MRF7S35015HSR3_11 FREESCALE | Alldatasheet

Document overview

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Technical content

Features

  • Characterized with Series Equivalent Large- -Signal Impedance Parameters
  • Internally Matched for Ease of Use
  • Integrated ESD Protection
  • Greater Negative Gate- -Source Voltage Range for Improved Class C Operation
  • RoHS Compliant
  • In Tape and Reel. R3 Suffix = 250 Units, 32 mm Tape Width, 13 inch Reel.

Table 1. Maximum Ratings Table 2. Thermal Characteristics

  1. Continuous use at maximum temperature will affect MTTF.
  2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF

Select Documentation/Application Notes - - AN1955. © Freescale Semiconductor, Inc., 2008, 2011.All rights reserved.

Table 3. ESD Protection Characteristics Table 4. Electrical Characteristics(TC =2 5°C unless otherwise noted)

  1. Part internally matched both on input and output.

Figure 1. MRF7S35015HSR3 Test Circuit Schematic Table 5. MRF7S35015HSR3 Test Circuit Component Designations and Values *B1 is removed for WiMAX circuit performance.

Figure 2. MRF7S35015HSR3 TestCircuit Component Layout

Figure 3. Capacitance versus Drain- -Source Voltage Figure 4. DC Safe Operating Area Figure 5. Pulsed Power Gain and Drain Efficiency Figure 6. Pulsed Output Power versus Figure 7. Pulsed Power Gain versus Figure 8. Pulsed Power Gain versus

3300 MHz

3100 MHz

3500 MHz

Figure 9. Pulsed Output Power versus

3100 MHz - -30_C 3300 MHz - -30_C

3100 MHz 25_C

3500 MHz - -30_C

3300 MHz 85_C

3300 MHz 25_C

3500 MHz 85_C

3100 MHz 85_C

3500 MHz 25_C

Figure 10. Pulsed Power Gain and Drain Efficiency Figure 11. Pulsed Power Gain and Drain Efficiency Figure 12. Pulsed Power Gain and Drain Efficiency

Figure 16. Series Equivalent Source and Load Impedance

Refer to the following documents to aid your design process. Application Notes

  • AN1955: Thermal Measurement Methodology of RF Power Amplifiers Engineering Bulletins
  • EB212: Using Data Sheet Impedances for RF LDMOS Devices

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description

0 June 2008 • Initial Release of Data Sheet

1 Aug. 2008 • Added p. 1 of Case 465J- -02 Mechanical Outline drawing, p. 9 Microstrip and moved footnote reference from Z2 and Z3 to Z15 and Z17, p. 3

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