MRF8P9300HR6_10 FREESCALE | Alldatasheet
Document overview
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- PDF pages: 18
Technical content
Features
- 100% PAR Tested for Guaranteed Output Power Capability
- Characterized with Series Equivalent Large- -Signal Impedance Parameters and Common Source S- -Parameters
- Internally Matched for Ease of Use
- Integrated ESD Protection
- Greater Negative Gate- -Source VoltageRange for Improved Class C Operation
- Designed for Digital Predistortion Error Correction Systems
- Optimized for Doherty Applications
- RoHS Compliant
- In Tape and Reel. R6 Suffix = 150 Units per 56 mm, 13 inch Reel.
Table 1. Maximum Ratings
- Continuous use at maximum temperature will affect MTTF.
- MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
42 RFoutB/VDSB
Figure 1. Pin Connections © Freescale Semiconductor, Inc., 2009- -2010.All rights reserved.
Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Electrical Characteristics(TA =2 5°C unless otherwise noted) Channel Bandwidth @±5M H zO f f s e t . Channel Bandwidth @±5M H zO f f s e t .
- MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
Select Documentation/Application Notes - - AN1955.
- Each side of device measured separately.
- Part internally matched both on input and output.
Table 4. Electrical Characteristics(TA =2 5°C unless otherwise noted)(continued) 3.84 MHz Channel Bandwidth @±5M H zO f f s e t .
Figure 2. MRF8P9300HR6(HSR6) Test Circuit Component Layout *C10, C11, C12, and C13 are mounted vertically. Table 5. MRF8P9300HR6(HSR6) Test Circuit Component Designations and Values
MRF8P9300HR6 MRF8P9300HSR6 RF Device Data Freescale Semiconductor λ λ λ λ λ λ Single- -ended Quadrature combined Doherty Push- -pull λ λ 4 λ λ Figure 3.Possible Circuit Topologies Devices are tested in a parallel configuration
Pout, OUTPUT POWER (WATTS) AVG. Figure 7. Single- -Carrier W- -CDMA Power Gain, Drain Figure 8. Broadband Frequency Response
20 Gain
940 MHz
960 MHz
920 MHz
Figure 9. CCDF W- -CDMA IQ Magnitude Channel Bandwidth @±5M H zO f f s e t .
3.84 MHz
Figure 10. Single- -Carrier W- -CDMA Spectrum
Figure 11. Series Equivalent Source and Load Impedance
Figure 12. Pulsed CW Output Power NOTE: Measurement made on a per side basis.
Figure 13. MRF8P9300HR6(HSR6) Test Circuit Component Layout 865- -895 MHz Table 6. MRF8P9300HR6(HSR6) Test Circuit Component Designations and Values 865- -895 MHz
Figure 14. Output Peak- -to- -Average Ratio Compression (PARC) Broadband Performance @ Pout = 100 Watts Avg.
3.84 MHz Channel Bandwidth, Input Signal
Pout, OUTPUT POWER (WATTS) AVG. Figure 15. Single- -Carrier W- -CDMA Power Gain, Drain Figure 16. Broadband Frequency Response
880 MHz 895 MHz
865 MHz
880 MHz
895 MHz
3.84 MHz Channel Bandwidth
Figure 17. Series Equivalent Source and Load Impedance 865- -895 MHz
MRF8P9300HR6 MRF8P9300HSR6 RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS
MRF8P9300HR6 MRF8P9300HSR6
MRF8P9300HR6 MRF8P9300HSR6 RF Device Data Freescale Semiconductor
MRF8P9300HR6 MRF8P9300HSR6
MRF8P9300HR6 MRF8P9300HSR6 RF Device Data Freescale Semiconductor PRODUCT DOCUMENTATION AND SOFTWARE Refer to the following documents to aid your design process. Application Notes
- AN1955: Thermal Measurement Methodology of RF Power Amplifiers Engineering Bulletins
- EB212: Using Data Sheet Impedances for RF LDMOS Devices Software
- Electromigration MTTF Calculator
- RF High Power Model
- .s2p File For Software, do a Part Number search at http://www.freescale.com, and select the Part Number link. Go to the Software & Tools tab on the parts Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Nov. 2009 • Initial Release of Data Sheet 1 May 2010 • Changed ESD Human Body Model rating from Class 1C to Class 2 to reflect recent ESD test results of the device, p. 2
- Added Alternate Characterization for 865- -895 MHz Frequency Band as follows: - - Typical Performance bullet, p. 1 - - Typical Broadband Performance table, p. 3 - - Fig. 13, Test Circuit Component Layout and Table 6, Test Circuit Component Designations and Values, p. 10 - - Fig. 14, Output Peak- -to- -Average Ratio Compression (PARC) Broadband Performance @ P out = 100 Watts A v g . ,p .1 1 - - Fig. 15, Single- -Carrier W- -CDMA Power Gain, Drain, Efficiency and ACPR versus Output Power, p. 11 - - Fig. 16, Broadband Frequency Response, p. 11 - - Fig. 17, Series Equivalent Source and Load Impedance, p. 12 1.1 July 2010 • Changed 850 MHz to 880 MHz in the Typical Broadband Performance table for the 865- -895 MHz frequency band, p. 3
- Added connection pad identifiers to Fig. 2, Test Circuit Component Layout, p. 4
MRF8P9300HR6 MRF8P9300HSR6 Information in this document is provided solely to enablesystem and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its productsfor any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and allliability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals, must be validated for each customer application by customers technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components insystems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributorsharmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009- -2010. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516
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