MRF6S18060NR1_08 FREESCALE | Alldatasheet
Document overview
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Technical content
Features
- Characterized with Series Equivalent Large-Signal Impedance Parameters
- Internally Matched for Ease of Use
- Qualified Up to a Maximum of 32 V DD Operation
- Integrated ESD Protection
- 225°C Capable Plastic Package
- N Suffix Indicates Lead-Free Terminations. RoHS Compliant.
- In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel.
Table 1. Maximum Ratings Table 2. Thermal Characteristics
- Continuous use at maximum temperature will affect MTTF.
- MTTF calculator available at http://www.freescale.com/rf . Select Software & Tools/Development Tools/Calculators to access
MTTF calculators by product. Select Documentation/Application Notes - AN1955. © Freescale Semiconductor, Inc., 2006, 2008. All rights reserved.
Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted)
- Part is internally matched both on input and output.
Figure 1. MRF6S18060NR1(NBR1) Test Circuit Schematic 1900 MHz Table 6. MRF6S18060NR1(NBR1) Test Circuit Component Designations and Values 1900 MHz
Figure 2. MRF6S18060NR1(NBR1) Test Circuit Component Layout 1900 MHz
Figure 15. Series Equivalent Source and Load Impedance 1900 MHz
Figure 16. MRF6S18060NR1(NBR1) Test Circuit Schematic 1800 MHz Table 7. MRF6S18060NR1(NBR1) Test Circuit Component Designations and Values 1800 MHz
Figure 17. MRF6S18060NR1(NBR1) Test Circuit Component Layout 1800 MHz
Figure 25. Series Equivalent Source and Load Impedance 1800 MHz
MRF6S18060NR1 MRF6S18060NBR1 PACKAGE DIMENSIONS
MRF6S18060NR1 MRF6S18060NBR1 RF Device Data Freescale Semiconductor
MRF6S18060NR1 MRF6S18060NBR1
MRF6S18060NR1 MRF6S18060NBR1 RF Device Data Freescale Semiconductor
MRF6S18060NR1 MRF6S18060NBR1
MRF6S18060NR1 MRF6S18060NBR1 RF Device Data Freescale Semiconductor
MRF6S18060NR1 MRF6S18060NBR1 PRODUCT DOCUMENTATION Refer to the following documents to aid your design process. Application Notes
- AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
- AN1955: Thermal Measurement Methodology of RF Power Amplifiers
- AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages Engineering Bulletins
- EB212: Using Data Sheet Impedances for RF LDMOS Devices
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 4 Dec. 2008 • Modified data sheet to reflect RF Test Reduction described in Product and Process Change Notification number, PCN13232, p. 1, 2
- Removed Total Device Dissipation from Max Ratings table as data was redundant (information already provided in Thermal Characteristics table), p. 1
- Changed Storage Temperature Range in Max Ratings table from -65 to +175 to -65 to +150 for standardization across products, p. 1
- Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150°C, p. 1
- Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table, related Continuous use at maximum temperature will affect MTTF footnote added and changed 200°C to 225°C in Capable Plastic Package bullet, p. 1
- Corrected VDS to VDD in the RF test condition voltage callout for VGS(Q), and added Measured in Functional Test, On Characteristics table, p. 2
- Removed Forward Transconductance from On Characteristics table as it no longer provided usable information, p. 2
- Updated Part Numbers in Tables 6, 7, Component Designations and Values, to latest RoHS compliant part numbers, p. 3, 9
- Removed lower voltage tests from Fig. 6, Power Gain versus Output Power, due to fixed tuned fixture limitations, p. 5
- Replaced Fig. 13, MTTF versus Junction Temperature with updated graph. Removed Amps2 and listed operating characteristics and location of MTTF calculator for device, p. 7
- Replaced Case Outline 1486-03, Issue C, with 1486-03, Issue D, p. 14-16. Added pin numbers 1 through 4 on Sheet 1.
- Replaced Case Outline 1484-04, Issue D, with 1484-04, Issue E, p. 17-19. Added pin numbers 1 through 4 on Sheet 1, replacing Gate and Drain notations with Pin 1 and Pin 2 designations.
- Added Product Documentation and Revision History, p. 20
MRF6S18060NR1 MRF6S18060NBR1 RF Device Data Freescale Semiconductor Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals, must be validated for each customer application by customers technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale/C0116 and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006, 2008. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516
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