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Unmatched Input and Output Allowing Wide Frequency Range Utilization Device can be used Single- -Ended or in a Push- -Pull Configuration Qualified Up to a Maximum of 50 VDD Operation Characterized from 30 V to 50 V for Extended Power Range Suitable for Linear Application with Appropriate Biasing Integrated ESD Protection with Greater Negative Gate- -Source Voltage Range for Improved Class C Operation Characterized with Series Equivalent Large- -Signal Impedance Parameters In Tape and Reel. R6 Suffix = 150 Units, 56 mm Tape Width, 13- -inch Reel. R5 Suffix = 50 Units, 56 mm Tape Width, 13- -inch Reel. Document Number: MRFE6VP61K25H Rev. 4, 3/2013 Freescale Semiconductor Technical Data 1.8- -600 MHz, 1250 W CW, 50 V WIDEBAND RF POWER LDMOS TRANSISTORS MRFE6VP61K25HR6 MRFE6VP61K25HSR5 MRFE6VP61K25GSR5 (Top View) Drain A31 Figure 1. Pin Connections
42 Drain B
source terminal for the transistor. Freescale Semiconductor, Inc., 2010- -2013.All rights reserved.
Freescale Semiconductor, Inc. Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted)
- Continuous use at maximum temperature will affect MTTF.
- MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
Select Documentation/Application Notes - - AN1955.
- Each side of device measured separately. (continued)
Freescale Semiconductor, Inc. Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued) Table 5. Load Mismatch/Ruggedness(In Freescale Test Fixture, 50 ohm system) IDQ = 100 mA
230 Pulse
1500 Peak
50 No Device Degradation
- Measurements made with device in straight leadconfiguration before any lead forming operation is applied. Lead forming is used for gull
Freescale Semiconductor, Inc. Figure 2. MRFE6VP61K25HR6(HSR6) 230 MHz Production Test Circuit Component Layout — Pulse Table 6. MRFE6VP61K25HR6(HSR6) 230 MHz Production Test Circuit Component Designations and Values — Pulse
Freescale Semiconductor, Inc. Table 7. MRFE6VP61K25HR6(HSR6) 230 MHz Production Test Circuit Microstrips — Pulse Figure 3. MRFE6VP61K25HR6(HSR6) 230 MHz Production Test Circuit Schematic — Pulse
Freescale Semiconductor, Inc. Figure 4. Capacitance versus Drain- -Source Voltage Note: Each side of device measured separately. Figure 5. Output Power versus Input Power Figure 6. Power Gain and Drain Efficiency Figure 7. Power Gain versus Output Power
50 V21
40 V 45 V
Figure 8. Drain Efficiency versus Output Power Figure 9. Power Gain and Drain Efficiency versus
50 V35 V 40 V 45 V
Freescale Semiconductor, Inc. gate to gate, balanced configuration. drain to drain, balanced configuration. Figure 12. Source and Load Impedances Optimized for IRL, Power and Efficiency — Push- -Pull
Freescale Semiconductor, Inc. Figure 13. MRFE6VP61K25HR6(HSR6) 87.5- -108 MHz FM Broadcast Reference Circuit Component Layout Table 8. MRFE6VP61K25HR6(HSR6) 87.5- -108 MHz FM Broadcast Reference Circuit Component Designations
Freescale Semiconductor, Inc. Figure 14. MRFE6VP61K25HR6(HSR6) 87.5- -108 MHz FM Broadcast Reference Circuit Schematic
Freescale Semiconductor, Inc. Figure 15. Power Gain and Drain Efficiency
108 MHz 98 MHz
87.5 MHz
108 MHz
98 MHz
gate to gate, balanced configuration. drain to drain, balanced configuration. Figure 16. Series Equivalent 87.5- -108 MHz FM Broadcast Reference Circuit Source and Load Impedance
Freescale Semiconductor, Inc. Figure 17. MRFE6VP61K25HR6(HSR6) 144- -148 MHz Reference Circuit Component Layout *C7, C8, C9, C10, C11, and C12 are mounted vertically. Note: Component number C2 is not used. Table 9. MRFE6VP61K25HR6(HSR6) 144- -148 MHz Reference Circuit Component Designations and Values
Freescale Semiconductor, Inc. Figure 18. MRFE6VP61K25HR6(HSR6) 144- -148 MHz Reference Circuit Schematic
Freescale Semiconductor, Inc. Figure 22. 144 MHz Harmonics @ 1 kW
144 MHz, 1 kW
144.00000000 MHz
144.00501002 MHz
288.00501002 MHz
432.00501002 MHz
576.00501002 MHz
1.5 E 04 W
Freescale Semiconductor, Inc. MRFE6VP61K25HR6 MRFE6VP61K25HSR5 MRFE6VP61K25GSR5 PACKAGE DIMENSIONS
MRFE6VP61K25HR6 MRFE6VP61K25HSR5 MRFE6VP61K25GSR5 RF Device Data Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MRFE6VP61K25HR6 MRFE6VP61K25HSR5 MRFE6VP61K25GSR5
MRFE6VP61K25HR6 MRFE6VP61K25HSR5 MRFE6VP61K25GSR5 RF Device Data Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MRFE6VP61K25HR6 MRFE6VP61K25HSR5 MRFE6VP61K25GSR5
MRFE6VP61K25HR6 MRFE6VP61K25HSR5 MRFE6VP61K25GSR5 RF Device Data Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MRFE6VP61K25HR6 MRFE6VP61K25HSR5 MRFE6VP61K25GSR5 PRODUCT DOCUMENTATION AND SOFTWARE Refer to the following documents and software to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers Engineering Bulletins EB212: Using Data Sheet Impedances for RF LDMOS Devices Software Electromigration MTTF Calculator RF High Power Model .s2p File For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Nov. 2010 Initial Release of Data Sheet 1 Jan. 2011 Fig. 1, Pin Connections, corrected pin 4 label from RFout/VGS to RFin/VGS,p .1 2 May 2012 Added Application Circuits Typical Performance table, p. 1 Capable of Handling VSWR bullet: corrected 1250 Peak Output Power value to 1500 and converted to table, p. 1, 3 Table 1, Max Ratings: final DC test specification for Drain- -Source Voltage changed from +125 to +133 Vdc, p. 2 Table 3, ESD Protection Characteristics: added the device’s ESD passing level as applicable to each ESD class, p. 2 Table 4, Off Characteristics: finalDC test specification for Drain- -Source Breakdown Voltage minimum value changed from 125 to 133 Vdc, p. 2 Table 4, On Characteristics: addedForward Transconductance, p. 2 Fig. 10, MTTF versus Junction Temperature - - CW: MTTF end temperature on graph changed to match maximum operating junction temperature, p. 7 Added Fig. 12, Source and Load Impedances Optimized forIRL, Power and Efficiency — Push- -pull, p. 8 Added Fig. 13, 87.5- -108 MHz FM Broadcast Reference Circuit Component Layout, p. 9 Added Table 9, 87.5- -108 MHz FM Broadcast Reference Circuit Component Designations and Values, p. 9 Added Fig. 14, 87.5- -108 MHz FM Broadband Reference Circuit Schematic, p. 10 Added Fig. 15, Power Gain and Drain Efficiency versus Output Power (87.5- -108 MHz), p. 11 Added Fig. 16, Series Equivalent 87.5- -108 MHz FM Broadcast Reference Circuit Source and Load Impedance, p. 11 Added Fig. 17, 144- -148 MHz Reference Circuit Component Layout, p. 12 Added Table 9, 144- -148 MHz Reference Circuit Component Designations and Values, p. 12 Added Fig. 18, 144- -148 MHz Reference Circuit Schematic, p. 13 Added Fig. 19, Series Equivalent 144- -148 MHz Reference Circuit Source and Load Impedance, p. 14 Added Fig. 20, Power Gain and Drain Efficiency versus Output Power (144- -148 MHz), p. 14 Added Fig. 21, Intermodulation Distortion Products versus Output Power (144- -148 MHz), p. 14 Added Fig. 22, 144 MHz Harmonics @ 1 kW, p. 15 3 Oct. 2012 Added part number MRFE6VP61K25GSR5, p. 1 Added 2282- -02 (NI- -1230S- -4 Gull) package isometric, p. 1, and Mechanical Outline, p. 20, 21 4 Mar. 2013 MRFE6VP61K25HR6 tape and reel option replaced with MRF6VP61K25HR5 per PCN15551. Replaced Case Outline 98ASB16977C, Issue E with Issue F, p. 16, 17. Changed dimension C from Replaced Case Outline 98ARB18247C, Issue F with Issue G, p. 18, 19. Changed dimension C from Replaced Case Outline 98ASA00459D, Issue O with Issue A, p. 20, 21. Changed dimension C from
MRFE6VP61K25HR6 MRFE6VP61K25HSR5 MRFE6VP61K25GSR5 RF Device Data Freescale Semiconductor, Inc. Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale, the Freescale logo, AltiVec, C- -5, CodeTest, CodeWarrior, ColdFire, C- -Ware, Energy Efficient Solutions logo, Kinetis, mobileGT, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony, and VortiQa are trademarks of ColdFire+, CoreNet, Flexis, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, SMARTMOS, TurboLink, Vybrid, and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. E 2010- -2013 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MRFE6VP61K25H Rev. 4, 3/2013