MRF374A_06 FREESCALE | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 12
Technical content
Features
- Integrated ESD Protection
- Excellent Thermal Stability
- Characterized with Differential Large-Signal Impedance Parameters
- RoHS Compliant
Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics © Freescale Semiconductor, Inc., 2006. All rights reserved.
Table 4. Electrical Characteristics (TC = 25°C unless otherwise noted)
- Each side of device measured separately.
- Measurement made with device in push-pull configuration.
Figure 1. MRF374A Narrowband Test Circuit Component Layout transition period. These changes will have no impact on form, fit or function of the current product.
Table 5. MRF374A Narrowband Test Circuit Component Layout Designations and Values
28 Vdc
Figure 2. Gain versus Frequency Figure 3. Intermodulation Distortion versus Figure 4. Drain Efficiency versus Frequency Figure 5. Performance in Broadband Circuit Figure 6. Capacitance versus Voltage Figure 7. COFDM Intermodulation, Gain and Efficiency
32 Vdc
Pout, OUTPUT POWER (WATTS) AVG.
2 K Mode COFDM
64 QAM
Figure 12. Power Gain versus Peak Output Power Figure 13. Power Gain versus Peak Output Power
470 MHz
560 MHz
760 MHz
660 MHz
860 MHz
Figure 14. Drain Efficiency versus Peak Output Power Figure 15. Drain Efficiency versus Peak Output Power Figure 16. Intermodulation Distortion versus Figure 17. Intermodulation Distortion versus
860 MHzVDD = 28 Vdc
660 MHz 560 MHz
Figure 18. Series Equivalent Source and Load Impedance gate to gate, balanced configuration. from drain to drain, balanced configuration.
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY FROM PACKAGE BODY . D F E H R (LID) Q2X C SEATING PLANE CASE 375F-04 ISSUE E K 4 PL STYLE 1: PIN 1. DRAIN 2. DRAIN 3. GATE 4. GATE 5. SOURCE DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.135 1.145 28.80 29.10 B 0.225 0.235 5.72 5.97 C 0.135 0.178 3.43 4.52 D 0.210 0.220 5.33 5.59 E 0.055 0.065 1.40 1.65 F 0.004 0.006 0.11 0.15 G H 0.077 0.087 1.96 2.21 K L N 0.638 0.650 16.20 16.50 Q R 0.227 0.233 5.77 5.92
0.900 BSC
0.220 0.250
0.260 BSC
22.86 BSC
5.59 6.35
6.60 BSC
G BMbbb MLMAMbbb B MT B B (FLANGE) M N T MAMbbb B MT (INSULATOR) MAMccc B MT (LID) A (FLANGE) A M S (INSULATOR) MAMbbb B MT MAMccc B MT A M 0.643 0.657 16.33 16.69 S 0.225 0.235 5.715 5.97 .125 .135 3.175 3.43 bbb 0.010 BSC 0.254 BSC ccc 0.015 BSC 0.381 BSC T NI-650
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals, must be validated for each customer application by customers technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale/C0116 and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. All rights reserved. How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center
2 Dai King Street
Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Document Number: MRF374A Rev. 5, 5/2006