MS205A-001 MURATA | Alldatasheet

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Document No. ︓JEMR33-**** (subject to change without notice) 1/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 1. Scope This document is applied to a magnetic s ensor operating to ON/OFF when the sensor detects the m agnetic field. 2. Part number 2-1 Part description Magnetic Sensor 2-2 Murata part number MRMS205A-001 3. Dimensions and schematics 3-1 Dimensions 0.4 1.9 2.92.9±0.2 1.9±0.2 +0.1-0.05 +0.1-0.05 0.4 1.1 0.16 0.8 0~0.1 +0.1 -0.05 ±0.1 ±0.11.1 0.8 0.16 (Unit :mm) ①:Vcc ②:GND ③:OUT 3-1-2 Marking example ↓ ↓ ↓ Ⅱ Manufactured year...The last digit of the year ⅠⅡⅢ Ⅲ Manufactured month.. Jan to Sep : 1 to 9 O c t t o D e c : X , Y , Z 「 」91 ① ③

Document No. ︓JEMR33-**** (subject to change without notice) 2/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 3-1-3 Reference mount pad (Unit :mm) NOTE1) Please evaluate your soldiring paset condition and reflow condition with our product being mounted to your product. NOTE2) Please make sure the sensing direction of the sens or (see the item 3-2) and your magnetic field direction to the sensor. 3-2 Block wiring diagram 3-3 Magnetic electric c onversion characteristic ON/OFF switched depending on the intensity of the magnetic field. (Negative logic) VOH VOL VOUT Hon Hoff Hon Hoff S pole N pole Sensing direction (N or S)

Document No. ︓JEMR33-**** (subject to change without notice) 3/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 3-4 Timing diagram The sensor has intermitt ence operating circuit. NOTE1) AMR element is driven by the interm ittent swich curcuit shown in item 3-2. The timing of Vout c hange is subject to the period of Icc on. NOTE2) When the change rate Hon and Hoff exceed the speed of intermi ttent swich, sensor may couse non operation or miss operation. Ref. (Typ.) Vcc = 5.0V ①:8mA ②:8μA ③:4μA ④:50mS ⑤:25μS

Document No. ︓JEMR33-**** (subject to change without notice) 4/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 3-5 Electric characteristics/ absolute maximum rating (Ta=+25 oC±3oC) Parameter Symbol Conditions Min. Typ. Max. Unit 1 Supply voltage Vcc - 3.0 5.0 5.5 V 2 Absolute max. supply voltage - - - - 6.0 V 3 Current consumption IAVE Vcc=5.0V No Load Resist Average Current - 8 15 uA

4 Operating magnetic field

Hon Vcc=5.0V No Load Resist - - 2.5 mT Hoff Vcc=5.0V No Load Resist 0.5 - - 5 Hi level output V0H Vcc=5.0V No Load Resist 4.5 - - V 6 Lo level output VOL Vcc=5.0V No Load Resist - - 0.5 V 7 Operating temp. range - - -40 - +85 oC 8 Storage temp. range - - -40 - +125 oC NOTE1) Each specification is defined by testing above items individually. NOTE2) When shifting the sensor output from H to L, please make sure the magnetic field applied to the sensor becomes higher than the above operating magnetic field (Hon) through your designing. NOTE3) When shifting the sensor output from L to H, please make sure the magnetic field applied to the sensor becomes lower than the above operating magnetic field (Hoff) through your designing. NOTE4) Operating magnetic field is specific to Vcc=5.0V. Operat ing magnetic field can possibly change when applying the supply voltage other than 5.0V. Please pay attention in a design to an operating magnetic field especially when you consider the supply voltage other than 5.0V. Reference) Output current- output voltage relationship

Document No. ︓JEMR33-**** (subject to change without notice) 5/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 4. Packing specifications 4-1 Packing information Form of packing Reel dimension Pcs per reel Tape & reel φ180 3000pcs 4-2 Taping specifications 4-2-1 Taping dimensions U n i t : m m Parameter Symbol Size/ Angle Parameter Symbol Size/ Angle Pocket Length A 3.35±0.1 Dist. Between center lines L direction G 2.0±0.05 Width B 3.2±0.1 W direction D 3.5±0.05 Depth K 0 1.4±0.1 Cover tape Width W 5.5 +0.3-0 Pitch F 4.0±0.1 Carrier tape Width C 8.0±0.1 Feed hole Pitch H 4.0±0.1 Depth K 1 1.5±0.1 Position E 1.75±0.1 Device Tilt θ 30°MAX Overall thickness K 1.55±0.1

Document No. ︓JEMR33-**** (subject to change without notice) 6/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 4-2-2 Reel dimensions...EIAJ PRV08B compliant Unit: mm 4-2-3 Start/End of taping 4-2-4 Other notes Continuously missing devic e shall not exceed 2 pcs. Peeling strength of the co ver tape: 0.1 to 0.7N. Item Symbol Dim/Angle Flange Diameter A φ178±2 Dis. between flanges W 9±0.5 Hub Diameter B φ60±1 Hub slit position θ1 90° Spindle hole diam. C φ13±0.5 Key slit position θ2 120° Marking Labeled on one side of flange W C B A Reel label A (example) Reel label B (example) Trailer 160mm or more Product containing part Leader Product containing part Empty part: 100mm or more Cover tape Leader: 400mm or more ROHS-Y<※> ROHS-Y<※>

Document No. ︓JEMR33-**** (subject to change without notice) 7/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 4-3 Outer packing specifications 1 to 2 reels: Packed in 2 reel box 3 to 5 reels: Packed in 5 reel box 6 to 10 reels: Packed in 10 reel box *When the box is not filled with reels, antistatic buffer material will be used to avoid product from moving inside box. *Unit: mm, Tolerance: +/- 5mm Material Reel packing box: Cardboard <1 reel or 2 reels> <3 reels and more> 45(2 reel box) 93(5 reel box) 143(10 reel box ) Reel Label Reel box 186 186 186 186

Document No. ︓JEMR33-**** (subject to change without notice) 8/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 5. Mounting condition 5-1 Reflow condition ・Below is the maximum reflow condition for the product mounting. ・The temperature mentioned in below table an d figure is package surface temperature. ・The absolute maximum package peak temperature is 260℃ and time within the temperature of 260℃ must not exceed 10 se conds (Requirement). Profile Conditions Pre-heating Temperature Min. Temperature Max. Time from Temperature Min. to Max. 150 oC 180oC 60-120s Heating Liquidus temperature Time maintained over Liquidus temperature Peak Temperature 230 oC 30s 260 oC/10s max. Cycle of reflow 3 times max.

Document No. ︓JEMR33-**** (subject to change without notice) 9/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 6. Reliability test No. Reliability test Test conditions Judgment criteria 1 High temp. storage +125 oC 500h No-load It shall be tested after being kept in a room over 2hours and Vcc=5.0V. ・Output voltage Hi:4.5V or above Lo:0.5V or less ・Using current 15 μA or less 2 High temp. load +105 oC 500h Load voltage 5.5V 3 Low temp. storage -40 oC 500h No-load High temp, high humidity load +85oC 85%RH 500h Load voltage 5.5V

5 Thermal shock

-55 oC /30 min ⇔ +125 oC /30min (vapor phase) 500 cycle, no-load

6 Vibration

Apply vibration [Max amplitude: 1.5mm, frequency: 10 to 55Hz, 1 cycle minute, 3 directions, 2h in each direction (total 6h )]

7 Shock test

Unpacked condition, X, Y, Z direction, 1470m/s2, 5 times/each

8 Drop test

100g dummy load, Height: 150cm, on the concrete, 6 sides, 10 times/each Solder heat resistance Pre treatment: +85oC, 85%RH, 168h Reflow condition: Max. 260oC & 230oC, 30 sec, times of reflow: 3 Electrostatic resistance Machine Model Condition: 200pF, Resistance: 0Ω, +/-200V Human Body Model Condition: 100pF, Resistance: 1.5kΩ, +/-2kV

11 Solderability

Solder temp.: +230oC, Time: 3 sec immersion 90% and more terminal surface covered with solder Electrode sticking tendency 5N(510gf), 4 directions, 10 sec No external abnormality found.

13 Bending cycle

Glass epoxy PCB, t=1.6, Speed: 5mm/min, 90mm span, bending range ±1mm, 1500 cycle No terminal fracture, loosening found.

14 Bending limit

Glass epoxy PCB, t=1.6, 90mm span, bending range ±7mm.

Document No. ︓JEMR33-**** (subject to change without notice) 10/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 7. Caution 7-1 Limitation of applications Please avoid using this product for the applications listed below which require especially high reliability in order to prevent defects that might directly cause damage to the third party’s life, body, or property. When this product is used for the applic ations listed below, we shall not be liable for any claims on the product. ① Aircraft equipment ② Aerospace equipment ③ Undersea equipment ④ Generating plant equipment ⑤ Medical equipment ⑥ Transportation equipment (vehicles, trains, ships, etc.) ⑦ Traffic signal equipment ⑧ Disaster prevention/ crime prevention equipment ⑨ Data processing equipment ⑩ Application of similar complexity and/or reli ability requirements to the applications listed above. 7-2 Fail-safe Be sure to provide appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 8. Caution for use 8-1 Handling ・ This product may be degraded by electrostatic di scharge. It is necessary to take anti-static precautions when handling. 8-2 Design ・ Please carefully evaluate this product for the magneto-variation of the magnet used along with this product, otherwise this product may result in the miss-operation or the non-operation. ・Sensor miss-operation or non-operation may occur due to the influence of the magnetic noise from surrounding devices such as motor.Please make sure there is no influence of the magneti noise in designing process. ・Please be careful about a magnetic body (Iron, Nickel, etc.) and a magnetic noise immunity that may affect the magnetism of a magnet. ・Please do not supply inverse voltage or excess voltage to this product. If applied, this product may be damaged and electrically destroyed. ・Please design your product not to be affected by stress of the resin due to heat shrink.

Document No. ︓JEMR33-**** (subject to change without notice) 11/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 ・Sensor output (Vout) is not st able at power on to the sensor . After power on, it needs about 4 times of Tc showed on item 3-4 to make it stable. ・Please avoid plugging/unplugging of connector cable while the power is on. Power OFF → ON → B≧Hon[mT] B<Hoff[mT] ①When Magnetic flux density B is bigger than Hon in the initial state. Output ’L’ ②When Magnetic flux density B is smaller than Hoff in the initial state. Output ’L’ ’H’ ’L’ Tc:Internal transmission cycle ’Indeterminate’ ’Indeterminate’ Tc[mS] Tc[mS] ↓Cause of misjudgment ・ It is effective to place a bypass capacit or near AMR sensor for power supply noise suppression. * 0.1 μF is the recommended value and does not guarantee operation. Please select the suitable capacity depending on the usage environment. In addition, when the sensor is used under high noise level, Zener diode is recomm ended in parallel with a bypass capacitor. Gnd Vcc Out 0.1μF

Document No. ︓JEMR33-**** (subject to change without notice) 12/12 M u r a t a M a n u f a c t u r i n g C o . , L T D . V e r . 1 0 . 1 8-3 Storage condition ・Recommended storage conditi ons are listed below. Temperature : +5 to +30 oC Humidity : 70%(RH)% and lower *Desiccator storage or storage in N 2 atmosphere is recommended. ・Allowable storage time of the product is one year from the date of delivery. Please take account of the storage conditions listed above. Please also use the product as soon as possible after opening the product packing to avoid the deterioration of solderability. ・Please avoid the water, c hemical solvent, or oil. ・Please avoid the corrosive gas (Cl 2 H 2S, NH 3 NO 2, NO 3 etc.) ・Please avoid the strong vibration or shock. 8-4 Mounting ・Please mount this product under standard reflow condition. Otherwise this product may be damaged. ・Hand soldering is not allowed for this product. ・Please do not apply excessive load to the terminals. Also, please do not bend the terminals. ・Please do not apply excessive bending stress to the product by bending the PCB or by similar handling as it may change the sensor sensitivity. ・Please make sure the mounting state of t he sensor after mounting it. Depend on your application, mounting error may ca use the sensor miss operation. 9. Note ・Make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. ・Not to use our product deviating from the agreed s pecification.