MRF21045LR3_08 FREESCALE | Alldatasheet

Document overview

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Technical content

Features

  • InternallyMatchedforEaseofUse
  • HighGain,HighEfficiencyandHighLinearity
  • IntegratedESDProtection
  • DesignedforMaximumGainandInsertionPhaseFlatness
  • ExcellentThermalStability
  • CharacterizedwithSeriesEquivalentLarge--SignalImpedanceParameters
  • LowGoldPlatingThicknessonLeads,40µ″Nominal.
  • RoHSCompliant
  • InTapeandReel.R3Suffix=250Unitsper32mm,13InchReel.

Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics SelectDocumentation/ApplicationNotes -- AN1955.  FreescaleSemiconductor,Inc.,2008.Allrightsreserved.

Table 4. Electrical Characteristics(TC =25°Cunlessotherwisenoted)

  1. Partisinternallymatchedbothoninputandoutput.

Table 4. Electrical Characteristics

Figure 1. MRF21045LR3(SR3) Test Circuit Schematic Table 5. MRF21045LR3(SR3) Component Designations and Values

Figure 2. MRF21045LR3(SR3) Test Circuit Component Layout noimpactonform,fitorfunctionofthecurrentproduct.

Figure 13. Series Equivalent Source and Load Impedance DD =28Vdc,IDQ =500mA,P out=10WAvg.

NOT RECOMMENDED FOR NEW DESIGN NOT RECOMMENDED FOR NEW DESIGN MRF21045LR3 MRF21045LSR3 RFDeviceData FreescaleSemiconductor PACKAGE DIMENSIONS CASE 465E--04 ISSUE F NI--400 MRF21045LR3 NOTES: 1. CONTROLLINGDIMENSION:INCH. 2. INTERPRETDIMENSIONSANDTOLERANCES PERASMEY14.5M,1994. 3. DIMENSIONHISMEASURED0.030(0.762) AWAYFROMPACKAGEBODY. 4. INFORMATIONONLY:CORNERBREAK(4X)TO (1.52±0.13)x45°CHAMFER. STYLE1: PIN1. DRAIN 2. GATE 3. SOURCE SEATING PLANE 2X D N (LID) E R (LID) F 2X K A T C MBMbbb A MT H B B G A MAMccc B MT MAMbbb B MT 2X Q M (INSULATOR) S (INSULATOR) MAMccc B MT MAMaaa B MT MAMaaa B MT DIM A MIN MAX MIN MAX MILLIMETERS .795 .805 20.19 20.44 INCHES B .380 .390 9.65 9.9 C .125 .163 3.17 4.14 D .275 .285 6.98 7.24 E .035 .045 0.89 1.14 F .004 .006 0.10 0.15 G H .057 .067 1.45 1.7 K .092 .122 2.33 3.1 M .395 .405 10 10.3 N .395 .405 10 10.3 Q .120 .130 3.05 3.3 R .395 .405 10 10.3 S .395 .405 10 10.3 aaa bbb ccc .600BSC 15.24BSC .005BSC 0.127BSC .010BSC 0.254BSC .015BSC 0.381BSC SEE NOTE 4 CASE 465F--04 ISSUE E NI--400S MRF21045LSR3 NOTES: 1. CONTROLLINGDIMENSION:INCH. 2. INTERPRETDIMENSIONSANDTOLERANCES PERASMEY14.5M--1994. 3. DIMENSIONHISMEASURED0.030(0.762)AWAY FROMPACKAGEBODY. STYLE1: PIN1. DRAIN 2. GATE 3. SOURCE SEATING PLANE E F 2X K MAMbbb B MT A T C H B A DIM A MIN MAX MIN MAX MILLIMETERS .395 .405 10.03 10.29 INCHES B .395 .405 10.03 10.29 C .125 .163 3.18 4.14 D .275 .285 6.98 7.24 E .035 .045 0.89 1.14 F .004 .006 0.10 0.15 H .057 .067 1.45 1.70 K .092 .122 2.34 3.10 M .395 .405 10.03 10.29 S .395 .405 10.03 10.29 aaa .005REF 0.127REF 2X D MAMccc B MT bbb .010REF 0.254REF ccc .015REF 0.38REF N .395 .405 10.03 10.29 R .395 .405 10.03 10.29 MAMccc B MT MAMaaa B MT N (LID) M (INSULATOR) (FLANGE) B (FLANGE) R (LID) S (INSULATOR) MAMaaa B MT

NOT RECOMMENDED FOR NEW DESIGN NOT RECOMMENDED FOR NEW DESIGN RFDeviceData FreescaleSemiconductor MRF21045LR3 MRF21045LSR3 PRODUCT DOCUMENTATION Refertothefollowingdocumentstoaidyourdesignprocess. Application Notes

  • AN1955:ThermalMeasurementMethodologyofRFPowerAmplifiers Engineering Bulletins
  • EB212:UsingDataSheetImpedancesforRFLDMOSDevices

REVISION HISTORY

Thefollowingtablesummarizesrevisionstothisdocument. Revision Date Description 12 Oct.2008 • Datasheetrevisedtoreflectpartstatuschange,p.1,includinguseofapplicableoverlay.

  • ModifieddatasheettoreflectRFTestReductiondescribedinProductandProcessChangeNotification number,PCN12779,p.1,2
  • AddedProductDocumentationandRevisionHistory,p.10

NOT RECOMMENDED FOR NEW DESIGN NOT RECOMMENDED FOR NEW DESIGN MRF21045LR3 MRF21045LSR3 RFDeviceData FreescaleSemiconductor Informationinthisdocumentisprovidedsolelytoenablesystemandsoftware implementerstouseFreescaleSemiconductorproducts.Therearenoexpressor impliedcopyrightlicensesgrantedhereundertodesignorfabricateanyintegrated circuitsorintegratedcircuitsbasedontheinformationinthisdocument. FreescaleSemiconductorreservestherighttomakechangeswithoutfurthernoticeto anyproductsherein.FreescaleSemiconductormakesnowarranty,representationor guaranteeregardingthesuitabilityofitsproductsforanyparticularpurpose,nordoes FreescaleSemiconductorassumeanyliabilityarisingoutoftheapplicationoruseof anyproductorcircuit,andspecificallydisclaimsanyandallliability,includingwithout limitationconsequentialorincidentaldamages.“Typical”parametersthatmaybe providedinFreescaleSemiconductordatasheetsand/orspecificationscananddo varyindifferentapplicationsandactualperformancemayvaryovertime.Alloperating parameters,including“Typicals”,mustbevalidatedforeachcustomerapplicationby customer’stechnicalexperts.FreescaleSemiconductordoesnotconveyanylicense underitspatentrightsnortherightsofothers.FreescaleSemiconductorproductsare notdesigned,intended,orauthorizedforuseascomponentsinsystemsintendedfor surgicalimplantintothebody,orotherapplicationsintendedtosupportorsustainlife, orforanyotherapplicationinwhichthefailureoftheFreescaleSemiconductorproduct couldcreateasituationwherepersonalinjuryordeathmayoccur.ShouldBuyer purchaseoruseFreescaleSemiconductorproductsforanysuchunintendedor unauthorizedapplication,BuyershallindemnifyandholdFreescaleSemiconductor anditsofficers,employees,subsidiaries,affiliates,anddistributorsharmlessagainstall claims,costs,damages,andexpenses,andreasonableattorneyfeesarisingoutof, directlyorindirectly,anyclaimofpersonalinjuryordeathassociatedwithsuch unintendedorunauthorizeduse,evenifsuchclaimallegesthatFreescale Semiconductorwasnegligentregardingthedesignormanufactureofthepart. Freescale/C0116andtheFreescalelogoaretrademarksofFreescaleSemiconductor,Inc. Allotherproductorservicenamesarethepropertyoftheirrespectiveowners.  FreescaleSemiconductor,Inc.2008.Allrightsreserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: FreescaleSemiconductor,Inc. TechnicalInformationCenter,EL516 2100EastElliotRoad Tempe,Arizona85284 www.freescale.com/support Europe, Middle East, and Africa: FreescaleHalbleiterDeutschlandGmbH TechnicalInformationCenter Schatzbogen7 81829Muenchen,Germany +441296380456(English) +46852200080(English) +498992103559(German) +33169354848(French) www.freescale.com/support Japan: FreescaleSemiconductorJapanLtd. Headquarters ARCOTower15F 1--8--1,Shimo--Meguro,Meguro--ku, Tokyo153--0064 Japan 0120191014or+81354379125 support.japan@freescale.com Asia/Pacific: FreescaleSemiconductorChinaLtd. ExchangeBuilding23F No.118JianguoRoad ChaoyangDistrict Beijing100022 China +861058798000 support.asia@freescale.com For Literature Requests Only: FreescaleSemiconductorLiteratureDistributionCenter P.O.Box5405 Denver,Colorado80217 LDCForFreescaleSemiconductor@hibbertgroup.com DocumentNumber:MRF21045 Rev.12,10/2008