MS2213 MICROSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- • REFRACTORY/GOLD METALLIZATION
- • EMITTER SITE BALLASTED
- • 15:1 VSWR CAPABILITY
- • LOW RF THERMAL RESISTANCE
- • INPUT/OUTPUT MATCHING
- • OVERLAY GEOMETRY
- • METAL/CERAMIC HERMETIC PACKAGE
- • P OUT = 30 W MIN. WITH 7.8 dB Gain RF & MICROWAVE TRANSISTORS SPECIALITY AVIONICS/JTIDS APPLICATIONS
140 COMMERCE DRIVE
MONTGOMERYVILLE, PA 18936-1013 PHONE: (215) 631-9840 FAX: (215) 631-9855
MSC0920.PDF 9-23-98 MS2213 ELECTRICAL SPECIFICATIONS (ELECTRICAL SPECIFICATIONS ( Tcase = 25Tcase = 25 °°C)C) STATICSTATIC Symbol Test Conditions Value Min. Typ. Max. Unit BV CBO IC = 10 mA 55 ---- ---- V BV EBO IE = 1 mA 3.5 ---- ---- V BV CER IC = 20 mA R BE = 10 Ω 55 ---- ---- V ICES V CE = 35 V ---- ---- 5.0 mA DYNAMICDYNAMIC Symbol Test Conditions Value Min. Typ. Max. Unit P OUT f = 960 - 1215 MHz P IN = 5.0 W V C C = +35 V 30 36 ---- W VVC f = 960 - 1215 MHz P IN = 5.0 W V C C = +35 V 40 45 ---- % G P f = 960 - 1215 MHz P IN = 5.0 W V C C = +35 V 7.8 8.6 ---- dB Duty Cycle: Burst 49.2%, Overall 20.8%
MSC0920.PDF 9-23-98 MS2213 PACKAGE MECHANICAL DATA