MPY634AM

MPY634 TI | Alldatasheet

Document overview

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Technical content

SBFS017A – DECEMBER 1995 – REVISED DECEMBER 2004 www.ti.com PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995-2004, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.

FEATURES

G WIDE BANDWIDTH: 10MHz typ G ±0.5% MAX FOUR-QUADRANT ACCURACY G INTERNAL WIDE-BANDWIDTH OP AMP G EASY TO USE G LOW COST

APPLICATIONS

G MODULATION AND DEMODULATION G VOLTAGE-CONTROLLED AMPLIFIERS G VIDEO SIGNAL PROCESSING G VOLTAGE-CONTROLLED FILTERS AND OSCILLATORS

DESCRIPTION

The MPY634 is a wide bandwidth, high accuracy, four- quadrant analog multiplier. Its accurately laser-trimmed multiplier characteristics make it easy to use in a wide variety of applications with a minimum of external parts, often eliminating all external trimming. Its differential X, Y, and Z inputs allow configuration as a multiplier, squarer, divider, square-rooter, and other functions while maintain- ing high accuracy. The wide bandwidth of this new design allows signal processing at IF, RF, and video frequencies. The internal output amplifier of the MPY634 reduces design complexity compared to other high frequency mul- tipliers and balanced modulator circuits. It is capable of performing frequency mixing, balanced modula- tion, and demodulation with excellent carrier rejection. An accurate internal voltage reference provides precise setting of the scale factor. The differential Z input allows user-selected scale factors from 0.1 to 10 using external feedback resistors. V-I V-I V-I SF Multiplier Core Voltage Reference and Bias

0.75 Atten

–VS +VS (X1 – X2)(Y1 – Y2) SF VOUT = A – (Z1 – Z2) Transfer Function Precision Output Op Amp Wide Bandwidth PRECISION ANALOG MULTIPLIER OBSOLETE

SBFS017Awww.ti.com SPECIFICATIONS ELECTRICAL At TA = +25°C and VS = ±15VDC, unless otherwise noted. MPY634KP/KU MPY634AM MPY634BM MPY634SM (Z2 – Z1) (X1 – X2)10V + Y1 10V + Z2 (X1 – X2)2 + Z210V 10V + Z2 (Z2 – Z1) (X1 – X2)10V + Y1 (X1 – X2)2 + Z210V OBSOLETE OBSOLETE OBSOLETE MODEL MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS MULTIPLIER PERFORMANCE Transfer Function ** Total Error (1) TA = min to max ±2.5 ±1.5 ±1.0 ±2.0 % Total Error vs Temperature ±0.03 ±0.022 ±0.015 ±0.02 %/ °C Scale Factor Error Temperature Coefficient of Scaling Voltage ±0.02 ±0.01 ±0.01 * %/ °C Supply Rejection (±15V ±1V) ±0.01 ±0.01 * * % Nonlinearity Feedthrough(3) X (Y Nulled, X = 20Vp-p, 50Hz) ±0.3 ±0.3 ±0.15 ±0.3 * % Y (X Nulled, Y = 20Vp-p, 50Hz) ±0.01 ±0.01 * ±0.1 * % Both Inputs (500kHz, 1Vrms) Unnulled 40 50 45 55 * 60 * * dB N u l l e d 5 5 6 05 5 6 56 0 7 0* * d B Output Offset Voltage ±50 ±100 ±5 ±30 * ±15 * * mV Output Offset Voltage Drift * ±200 ±100 * ±500 µV/°C DYNAMICS Small Signal BW, OUT = 0.1Vrms) 6 10 8 10 * * 6 * MHz 1% Amplitude Error (CLOAD = 1000pF) 100 100 * * kHz Slew Rate (VOUT = 20Vp-p) 20 20 * * V/ µs Settling Time (to 1%, ∆VOUT = 20V) 2 2 * * µs NOISE Noise Spectral Density: SF = 10V 0.8 0.8 * * µV/√Hz Wideband Noise: f = 10Hz to 5MHz 1 1 * * mVrms f = 10Hz to 10kHz 90 90 * * µVrms OUTPUT Output Voltage Swing ±11 ±11 * * V Output Impedance (f ≤ 1kHz) 0.1 0.1 * * Ω Output Short Circuit Current L = 0, TA = min to max) 30 30 * * mA Amplifier Open Loop Gain (f = 50Hz) 85 85 * * dB INPUT AMPLIFIERS (X, Y and Z) Input Voltage Range Differential VIN (VCM = 0) ±12 ±12 * * V Common-Mode V IN (VDIFF = 0) ±10 ±10 * * V (see Typical Performance Curves) Offset Voltage X, Y ±25 ±100 ±5 ±20 ±2 ±10 * * mV Offset Voltage Drift X, Y 200 100 50 * µV/°C Offset Voltage Z ±25 ±100 ±5 ±30 ±2 ±15 * * mV Offset Voltage Drift Z 200 200 100 500 µV/°C CMRR 60 80 60 80 70 90 * * dB Bias Current 0.8 2.0 0.8 2.0 * * * * µA Offset Current 0.1 0.1 * * 2.0 µA Differential Resistance 10 10 * * M Ω DIVIDER PERFORMANCE Transfer Function (X 1 > X2) Total Error(1) untrimmed SQUARE PERFORMANCE Transfer Function Total Error (–10V ≤ X ≤ 10V) ±1.2 ±0.6 ±0.3 * %

SBFS017A www.ti.com –VS SF SOIC: MPY634KUDIP: MPY634KPTO-100: MPY634AM/BM/SM 6 Z2 Out +VS X

1 Input

+VS NC Output Z S X +VS NC Output Z S NC SPECIFICATIONS (CONT ) ELECTRICAL At TA = +25°C and VS = ±15VDC, unless otherwise noted. MPY634KP/KU MPY634AM MPY634BM MPY634SM √10V (Z2 – Z1) +X2 * Specification same as for MPY634AM. Gray indicates obsolete parts. NOTES: (1) Figures given are percent of full scale, ±10V (i.e., 0.01% = 1mV). (2) May be reduced to 3V using external resistor between –V S and SF. (3) Irreducible component due to nonlinearity; excludes effect of offsets. PIN CONFIGURATIONS Basic Model Number Performance Grade(1) K: U: –40°C to +85°C Package Code P: Plastic 14-pin DIP U: 16-pin SOIC NOTE: (1) Performance grade identifier may not be marked on the SOIC package; a blank denotes “K” grade.

ORDERING INFORMATION

MPY634 ( ) ( ) Top View PACKAGE DRAWING PRODUCT PACKAGE NUMBER MPY634KP 14-Pin PDIP 010 MPY634KU 16-Pin SOIC 211 NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. PACKAGE INFORMATION (1) √10V (Z2 – Z1) +X2 OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE OBSOLETE MODEL MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS SQUARE-ROOTER PERFORMANCE Transfer Function (Z 1 ≤ Z2) ** Total Error(1) (1V ≤ Z ≤ 10V) ±2.0 ±1.0 ±0.5 * % POWER SUPPLY Supply Voltage: Rated Performance ±15 ±15 * * VDC Supply Current, Quiescent 4 6 4 6 * * * * mA TEMPERATURE RANGE Specification –40 +85 –25 +85 * * –55 +125 °C ABSOLUTE MAXIMUM RATINGS PARAMETER MPY634AM/BM MPY634KP/KU MPY634SM Power Supply Voltage ±18 * ±20 Power Dissipation 500mW * * Output Short-Circuit to Ground Indefinite * * Input Voltage ( all X, Y and Z) ±V S ** Temperature Range: Operating –25°C/+85°C –40°C/+85°C –55°C/+125°C Storage –65°C/+150°C –40°C/+85°C* Lead Temperature (soldering, 10s) +300 °C* * SOIC ‘KU ’ Package +260 °C * Specification same as for MPY634AM/BM. NOTE: Gray indicates obsolete parts.

SBFS017Awww.ti.com TYPICAL PERFORMANCE CURVES At TA = +25°C, VS = ±15VDC, unless otherwise noted. –20 –40 –60 –80 –100 100 1k 10k 1M 10M 100M Frequency (Hz) FEEDTHROUGH vs FREQUENCY Feedthrough Attenuation (dB) 100k X Feedthrough Y Feedthrough –10 –20 –30 1k 10k 100k 1M 10M 100M Frequency (Hz) FREQUENCY RESPONSE AS A MULTIPLIER Output Response (dB) C L = 0pF C L = 1000pF Normal Connection With X10 Feedback Attenuator –50 –60 –70 –80 Temperature (°C) FEEDTHROUGH vs TEMPERATURE Feedthrough Attenuation (dB) –20 20 60 100 140–40 0 40 80 120 fY = 500kHz VX = nulled nulled at 25°C –60 10k 1M 10M Frequency (Hz) COMMON-MODE REJECTION RATIO vs FREQUENCY CMRR (dB) 100 100M Typical for all inputs 1.5 1.25 0.75 0.5 10 100 10k 100k Frequency (Hz) NOISE SPECTRAL DENSITY vs FREQUENCY Noise Spectral Density (µV/√Hz) –20 1k 10k 100k 1M 10M 100M Frequency (Hz) FREQUENCY RESPONSE AS A DIVIDER Output, V0/V2 (dB) VX = 100mVDC VZ = 10mVrms VX = 1VDC VZ = 100mVrms VX = 10VDC VZ = 100mVrms

SBFS017A www.ti.com TYPICAL PERFORMANCE CURVES (CONT) TA = +25°C, VS = ±15VDC, unless otherwise noted. THEORY OF OPERATION The transfer function for the MPY634 is: VOUT = A – (Z1 – Z2) where: A = open-loop gain of the output amplifier (typically 85dB at DC). SF = Scale Factor. Laser-trimmed to 10V but adjustable over a 3V to 10V range using external resistors. X, Y, Z are input voltages. Full-scale input voltage is equal to the selected SF. (Max input voltage = ±1.25 SF). An intuitive understanding of transfer function can be gained by analogy to the op amp. By assuming that the open-loop gain, A, of the output operational amplifier is infinite, 1 – X2) (Y1 – Y2) SF inspection of the transfer function reveals that any VOUT can be created with an infinitesimally small quantity within the brackets. Then, an application circuit can be analyzed by assigning circuit voltages for all X, Y and Z inputs and setting the bracketed quantity equal to zero. For example, the basic multiplier connection in Figure 1, Z 1 = VOUT and Z2 = 0. The quantity within the brackets then reduces to: – (VOUT – 0) = 0 This approach leads to a simple relationship which can be solved for VOUT to provide the closed-loop transfer function. The scale factor is accurately factory adjusted to 10V and is typically accurate to within 0.1% or less. The scale factor may be adjusted by connecting a resistor or potentiometer between pin SF and the –V S power supply. The value of the external resistor can be approximated by: SF 81 0 1 2 1 6 1 8 2 0 Positive or Negative Supply (V) INPUT/OUTPUT SIGNAL RANGE vs SUPPLY VOLTAGES Peak Positive or Negative Signal (V) Output, RL ≥ 2kΩ All inputs, SF = 10V –10 INPUT DIFFERENTIAL-MODE/ COMMON-MODE VOLTAGE –12 12 –55 1 0–10 Specified Accuracy VS = ±15V Functional Derated Accuracy VCM VDIFF 800 700 600 500 400 300 200 100 –20 0 60 100 140 Temperature (°C) BIAS CURRENTS vs TEMPERATURE (X,Y or Z Inputs) Bias Current (nA) 20–40 40 80 120 Scaling Voltage = 10V Scaling Voltage = 3V –60

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) MPY634KP Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type - MPY634KP MPY634KP.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 MPY634KP MPY634KU Active Production SOIC (DW) | 16 40 | TUBE Yes NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U MPY634KU.A Active Production SOIC (DW) | 16 40 | TUBE Yes NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U MPY634KU/1K Active Production SOIC (DW) | 16 1000 | LARGE T&R Yes NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U MPY634KU/1K.A Active Production SOIC (DW) | 16 1000 | LARGE T&R Yes NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U MPY634KU/1KE4 Active Production SOIC (DW) | 16 1000 | LARGE T&R Yes NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U MPY634KUE4 Active Production SOIC (DW) | 16 40 | TUBE Yes NIPDAU-DCC Level-3-260C-168 HR -40 to 85 MPY634U (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

www.ti.com 23-May-2025 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MPY634KU/1K SOIC DW 16 1000 356.0 356.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) MPY634KP N PDIP 14 25 506 13.97 11230 4.32 MPY634KP.A N PDIP 14 25 506 13.97 11230 4.32 MPY634KU DW SOIC 16 40 507 12.83 5080 6.6 MPY634KU.A DW SOIC 16 40 507 12.83 5080 6.6 MPY634KUE4 DW SOIC 16 40 507 12.83 5080 6.6 Pack Materials-Page 3

www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. SOIC - 2.65 mm max heightDW 16 SMALL OUTLINE INTEGRATED CIRCUIT7.5 x 10.3, 1.27 mm pitch 4224780/A

www.ti.com PACKAGE OUTLINE C TYP10.63 9.97

2.65 MAX

14X 1.27 16X 0.51 0.31 8.89 TYP0.33 0.10 0 - 8 0.3 0.1 (1.4) 0.25 GAGE PLANE 1.27 0.40 A NOTE 3 10.5 10.1 B NOTE 4 7.6 7.4 4220721/A 07/2016 SOIC - 2.65 mm max heightDW0016A SOIC NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. 5. Reference JEDEC registration MS-013. 1 16

0.25 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.500

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

(9.3) 14X (1.27) R0.05 TYP 16X (2) 16X (0.6) 4220721/A 07/2016 SOIC - 2.65 mm max heightDW0016A SOIC NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS OPENING SOLDER MASK METAL SOLDER MASK DEFINED LAND PATTERN EXAMPLE SCALE:7X SYMM 8 9 SEE DETAILS SYMM

www.ti.com EXAMPLE STENCIL DESIGN R0.05 TYP 16X (2) 16X (0.6) 14X (1.27) (9.3) 4220721/A 07/2016 SOIC - 2.65 mm max heightDW0016A SOIC NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:7X SYMM SYMM 8 9

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