto change withoutnotice. Please check our web site for latest information.

1812 CHIP INDUCTORS

Inductance2 L test Percent Q Q test SRF min4 DCR max5 Imax Part number1 (µH) freq (MHz) tolerance min3 freq (MHz) (MHz) (Ohms) (mA) MS450RAB123JSZ 12 2.5 5 22 0.79 55 2.0 280 MS450RAB153JSZ 15 2.5 5 22 0.79 45 2.5 260 MS450RAB183JSZ 18 2.5 5 24 0.79 37 2.8 240 MS450RAB223JSZ 22 2.5 5 20 0.79 32 3.2 210 MS450RAB273JSZ 27 2.5 5 24 0.79 27 3.6 200 MS450RAB333JSZ 33 2.5 5 22 0.79 23 4.0 190 MS450RAB393JSZ 39 2.5 5 20 0.79 19 4.5 185 MS450RAB473JSZ 47 2.5 5 24 0.79 16 5.0 180 MS450RAB563JSZ 56 2.5 5 22 0.79 13 5.5 170 MS450RAB683JSZ 68 2.5 5 24 0.79 10 6.0 150 MS450RAB823JSZ 82 2.5 5 24 0.79 9.0 7.0 135 MS450RAB104JSZ 100 2.5 5 24 0.79 8.5 8.0 135 MS450RAB124JSZ 120 0.79 5 25 0.79 8.5 11.5 110 MS450RAB154JSZ 150 0.79 5 23 0.79 8.5 13.0 100 MS450RAB184JSZ 180 0.79 5 24 0.79 8.0 14.2 85 MS450RAB224JSZ 220 0.79 5 23 0.79 6.0 16.2 80 MS450RAB274JSZ 270 0.79 5 23 0.79 5.0 20.5 75 MS450RAB334JSZ 330 0.79 5 24 0.79 4.5 22.5 70 MS450RAB394JSZ 390 0.79 5 14 0.25 3.5 24.5 65 MS450RAB474JSZ 470 0.79 5 15 0.25 3.0 26.5 65 MS450RAB564JSZ 560 0.79 5 13 0.25 2.0 28.5 65 MS450RAB684JSZ 680 0.79 5 13 0.25 1.9 38.5 60 MS450RAB824JSZ 820 0.79 5 13 0.25 1.6 41.0 50 MS450RAB105JSZ 1000 0.79 5 15 0.25 1.5 44.0 50 1. When ordering, please specify testing code: MS450RAB105JSZ Testing: Z = COTS H = Screening per Coilcraft CP-SA-10001 N = Screening per Coilcraft CP-SA-10003 2. Inductance at 2.5 MHz measured using an Agilent/HP 4286A and a Coilcraft SMD-A fixture with Coilcraft-provided correlation pieces. Inductance at 0.79 MHz measured using an Agilent/HP 4192A and Coilcraft SMD-B test fixture. 3. Q read at test frequency directly on an Agilent/HP 4192A LF imped- ance analyzer and a Coilcraft SMD-B test fixture. 4. SRF measured using an Agilent/HP 8753D network analyzer and a Coilcraft SMD-D test fixture. 5. DCR measured on a Cambridge Technology micro-ohmmeter. 6. Electrical specifications at 25°C. Refer to Doc 362 “Soldering Surface Mount Components” before soldering. Core material Ferrite Terminations Tin-lead (63/37) over silver-platinum-glass frit Ambient temperature –55°C to +125°C with Imax current, +125°C to +155°C with derated current Storage temperature Component: –55°C to +155°C. Tape and reel packaging: –55°C to +80°C Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Temperature Coefficient of Inductance (TCL) +200 to +700 ppm/°C Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity) Enhanced crush-resistant packaging 600 per 7″ reel Plastic tape: 12 mm wide, 0.3 mm thick, 8 mm pocket spacing, 3.7 mm pocket depth This robust version of Coilcraft’s standard 1812LS series features high temperature materials that allow operation in ambient temperatures up to 155°C. The leach-resistant base metalization with tin-lead (Sn-Pb) terminations ensures the best possible board adhesion. High-Reliability Chip Inductors MS450RAB Document MS106-2 Revised 10/11/11

MS450RAB Series (1812) © Coilcraft, Inc. 2012 Cary, IL 60013 Phone 800-981-0363 Fax 847-639-1508 Email cps@coilcraft.com www.coilcraft-cps.com This product may not be used in medicalor high risk applicationswithoutprior Coilcraftapproval. Specificationssubjectto change withoutnotice. Please check our web site for latest information. Document MS106-2 Revised 10/11/11 A B C D max max max ref E F G H I J 4,95 3,81 3,43 1,78 2,54 0,64 3,25 3,05 1,14 3,00 mm Current Derating -40-55 -20 02 04 06 08 0 100 160140120 Ambient temperature (°C) Pe rcent of rated rmsI 120 110 100 25°C I I J H A B overall F G E terminal F C D Terminal wraparound: approx 0.015/0,38 both ends Recommended Land Pattern Pick and place material Suggested Land Pattern Note: Dimensions are before solder application. For maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C. Typical Q vs Frequency Typical L vs Frequency 12 µH 22 µH47 µH 100 µH 220 µH470 µH 1000 µH Q F actor 0.1 1 10010 Frequency (MHz) 12 µH 22 µH 47 µH 100 µH 220 µH 470 µH 1000 µH 100 1000 10000 0.1 1 10010 Inductance (µH) Frequency (MHz)