MS2208 MICROSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- • HERMETIC METAL/CERAMIC PACKAGE
- • LOW THERMAL RESISTANCE
- • 10:1 LOAD VSWR CAPABILITY
- • BALLASTED OVERLAY GEOMETRY
- • COMMON EMITTER CONFIGURATION RF & MICROWAVE TRANSISTORS AVIONICS APPLICATION
140 COMMERCE DRIVE
MONTGOMERYVILLE, PA 18936-1013 PHONE: (215) 631-9840 FAX: (215) 631-9855
MSC0926.PDF 10-09-98 MS2208 ELECTRICAL SPECIFICATIONS (ELECTRICAL SPECIFICATIONS ( Tcase = 25Tcase = 25 °°C)C) STATICSTATIC Symbol Test Conditions Value Min. Typ. Max. Unit Bvebo IE = 30 mA IC =0 mA 3.0 --- --- V Bvcbo IC = 50 mA IC =0 mA 70 --- --- V Bvces IC = 50 mA V BE =0 V 70 --- --- V Ices V BE = 50 mA V CE =50 V --- --- 40 mA HFE V CE = 5.0 V IC =1 A 10 --- 200 B DYNAMICDYNAMIC Symbol Test Conditions Value Min. Typ. Max. Unit P out P in = 70W f=1090 MHz V CC =50V 500 --- --- W ηηc P out f=1090 MHz V CC =50V 40 --- --- % G P P out f=1090 MHz V CC =50V 8.5 --- --- dB Load Mismatch P out =500W Peak f=1090 MHz, V cc =50V, VSWR=10:1, 10 µµsec, 1% Duty, VSWR=5:1, 32 µµsec, 2% Duty Conditions Pulse width=32 µµsec, Duty Cycle= 2% IMPEDANCE DATAIMPEDANCE DATA FREQ Z IN ( Ω)Ω) Z CL ( Ω)Ω) 1030 MHz 4.35+ j 6.97 1.38- j 4.08 1090 MHz 4.38+ j 2.75 0.874- j 3.55 1120 MHz 4.69+ j 2.95 1.3- j 4.97 P IN =70W V CC =50V
MSC0926.PDF 10-09-98 MS2208 PACKAGE MECHANICAL DATA