MRF8P8300H NXP | Alldatasheet

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Technical content

Features

 100% PAR Tested for Guaranteed Output Power Capability  Characterized with Series Equivalent Large- -Signal Impedance Parameters and Common Source S- -Parameters  Internally Matched for Ease of Use  Integrated ESD Protection  Greater Negative Gate- -Source Voltage Range for Improved Class C Operation  Designed for Digital Predistortion Error Correction Systems  Optimized for Doherty Applications  In Tape and Reel. R6 Suffix = 150 Units, 56 mm Tape Width, 13- -inch Reel. Table 1. Maximum Ratings Table 2. Thermal Characteristics

  1. Continuous use at maximum temperature will affect MTTF.
  2. MTTF calculator available at http://www.freescale.com/rf

Select Documentation/Application Notes - - AN1955.

42 RFoutB/VDSB

Figure 1. Pin Connections  Freescale Semiconductor, Inc., 2011, 2013.All rights reserved.

Freescale Semiconductor, Inc. Table 3. ESD Protection Characteristics Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted) Channel Bandwidth @5M H zO f f s e t . Channel Bandwidth @5M H zO f f s e t .

  1. Each side of device measured separately.
  2. Part internally matched both on input and output.

Freescale Semiconductor, Inc. Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued)

Freescale Semiconductor, Inc. Figure 2. MRF8P8300HR6(HSR6) Test Circuit Component Layout *C5, C6, C47, and C48 are mounted vertically. Table 5. MRF8P8300HR6(HSR6) Test Circuit Component Designations and Values

Freescale Semiconductor, Inc. Pout, OUTPUT POWER (WATTS) AVG. Figure 6. Single- -Carrier W- -CDMA Power Gain, Drain Figure 7. Broadband Frequency Response

790 MHz

805 MHz 820 MHz

805 MHz

820 MHz

Figure 8. CCDF W- -CDMA IQ Magnitude Channel Bandwidth @5M H zO f f s e t .

3.84 MHz

Figure 9. Single- -Carrier W- -CDMA Spectrum

Freescale Semiconductor, Inc. gate to ground, gate leads are tied together. drain to ground, drain leads are tied together. Figure 10. Series Equivalent Source and Load Impedance

Freescale Semiconductor, Inc.

822 MHz

806 MHz

822 MHz806 MHz

Figure 11. Pulsed CW Output Power Note: Measurement made on a per side basis.

MRF8P8300HR6 MRF8P8300HSR6 RF Device Data Freescale Semiconductor, Inc. PACKAGE DIMENSIONS

Freescale Semiconductor, Inc. MRF8P8300HR6 MRF8P8300HSR6

MRF8P8300HR6 MRF8P8300HSR6 RF Device Data Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc. MRF8P8300HR6 MRF8P8300HSR6

MRF8P8300HR6 MRF8P8300HSR6 RF Device Data Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents, tools and software to aid your design process. Application Notes  AN1955: Thermal Measurement Methodology of RF Power Amplifiers Engineering Bulletins  EB212: Using Data Sheet Impedances for RF LDMOS Devices Software  Electromigration MTTF Calculator  RF High Power Model  .s2p File For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 0 Jan. 2011  Initial Release of Data Sheet 1 Apr. 2013  Changed operating frequency from 790- -820 MHz to 750- -820 MHz due to expanded device frequency capability resulting from additional test data, p. 1  Table 3, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive devices, p. 2  Replaced Case Outline 98ASB16977C, Issue E with Issue F, p. 9, 10. Changed dimension C from  Replaced Case Outline 98ARB18247C, Issue F with Issue G, p. 11, 12. Changed dimension C from

Freescale Semiconductor, Inc. MRF8P8300HR6 MRF8P8300HSR6 Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2011, 2013 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MRF8P8300H Rev. 1, 4/2013