MPY634_16 TI1 | Alldatasheet

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SBFS017A – DECEMBER 1995 – REVISED DECEMBER 2004 www.ti.com PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995-2004, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.

FEATURES

G WIDE BANDWIDTH: 10MHz typ G ±0.5% MAX FOUR-QUADRANT ACCURACY G INTERNAL WIDE-BANDWIDTH OP AMP G EASY TO USE G LOW COST

APPLICATIONS

G MODULATION AND DEMODULATION G VOLTAGE-CONTROLLED AMPLIFIERS G VIDEO SIGNAL PROCESSING G VOLTAGE-CONTROLLED FILTERS AND OSCILLATORS

DESCRIPTION

The MPY634 is a wide bandwidth, high accuracy, four- quadrant analog multiplier. Its accurately laser-trimmed multiplier characteristics make it easy to use in a wide variety of applications with a minimum of external parts, often eliminating all external trimming. Its differential X, Y, and Z inputs allow configuration as a multiplier, squarer, divider, square-rooter, and other functions while maintain- ing high accuracy. The wide bandwidth of this new design allows signal processing at IF, RF, and video frequencies. The internal output amplifier of the MPY634 reduces design complexity compared to other high frequency mul- tipliers and balanced modulator circuits. It is capable of performing frequency mixing, balanced modula- tion, and demodulation with excellent carrier rejection. An accurate internal voltage reference provides precise setting of the scale factor. The differential Z input allows user-selected scale factors from 0.1 to 10 using external feedback resistors. V-I V-I V-I SF Multiplier Core Voltage Reference and Bias

0.75 Atten

–VS +VS (X1 – X2)(Y1 – Y2) SF VOUT = A – (Z1 – Z2) Transfer Function Precision Output Op Amp Wide Bandwidth PRECISION ANALOG MULTIPLIER OBSOLETE

SBFS017Awww.ti.com SPECIFICATIONS ELECTRICAL At TA = +25°C and VS = ±15VDC, unless otherwise noted. MPY634KP/KU MPY634AM MPY634BM MPY634SM (Z2 – Z1) (X1 – X2)10V + Y1 10V + Z2 (X1 – X2)2 + Z210V 10V + Z2 (Z2 – Z1) (X1 – X2)10V + Y1 (X1 – X2)2 + Z210V OBSOLETE OBSOLETE OBSOLETE MODEL MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS MULTIPLIER PERFORMANCE Transfer Function ** Total Error (1) TA = min to max ±2.5 ±1.5 ±1.0 ±2.0 % Total Error vs Temperature ±0.03 ±0.022 ±0.015 ±0.02 %/ °C Scale Factor Error Temperature Coefficient of Scaling Voltage ±0.02 ±0.01 ±0.01 * %/ °C Supply Rejection (±15V ±1V) ±0.01 ±0.01 * * % Nonlinearity Feedthrough(3) X (Y Nulled, X = 20Vp-p, 50Hz) ±0.3 ±0.3 ±0.15 ±0.3 * % Y (X Nulled, Y = 20Vp-p, 50Hz) ±0.01 ±0.01 * ±0.1 * % Both Inputs (500kHz, 1Vrms) Unnulled 40 50 45 55 * 60 * * dB N u l l e d 5 5 6 05 5 6 56 0 7 0* * d B Output Offset Voltage ±50 ±100 ±5 ±30 * ±15 * * mV Output Offset Voltage Drift * ±200 ±100 * ±500 µV/°C DYNAMICS Small Signal BW, OUT = 0.1Vrms) 6 10 8 10 * * 6 * MHz 1% Amplitude Error (CLOAD = 1000pF) 100 100 * * kHz Slew Rate (VOUT = 20Vp-p) 20 20 * * V/ µs Settling Time (to 1%, ∆VOUT = 20V) 2 2 * * µs NOISE Noise Spectral Density: SF = 10V 0.8 0.8 * * µV/√Hz Wideband Noise: f = 10Hz to 5MHz 1 1 * * mVrms f = 10Hz to 10kHz 90 90 * * µVrms OUTPUT Output Voltage Swing ±11 ±11 * * V Output Impedance (f ≤ 1kHz) 0.1 0.1 * * Ω Output Short Circuit Current L = 0, TA = min to max) 30 30 * * mA Amplifier Open Loop Gain (f = 50Hz) 85 85 * * dB INPUT AMPLIFIERS (X, Y and Z) Input Voltage Range Differential VIN (VCM = 0) ±12 ±12 * * V Common-Mode V IN (VDIFF = 0) ±10 ±10 * * V (see Typical Performance Curves) Offset Voltage X, Y ±25 ±100 ±5 ±20 ±2 ±10 * * mV Offset Voltage Drift X, Y 200 100 50 * µV/°C Offset Voltage Z ±25 ±100 ±5 ±30 ±2 ±15 * * mV Offset Voltage Drift Z 200 200 100 500 µV/°C CMRR 60 80 60 80 70 90 * * dB Bias Current 0.8 2.0 0.8 2.0 * * * * µA Offset Current 0.1 0.1 * * 2.0 µA Differential Resistance 10 10 * * M Ω DIVIDER PERFORMANCE Transfer Function (X 1 > X2) Total Error(1) untrimmed SQUARE PERFORMANCE Transfer Function Total Error (–10V ≤ X ≤ 10V) ±1.2 ±0.6 ±0.3 * %

SBFS017A www.ti.com –VS SF SOIC: MPY634KUDIP: MPY634KPTO-100: MPY634AM/BM/SM 6 Z2 Out +VS X

1 Input

+VS NC Output Z S X +VS NC Output Z S NC SPECIFICATIONS (CONT ) ELECTRICAL At TA = +25°C and VS = ±15VDC, unless otherwise noted. MPY634KP/KU MPY634AM MPY634BM MPY634SM √10V (Z2 – Z1) +X2 * Specification same as for MPY634AM. Gray indicates obsolete parts. NOTES: (1) Figures given are percent of full scale, ±10V (i.e., 0.01% = 1mV). (2) May be reduced to 3V using external resistor between –V S and SF. (3) Irreducible component due to nonlinearity; excludes effect of offsets. PIN CONFIGURATIONS Basic Model Number Performance Grade(1) K: U: –40°C to +85°C Package Code P: Plastic 14-pin DIP U: 16-pin SOIC NOTE: (1) Performance grade identifier may not be marked on the SOIC package; a blank denotes “K” grade.

ORDERING INFORMATION

MPY634 ( ) ( ) Top View PACKAGE DRAWING PRODUCT PACKAGE NUMBER MPY634KP 14-Pin PDIP 010 MPY634KU 16-Pin SOIC 211 NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. PACKAGE INFORMATION (1) √10V (Z2 – Z1) +X2 OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE MODEL MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS SQUARE-ROOTER PERFORMANCE Transfer Function (Z 1 ≤ Z2) ** Total Error(1) (1V ≤ Z ≤ 10V) ±2.0 ±1.0 ±0.5 * % POWER SUPPLY Supply Voltage: Rated Performance ±15 ±15 * * VDC Supply Current, Quiescent 4 6 4 6 * * * * mA TEMPERATURE RANGE Specification –40 +85 –25 +85 * * –55 +125 °C ABSOLUTE MAXIMUM RATINGS PARAMETER MPY634AM/BM MPY634KP/KU MPY634SM Power Supply Voltage ±18 * ±20 Power Dissipation 500mW * * Output Short-Circuit to Ground Indefinite * * Input Voltage ( all X, Y and Z) ±V S ** Temperature Range: Operating –25°C/+85°C –40°C/+85°C –55°C/+125°C Storage –65°C/+150°C –40°C/+85°C* Lead Temperature (soldering, 10s) +300 °C* * SOIC ‘KU ’ Package +260 °C * Specification same as for MPY634AM/BM. NOTE: Gray indicates obsolete parts.

SBFS017Awww.ti.com TYPICAL PERFORMANCE CURVES At TA = +25°C, VS = ±15VDC, unless otherwise noted. –20 –40 –60 –80 –100 100 1k 10k 1M 10M 100M Frequency (Hz) FEEDTHROUGH vs FREQUENCY Feedthrough Attenuation (dB) 100k X Feedthrough Y Feedthrough –10 –20 –30 1k 10k 100k 1M 10M 100M Frequency (Hz) FREQUENCY RESPONSE AS A MULTIPLIER Output Response (dB) C L = 0pF C L = 1000pF Normal Connection With X10 Feedback Attenuator –50 –60 –70 –80 Temperature (°C) FEEDTHROUGH vs TEMPERATURE Feedthrough Attenuation (dB) –20 20 60 100 140–40 0 40 80 120 fY = 500kHz VX = nulled nulled at 25°C –60 10k 1M 10M Frequency (Hz) COMMON-MODE REJECTION RATIO vs FREQUENCY CMRR (dB) 100 100M Typical for all inputs 1.5 1.25 0.75 0.5 10 100 10k 100k Frequency (Hz) NOISE SPECTRAL DENSITY vs FREQUENCY Noise Spectral Density (µV/√Hz) –20 1k 10k 100k 1M 10M 100M Frequency (Hz) FREQUENCY RESPONSE AS A DIVIDER Output, V0/V2 (dB) VX = 100mVDC VZ = 10mVrms VX = 1VDC VZ = 100mVrms VX = 10VDC VZ = 100mVrms

SBFS017A www.ti.com TYPICAL PERFORMANCE CURVES (CONT) TA = +25°C, VS = ±15VDC, unless otherwise noted. THEORY OF OPERATION The transfer function for the MPY634 is: VOUT = A – (Z1 – Z2) where: A = open-loop gain of the output amplifier (typically 85dB at DC). SF = Scale Factor. Laser-trimmed to 10V but adjustable over a 3V to 10V range using external resistors. X, Y, Z are input voltages. Full-scale input voltage is equal to the selected SF. (Max input voltage = ±1.25 SF). An intuitive understanding of transfer function can be gained by analogy to the op amp. By assuming that the open-loop gain, A, of the output operational amplifier is infinite, 1 – X2) (Y1 – Y2) SF inspection of the transfer function reveals that any VOUT can be created with an infinitesimally small quantity within the brackets. Then, an application circuit can be analyzed by assigning circuit voltages for all X, Y and Z inputs and setting the bracketed quantity equal to zero. For example, the basic multiplier connection in Figure 1, Z 1 = VOUT and Z2 = 0. The quantity within the brackets then reduces to: – (VOUT – 0) = 0 This approach leads to a simple relationship which can be solved for VOUT to provide the closed-loop transfer function. The scale factor is accurately factory adjusted to 10V and is typically accurate to within 0.1% or less. The scale factor may be adjusted by connecting a resistor or potentiometer between pin SF and the –V S power supply. The value of the external resistor can be approximated by: SF 81 0 1 2 1 6 1 8 2 0 Positive or Negative Supply (V) INPUT/OUTPUT SIGNAL RANGE vs SUPPLY VOLTAGES Peak Positive or Negative Signal (V) Output, RL ≥ 2kΩ All inputs, SF = 10V –10 INPUT DIFFERENTIAL-MODE/ COMMON-MODE VOLTAGE –12 12 –55 1 0–10 Specified Accuracy VS = ±15V Functional Derated Accuracy VCM VDIFF 800 700 600 500 400 300 200 100 –20 0 60 100 140 Temperature (°C) BIAS CURRENTS vs TEMPERATURE (X,Y or Z Inputs) Bias Current (nA) 20–40 40 80 120 Scaling Voltage = 10V Scaling Voltage = 3V –60

www.ti.com 11-Apr-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples MPY634AM OBSOLETE TO-100 LME 10 TBD Call TI Call TI MPY634BM OBSOLETE TO-100 LME 10 TBD Call TI Call TI MPY634KP ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type MPY634KP MPY634KPG4 ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type MPY634KP MPY634KU ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U MPY634KU/1K ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U MPY634KU/1KE4 ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U MPY634KUE4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

www.ti.com 11-Apr-2015 Addendum-Page 2 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 9-Sep-2016 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MPY634KU/1K SOIC DW 16 1000 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 9-Sep-2016 Pack Materials-Page 2

MMBC006 – MARCH 2001 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LME (O–MBCY–W10) METAL CYLINDRICAL PACKAGE 4202488/A 03/01 0.335 (8,51) 0.370 (9,40) 0.335 (8,51) 0.305 (7,75) 0.185 (4,70) 0.165 (4,19) 0.500 (12,70) MIN 0.010 (0,25) 0.040 (1,02) 0.040 (1,02) 0.010 (0,25) 0.016 (0,41) 0.021 (0,53) 0.045 (1,14) 0.029 (0,74) 0.028 (0,71) 0.034 (0,86) 0.120 (3,05) 0.110 (2,79) ø ø ø ø Seating Plane 36° 10 9 4 5 0.230 (5,84) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Leads in true position within 0.010 (0,25) R @ MMC at seating plane. D. Pin numbers shown for reference only. Numbers may not be marked on package. E. Falls within JEDEC MO–006/TO-100.

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