MS1076 MICROSEMI | Alldatasheet

Document overview

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Technical content

Features

  • 30 MHz
  • 28 VOLTS
  • GOLD METALLIZATION
  • POUT = 220 W PEP
  • GP = 12 dB GAIN MINIMUM
  • COMMON EMITTER CONFIGURATION RF & MICROWAVE TRANSISTORS HF SSB APPLICATIONS

Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. ELECTRICAL SPECIFICATIONS (Tcase = 25 °C) STATIC Symbol Test Conditions Value Min. T yp. Max. Unit BVCES I C = 100 mA 70 --- --- V BVCEO I C = 200 mA 35 --- --- V BVEBO I E = 20 mA 4.0 --- --- V ICEO V CE = 30 V --- --- 5 mA ICES V CE = 35 V --- --- 5 mA HFE V CE = 5 V, I C = 7 A 15 --- 60 --- DYNAMIC Symbol Test Conditions Value Min. T yp. Max. Unit POUT f = 30 MHz V CE = 28 V ICQ = 750 mA 220 --- --- WPEP GP f = 30 MHz VCE = 28 V ICQ = 750 mA 12 --- --- dB ηC f = 30 MHz VCE = 28 V ICQ = 750 mA 40 --- --- % IMD f = 30 MHz VCE = 28 V ICQ = 750 mA --- --- -30 dBc COB f = 1 MHz VCB = 28 V --- 450 --- pf Conditions f1 = 30.000 MHz f2 = 30.001 MHz HFE BINNING (marked on lid with appropriate letter): A = 15-19 D = 27-32 G = 45-50 B = 19-22.5 E = 32-38 H = 50-55 C = 22.5-27 F = 38-45 I = 55-60 IMPEDANCE DATA FREQ ZIN ZCL 30 MHz 1.2 + j0.41 1.25 + j1.92

Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. TYPICAL PERFORMANCE Pout vs Pin 100 125 150 175 200 225 250 275 0123456789 1 0 1 1 1 2 1 3 1 4 1 5 1 6 Pin(W) Pout(W) Gain vs Pout 11.00 11.50 12.00 12.50 13.00 13.50 14.00 14.50 15.00 15.50 0 20 40 60 80 100 120 140 160 180 200 220 240 260 Pout(W) Gain(dB)

Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. TEST CIRCUIT

Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. BIAS CIRCUIT

Microsemi reserves the right to change, without notice, the specifications and information contained herein. Visit our web site at www.microsemi.com or contact our factory direct. PACKAGE MECHANICAL DATA