MRF6S20010NR1 FREESCALE | Alldatasheet
Document overview
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Technical content
Features
- Characterized with Series Equivalent Large-Signal Impedance Parameters
- Internally Matched for Ease of Use
- Qualified Up to a Maximum of 32 V DD Operation
- Integrated ESD Protection
- 200°C Capable Plastic Package
- RoHS Compliant
- In Tape and Reel. R1 Suffix = 500 Units per 24 mm, 13 inch Reel.
Table 1. Maximum Ratings © Freescale Semiconductor, Inc., 2006. All rights reserved.
Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted)
- MTTF calculator available at http://www.freescale.com/rf . Select Tools/Software/Application Software/Calculators to
access the MTTF calculators by product. Select Documentation/Application Notes - AN1955.
- Part internally matched on input.
Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted) (continued) PAR = 8.5 dB @ 0.01% Probability on CCDF.
Figure 1. MRF6S20010NR1(GNR1) Test Circuit Schematic 2110-2170 MHz Table 6. MRF6S20010NR1(GNR1) Test Circuit Component Designations and Values 2110-2170 MHz
Figure 2. MRF6S20010NR1(GNR1) Test Circuit Component Layout 2110-2170 MHz
Figure 8. Pulse CW Output Power versus Figure 9. Power Gain and Drain Efficiency Figure 10. Power Gain versus Output Power
28 V 32 V
Figure 11. Broadband Frequency Response Figure 12. MTTF Factor versus Junction Temperature MTTF factor by ID2 for MTTF in a particular application.
Figure 15. CCDF W-CDMA 3GPP , Test Model 1,
64 DPCH, 67% Clipping, Single-Carrier Test Signal
Figure 16. 2-Carrier W-CDMA Spectrum
3.84 MHz
3.84 MHz BW
Figure 17. MRF6S20010NR1(GNR1) Test Circuit Schematic 1930-1990 MHz Table 7. MRF6S20010NR1(GNR1) Test Circuit Component Designations and Values 1930-1990 MHz
Figure 18. MRF6S20010NR1(GNR1) Test Circuit Component Layout 1930-1990 MHz
Figure 19. Single-Carrier N-CDMA Broadband Performance Figure 20. Single-Carrier N-CDMA ACPR and Drain Pout, OUTPUT POWER (WATTS) AVG.
8 Through 13)
Figure 21. Single-Carrier CCDF N-CDMA
1.2288 MHz
Figure 22. Single-Carrier N-CDMA Spectrum
Figure 23. MRF6S20010NR1(GNR1) Test Circuit Schematic 1805-1880 MHz Table 8. MRF6S20010NR1(GNR1) Test Circuit Component Designations and Values 1805-1880 MHz
Figure 24. MRF6S20010NR1(GNR1) Test Circuit Component Layout 1805-1880 MHz
Figure 29. Series Equivalent Source and Load Impedance
1800 MHz
2170 MHz
1900 MHz
Table 9. Common Source Scattering Parameters (VDD = 28 V, IDQ = 126 mA, TC = 25/C0053C, 50 ohm system)
Table 9. Common Source Scattering Parameters (VDD = 28 V, IDQ = 126 mA, TC = 25/C0053C, 50 ohm system) (continued)
MRF6S20010NR1 MRF6S20010GNR1 PACKAGE DIMENSIONS
MRF6S20010NR1 MRF6S20010GNR1 RF Device Data Freescale Semiconductor
MRF6S20010NR1 MRF6S20010GNR1
MRF6S20010NR1 MRF6S20010GNR1 RF Device Data Freescale Semiconductor TO-270-2 GULL PLASTIC CASE 1265A-02 ISSUE B BOTTOM VIEW E EXPOSED HEATSINK AREA A B D H PIN ONE ID ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ D AMaaa C AMaaa C NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M−1994. 3. DATUM PLANE −H− IS LOCATED AT TOP OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE TOP OF THE PARTING LINE. 4. DIMENSIONS D1" AND E1" DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS .006 PER SIDE. DIMENSIONS D1" AND E1" DO INCLUDE MOLD MISMATCH AND ARE DETER− MINED AT DATUM PLANE −H−. 5. DIMENSION b1 DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .005 TOTAL IN EXCESS OF THE b1 DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. DATUMS −A− AND −B− TO BE DETERMINED AT DATUM PLANE −H−. 7. DIMENSIONS D" AND E2" DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS .003 PER SIDE. DIMENSIONS D" AND E2" DO INCLUDE MOLD MISMATCH AND ARE DETER− MINED AT DATUM PLANE −D−. c1 E2 A DIM A MIN MAX MIN MAX MILLIMETERS .078 .082 1.98 2.08 INCHES A1 .001 .004 0.02 0.10 A2 .077 .088 1.96 2.24 D .416 .424 10.57 10.77 D1 .378 .382 9.60 9.70 D2 .290 .320 7.37 8.13 D3 .016 .024 0.41 0.61 E .316 .324 8.03 8.23 E1 .238 .242 6.04 6.15 E2 .066 .074 1.68 1.88 E3 .150 .180 3.81 4.57 E4 .058 .066 1.47 1.68 b1 .193 .199 4.90 5.06 c1 .007 .011 0.18 0.28 aaa .01 BSC .004
0.25 BSC
0.10 PIN 1 PIN 2 PIN 3 STYLE 1: PIN 1. DRAIN 2. GATE 3. SOURCE e 2 8 2 8 L .018 .024 4.90 5.06 °°°° DETAIL Y SEATING PLANE BMbbb C L A1 GAGE PLANE e DETAIL Y E5 .231 .235 5.87 5.97 MRF6S20010GNR1
MRF6S20010NR1 MRF6S20010GNR1 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals, must be validated for each customer application by customers technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale/C0116 and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. All rights reserved. How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7
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