MRF01-J-178

MRF01-J-178 HIROSE | Alldatasheet

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Push-On Coaxial Connectors (PC Card Type 22 Mountable) MRF01 Series I Features 1.Uses a push-on type system which is easy to engage and disengage. (There is no lock.) 2. Mountable on PCMCIA Type IICard The 3 mm receptacle thickness permits mounting to the back side of a type II card. Note that at the time of card mounting, use of 0.15mm offset of the board mounting surface from the card center line will result in the same card center axis and connector center axis. Modem Card Mounting Example (A special frame kit has not been manufactured.) Board Mounting Example Jack Side I Jack MRF01-J-178 I Receptacle MRF 01-R-1 I Conversion Adapter (Coupling portion: MRF01 side jack - SMA side jack) MRF01J-HRMJ Plug Side I Plug Receptacle MRF01-PR-1 I Conversion Adapter (Coupling portion: MRF01 side plug - SMA side jack) MRF01P-HRMJ 3. High Degree of Matching These connectors offer high frequency performance from 4. Accommodates Ultra-Fine Cable Suitable cable ...RG-178B/U (Ø1.8) ...RG-196A/U (Ø 2) I Applications Wireless LAN cards, GPS cards, and miniature wireless communications devices. I Function Diagrams

Item Requirements Test Conditions 1. Contact resistance Inner : 10 m ohms max. Outer : 3 m ohms max. 10 mA max. 2. Insulation resistance 5000 M ohms min. 500 V DC 3. Withstanding voltage No flashover or insulation breakdown. 500 V AC / 1 minute 5. Female contact retention 0.137 N min. Measured with a Ø 0.381 pin gauge 6. Insertion and withdrawal force (plug)0.56 N min. With corresponding connector 7. Durability (Insertion/withdrawal)Contact resistance: Amount of change 20 m ohms max.10,000 cycles 12. Hydrogen sulfide gas Contact resistance: Amount of change 20 m ohms max. No damage, cracks, or parts looseness. Leave for 96 hours in an atmosphere of 3ppm concentration sulfur dioxide gas at temperature of 40°C and humidity of 80%. 13. Salt spray No marked corrosion Exposed to density 5% salt water for 48 hours 8. Vibration No electrical discontinuity of 1µs or more No damage, cracks, or parts looseness. Frequency: 10 to 2000 Hz, single amplitude of 0.76 mm or acceleration of 147 m/s 2(peak), 4 hours in each of the 3 directions. 9. Shock No electrical discontinuity of 1µs or more No damage, cracks, or parts looseness. Acceleration of 490 m/s2, 11 ms duration, sine half-wave waveform, 6 cycles in each of the 3 axis 10. Humidity (Steady state) Insulation resistance: 100 M ohms min. Contact resistance: Amount of change 20 m ohms max. No damage, cracks, or parts looseness. 240 hours at temperature of -10ç to 65ç and humidity of 90% to 96% 11. Temperature cycle No damage, cracks, or parts looseness. Temperature: -65°C ¡ 20 to 35°C ¡ 125°C ¡ 20 to 35°C Time: 30 min ¡ Within 5 min ¡ 30 min. ¡ Within 5 min Cycles: 5 I Product Specifications I Materials Part Material Finish Body Beryllium copper/Brass Gold plating Female inner contact Beryllium copper Gold plating Male inner contact Phosphor bronze Gold plating Crimp sleeve Copper Nickel plating MRF01 – [ ] – [ ] qw e qSeries name : MRF01 wConnector types J : Jack R : Receptacle PR : Plug receptacle eApplicable cable or suffix RG-196B/U ( Ø 2) Network Analyzer Test Set Test Port Test Port Cable D.U.T Termination Note1: The cable connector is measured with double ended 10cm cable assembly. Note2: The printed circuit board connector is mounted on the 50 ohms PCB, to which Hirose's adaptor is connected. I Ordering Information Ratings Nominal characteristic impedance 50 ohms Voltage 150 V AC Rated Frequency DC to 3 GHz Operating temperature -20°C to +60°C Operating humidity 95% or less

(Coupling portion: MRF01 side plug - SMA side jack) G SMA conversion adapter (Coupling portion: MRF01 side jack - SMA side jack) CL No. Part Number 313-1102-7 MRF01-J-178 Ø3.8 (14.5) CL No. Part Number 313-1100-1 MRF01-PR-1 6.7 Ø3.0 4.7 0.3 3.2 CL No. Part Number 313-1101-4 MRF01-R-1 6.7 Ø3.0 4.7 0.3 3.2 CL No. Part Number 311-0289-1 MRF01P-HRMJ 13.8 6.5 9.53.5 8HEX 1/4-36UNS-2A CL No. Part Number 311-0290-0 MRF01J-HRMJ 13.8 9.53.5 6.5 8HEX 1/4-36UNS-2A

I Connector Mounting Condition The mounting reference diagram is an anticipated diagram of the condition of mounting to a frame offset 0.15 mm from the card center line. I PCB mounting pattern PCB (Ø3.2) (0.3) (Panel thickness) 0.3 (2.5)(1.4) (0.5) 5Max (1.7) (1) 0.5 3.2min1.8min 3.3 +0.1 5.5min (7) 0.7min Pad Copper foil portion (Resist layer beyond the pad) Corner escape portion (Ø 0.5 through hole)