MRFG35003N6AT1 FREESCALE | Alldatasheet

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Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level

  1. For reliable operation, the operating channel temperature should not exceed 150°C.

Select Documentation/Application Notes - AN1955.

3.5 GHz, 3 W, 6 V

© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.

Table 5. Electrical Characteristics (TA = 25°C unless otherwise noted) Single-Carrier W-CDMA, 3.84 MHz Channel Bandwidth Carrier. ACPR measured in 3.84 MHz Channel Bandwidth @ ±5 MHz Offset. PAR = 8.5 dB @ 0.01% Probability on CCDF.

Figure 1. MRFG35003N6A Test Circuit Schematic Table 6. MRFG35003N6A Test Circuit Component Designations and Values

Figure 2. MRFG35003N6A Test Circuit Component Layout

Table 7. Common Source S-Parameters (VDD = 6 Vdc, IDQ = 180 mA, TA = 25°C, 50 Ohm System)

Table 7. Common Source S-Parameters (VDD = 6 Vdc, IDQ = 180 mA, TA = 25°C, 50 Ohm System) (continued)

0.115 2.92 0.020 0.51 0.115 2.92 mm inches 0.095 2.41 0.146 3.71 SOLDER FOOTPRINT CASE 466-03 ISSUE D NOTES: 1. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1984. 2. CONTROLLING DIMENSION: INCH 3. RESIN BLEED/FLASH ALLOWABLE IN ZONE V, W, AND X. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.255 0.265 6.48 6.73 B 0.225 0.235 5.72 5.97 C 0.065 0.072 1.65 1.83 D 0.130 0.150 3.30 3.81 E 0.021 0.026 0.53 0.66 F 0.026 0.044 0.66 1.12 G 0.050 0.070 1.27 1.78 H 0.045 0.063 1.14 1.60 K 0.273 0.285 6.93 7.24 L 0.245 0.255 6.22 6.48 N 0.230 0.240 5.84 6.10 P 0.000 0.008 0.00 0.20 Q 0.055 0.063 1.40 1.60 R 0.200 0.210 5.08 5.33 S 0.006 0.012 0.15 0.31 U 0.006 0.012 0.15 0.31 ZONE V 0.000 0.021 0.00 0.53 ZONE W 0.000 0.010 0.00 0.25 ZONE X 0.000 0.010 0.00 0.25 STYLE 1: PIN 1. DRAIN 2. GATE 3. SOURCE 4. SOURCE J 0.160 0.180 4.06 4.57 ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ A B D F LR K N ZONE V ZONE W ZONE XG S H U /C009510 DRAFT P C E 0.35 (0.89) X 45 5/C0034 YY Q VIEW Y-Y /C0095/C0095 PLD-1.5 PLASTIC

Refer to the following documents to aid your design process. Application Notes

  • AN1955: Thermal Measurement Methodology of RF Power Amplifiers

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description

0 July 2007 • Initial Release of Data Sheet

1 Nov. 2008 • Removed ”Operating Case Temperature Range” from Maximum Ratings table so that the maximum channel temperature rating is the limiting thermal design criteria and not the case temperature range, p. 1 2 June 2009 • Modified data sheet to reflect MSL rating change from 1 to 3 as a result of the standardization of packing process as described in Product and Process Change Notification number, PCN13516, p. 1

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