MRFE6VP61K25HR6 FREESCALE | Alldatasheet

Document overview

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Technical content

Features

  • Unmatched Input and Output Allowing Wide Frequency Range Utilization
  • Device can be used Single- -Ended or in a Push- -Pull Configuration
  • Qualified Up to a Maximum of 50 VDD Operation
  • Characterized from 30 V to 50 V for Extended Power Range
  • Suitable for Linear Application with Appropriate Biasing
  • Integrated ESD Protection with Greater Negative Gate- -Source Voltage Range for Improved Class C Operation
  • Characterized with Series Equivalent Large- -Signal Impedance Parameters
  • RoHS Compliant
  • In Tape and Reel. R6 Suffix = 150 Units, 56 mm Tape Width, 13 inch Reel.

Table 1. Maximum Ratings Table 2. Thermal Characteristics

  1. Continuous use at maximum temperature will affect MTTF.
  2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF

Select Documentation/Application Notes - - AN1955. Figure 1. Pin Connections

42 RFout/VDS

© Freescale Semiconductor, Inc., 2010.All rights reserved.

Table 3. ESD Protection Characteristics Table 4. Electrical Characteristics(TA =2 5°C unless otherwise noted)

  1. Each side of device measured separately.

Figure 2. MRFE6VP61K25HR6(HSR6) Test Circuit Schematic — Pulsed

Figure 3. MRFE6VP61K25HR6(HSR6) Test Circuit Component Layout — Pulsed Table 5. MRFE6VP61K25HR6(HSR6) Test Circuit Component Designations and Values — Pulsed

Figure 4. Capacitance versus Drain- -Source Voltage Note: Each side of device measured separately. Figure 5. Pulsed Output Power versus Figure 6. Pulsed Power Gain and Drain Efficiency Figure 7. Pulsed Power Gain versus

50 V21

40 V 45 V

Figure 8. Pulsed Drain Efficiency versus Figure 9. Pulsed Power Gain and Drain Efficiency

50 V35 V 40 V 45 V

Figure 10. MTTF versus Junction Temperature — CW is operated at VDD =5 0V d c ,Pout = 1250 W CW, andηD = 74.6%.

gate to gate, balanced configuration. drain to drain, balanced configuration. Figure 11. Series Equivalent Source and Load Impedance

MRFE6VP61K25HR6 MRFE6VP61K25HSR6 PACKAGE DIMENSIONS

MRFE6VP61K25HR6 MRFE6VP61K25HSR6 RF Device Data Freescale Semiconductor

MRFE6VP61K25HR6 MRFE6VP61K25HSR6

MRFE6VP61K25HR6 MRFE6VP61K25HSR6 RF Device Data Freescale Semiconductor

MRFE6VP61K25HR6 MRFE6VP61K25HSR6 PRODUCT DOCUMENTATION AND SOFTWARE Refer to the following documents and software to aid your design process. Application Notes

  • AN1955: Thermal Measurement Methodology of RF Power Amplifiers Engineering Bulletins
  • EB212: Using Data Sheet Impedances for RF LDMOS Devices Software
  • Electromigration MTTF Calculator
  • RF High Power Model
  • .s2p File For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 0 Nov. 2010 • Initial Release of Data Sheet

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