MRFE6VS25N FREESCALE | Alldatasheet
Document overview
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- PDF pages: 24
Technical content
Features
- Wide Operating Frequency Range
- Extremely Rugged
- Unmatched, Capable of Very Broadband Operation
- Integrated Stability Enhancements
- Low Thermal Resistance
- Extended ESD Protection Circuit
- In Tape and Reel. R1 Suffix = 500 Units, 24 mm Tape Width, 13 inch Reel. 1.8- -2000 MHz, 25 W, 50 V WIDEBAND RF POWER LDMOS TRANSISTOR MRFE6VS25NR1 Note: The backside of the package is the source terminal for the transistor. (Top View) Drain12
Figure 1. Pin Connections © Freescale Semiconductor, Inc., 2012.All rights reserved.
Freescale Semiconductor, Inc. Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics(TA =2 5°C unless otherwise noted)
- Continuous use at maximum temperature will affect MTTF.
- MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
Documentation/Application Notes - - AN1955.
Freescale Semiconductor, Inc. Table 5. Electrical Characteristics(TA =2 5°C unless otherwise noted)(continued)
512 Pulse
31 Peak
50 No Device Degradation
Freescale Semiconductor, Inc. Figure 2. Capacitance versus Drain- -Source Voltage Figure 3. Normalized VGS versus Quiescent
0.7 Amps
0.9 Amps
Figure 4. MTTF versus Junction Temperature - - CW under indicated test conditions.
Freescale Semiconductor, Inc.
512 MHz NARROWBAND PRODUCTION TEST FIXTURE
Figure 5. MRFE6VS25NR1 Narrowband Test Circuit Component Layout 512 MHz *C5, C9 and C10 are mounted vertically. Table 6. MRFE6VS25NR1 Narrowband Test Circuit Component Designations and Values 512 MHz
Freescale Semiconductor, Inc. Table 7. MRFE6VS25NR1 Narrowband Test Circuit Microstrips 512 MHz Figure 6. MRFE6VS25NR1 Narrowband Test Circuit Schematic 512 MHz
Freescale Semiconductor, Inc. Figure 10. Narrowband Series Equivalent Source and Load Impedance 512 MHz
Freescale Semiconductor, Inc. Table 8. 1.8- -30 MHz Broadband Performance(In Freescale Reference Circuit, 50 ohm system) Table 9. Load Mismatch/Ruggedness(In Freescale Reference Circuit, 50 ohm system, IDQ =2 5m A )
30 Pulse (100μsec,
29 Peak
50 No Device
Freescale Semiconductor, Inc. Figure 11. MRFE6VS25NR1 Broadband Reference Circuit Component Layout 1.8- -30 MHz *C1 and C11 are mounted vertically. Table 10. MRFE6VS25NR1 Broadband Reference Circuit Component Designations and Values 1.8- -30 MHz
Freescale Semiconductor, Inc. Table 11. MRFE6VS25NR1 Broadband Reference Test Circuit Microstrips 1.8- -30 MHz Figure 12. MRFE6VS25NR1 Broadband Reference Circuit Schematic 1.8- -30 MHz
Freescale Semiconductor, Inc. Figure 13. Power Gain, CW Output Power and Drain Figure 14. CW Output Power versus Gate- -Source
30 MHz
1.8 MHz
Figure 15. CW Output Power versus Input Power Figure 16. Power Gain and Drain Efficiency versus CW Output Power
10 MHz
Freescale Semiconductor, Inc. Figure 20. Broadband Series Equivalent Source and Load Impedance 1.8- -30 MHz
Freescale Semiconductor, Inc.
1030 MHz NARROWBAND REFERENCE CIRCUIT
Table 12. 1030 MHz Narrowband Performance(In Freescale Reference Circuit, 50 ohm system) Table 13. Load Mismatch/Ruggedness(In Freescale Reference Circuit, 50 ohm system, IDQ =2 5m A )
1030 Pulse (100μsec,
30 Peak
Freescale Semiconductor, Inc.
1030 MHz NARROWBAND REFERENCE TEST FIXTURE
Figure 21. MRFE6VS25NR1 Narrowband Reference Circuit Component Layout 1030 MHz Table 14. MRFE6VS25NR1 Narrowband Reference Circuit Component Designations and Values 1030 MHz
Freescale Semiconductor, Inc. Table 15. MRFE6VS25NR1 Narrowband Reverence Test Circuit Microstrips 1030 MHz Figure 22. MRFE6VS25NR1 Narrowband Reference Circuit Schematic 1030 MHz
Freescale Semiconductor, Inc. Figure 26. Narrowband Series Equivalent Source and Load Impedance 1030 MHz
Freescale Semiconductor, Inc. MRFE6VS25NR1 PACKAGE DIMENSIONS
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MRFE6VS25NR1
Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents, software and tools to aid your design process. Application Notes
- AN1907: Solder Reflow Attach Method for High Power RF Devices in Over- -Molded Plastic Packages
- AN1955: Thermal Measurement Methodology of RF Power Amplifiers
- AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over- -Molded Plastic Packages
- AN3789: Clamping of High Power RF Transistors and RFICs in Over- -Molded Plastic Packages Engineering Bulletins
- EB212: Using Data Sheet Impedances for RF LDMOS Devices
- EB38: Measuring the Intermodulation Distortion of Linear Amplifiers Software
- Electromigration MTTF Calculator
- RF High Power Model
- .s2p File Development Tools
- Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the Part Number link. Go to the Software & Tools tab on the parts Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description
0 June 2012 • Initial Release of Data Sheet
Freescale Semiconductor, Inc. MRFE6VS25NR1 Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customers technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.reg.net/v2/webservices/Freescale/Docs/TermsandConditions.htm. Freescale, the Freescale logo, AltiVec, C- -5, CodeTest, CodeWarrior, ColdFire, C- -Ware, Energy Efficient Solutions logo, Kinetis, mobileGT, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony, and VortiQa are trademarks of ColdFire+, CoreNet, Flexis, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, SMARTMOS, TurboLink, Vybrid, and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. E 2012 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MRFE6VS25N Rev. 0, 6/2012