MS249 MULTICOMP | Alldatasheet
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Page <1> 05/06/12 V1.1 www.element14.com www.farnell.com www.newark.com Raw Materials: Grosvenor pure alloy bar solder is manufactured exclusively from high grade materials We are aware that re-cycled material can be used, but in our opinion reclaimed scrap metal leaves too many impurities to satisf y the quality demands of today’s electronics industry Specifications: The most common purchasing specification used in the UK is BS 219 (1977 / 1984) We illustrate below a typical independent analysis of Grosvenor Solder when compared with BS 219 The comparison clearly shows that grosvenor solder contains a far lower level of impurities than allowed in the British or othe r national standards (We believe most national standards have to give excessively high impurity levels to allow for the re-cycling of scrap metal) BS 219. 63 / 37 AP Sn% Sb% Pb% Cu% Zn% Fe% As% Ag% Bi% In% Typical Batch Analysis : Grosvenor Pure Alloy 63 / 37 (BS 219) Sn Sb Pb Cu Zn Fe As Ag Bi In Sn Sb Pb Cu Zn Fe As Ag Bi In Typical Batch Analysis : High Purity Virgin Lead Typical Batch Analysis : High Purity Virgin Tin Sn Sb Pb Cu Zn Fe As Ag Bi In
Page <2> 05/06/12 V1.1 www.element14.com www.farnell.com www.newark.com Analytical Service: A regular check on bath composition and impurity levels is advisable A full analytical report enables problems to be solved quickly which means a more constant through-put of flow solder production A 3 month check is normally found sufficient, but this depends on workload Dross Service: Agitation of solder by wave soldering or dipping will cause oxidisation (know as dross) Dross must be regularly removed and placed carefully into the free of charge containers supplied on request, for return to gros venor Specification Table Impurity Levels (Maximum) as Specified KP and AP (Maximum) Typical BS219 QQ-S-571E BS219 QQ-S-571E AP Sn63 AP / KP Sn63 Sb 0.2% Cd 0.005% 0.2% to 0.5% 0.001% Sb <0.02% Cd <0.001% <0.2 to 0.5% <0.001% BS 219 Tin Lead Melting Range - AP 63 to 64% REM 183 to 185°C - KP 59 to 60% 183 to 188°C QQ-S-571E SN 62.5 to 63.5% 183°C All soldering operations will introduce contaminates to the solder bath Unfortunately different materials and operations will introduce differing levels of contaminants Listed are typical contaminants found Aluminium* : As little as 0.005% may increase dross rate without affecting joint formation. 0.001% may result in a sluggish or gritty solder Antimony : Certain of the specification require the intentional additional of antinomy. Ostensibly this to retard the transformation of tin into its grey state, sometimes known as ‘tin pest’, however this argument no longer appears to have validity in a eutectic or near eutectic alloy Technical Information :
Page <3> 05/06/12 V1.1 www.element14.com www.farnell.com www.newark.com Arsenic : 0.03% can cause dewetting but arsenic is not usually a contaminant in electronic applications Bismuth : 0.5% has been observed to cause discoloration and oxidation of solder, but appreciable grade alloys or finishes Cadmium* : At levels of 0.002% joint formulation will be noticeably affected. At 0.005% there will be a high incidence of bridging and icicling, together with a deterioration in joint strength Copper : Generally, at levels of 0.25% copper or even less, joint formulation will deteriorate Gold : At levels of 0.1% and quite often even less, the solder becomes sluggish and dull joints are formed Iron : 0.02% of iron can make joint formulation gritty Sulphur : As little as 0.001% may inhibit wetting and may produce grittiness Zinc : The presence of zinc can cause dulling and increase bridging and icicling 0.005% can cause lack of adhesion and grittiness Notes: ** When copper and gold in combination add to 0.2% joint formulation will usually have deteriorated * The effects of aluminium, cadmium and zinc are cumulative. If more than one element is present the following lower maxima are suggested 0.005%, 0.002% and 0.001% Solder Alloys: Solder used in electronic process contains principally tin and lead. Special solders may contain silver, antimony or copper. A p otential health risk from solder is associated with its lead content, the other components are not usually regarded as hazardous in this context. The metal can give rise to lead fumes at temperatures above 500°C, but this level is rarely met with in electronic sol dering. Oxide can be transferred to the hands while using these products and we recommended that eating, drinking and smoking should no t be permitted at work stations. Hands should be washed with soap and warm water before eating. Oxide evolved as dross on a wave soldering machine should be handle with care to avoid raising dust. Dross should be stored in a metal container with a sealed l id and returned to grosvenor for disposal. Bar solder should be kept dry to avoid the risk of violent splashing that can occur if wet solder is added to a hot molten solder bath. Grosvenor recommend that gloves should be used for handling wire and bar and suitable eye protection should be worn when adding solder to the machine, bath and when hand soldering Health and Safety at Work Act 1974: Product : Bar solder, ingot, solid wire, tinmans, blowpipe and pellets Nature of hazards : Contains lead-absorption can arise from the oxide which forms on the surface of molten alloys Physical data : Lustrous metal Fire and explosion data : Flash point-none Non-flammable Store in a dry place Health hazard : Molten metals can cause burns Emergency first aid : Treat all burns Get medical help Spillage : Allow to cool, collect and return to supplier Reactivity : Do not place wet or damp metal into a molten bath-could cause explosion Special protection info : Personal hygiene is important, wash hands after contact and before meals Special information : Further details are given in the lead code of practice for health precautions, issued by the department o f employment Possible systemic and long term effects : Maximum exposure limit : 0.15 mg per cubic metre (T.W.A 8 hours) : Antimony : Moderate toxicity, a severe irritant Possible systemic and long term effects
Page <4> 05/06/12 V1.1 www.element14.com www.farnell.com www.newark.com Important Notice : This data sheet and its contents (the "Information") belong to the members of the Premier Farnell group of companies (the "Group") or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group's liability for death or personal injury resulting from its negligence. Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012. : Cadmium : High toxicity, irritant to nasal passages, carcinogenic and possible systemic effects : Maximum exposure limit : 0.05 mg per cubic metre (T.W.A 8 hours) : Copper : High toxicity, possible systemic and long term effects : Maximum exposure limit : 1 mg per cubic metre (T.W.A 8 hours) Part Number Table Description Part Number Solder Bar, Extrusol, 1kg MS249