MPX5010 FREESCALE | Alldatasheet
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Features
5.0% Maximum Error over 0 ° to 85°C Ideally Suited for Mi croprocessor or Microcontroller-Based Systems Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package Temperature Compensated over 40 ° to +125°C Patented Silicon Shear Stress Strain Gauge Available in Differential and Gauge Configurations Available in Surface Mount (SMT) or Through-hole (DIP) Configurations Application Examples Hospital Beds H V A C Respiratory Systems Process Control
ORDERING INFORMATION
No. MPX Series Order No. Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV5010G SERIES) Basic Elements Gauge, Element Only, SMT 482 MPXV5010G6U Rails MPXV5010G Gauge, Element Only, DIP 482B MPXV5010G7U Rails MPXV5010G Ported Elements Gauge, Axial Port, SMT 482A MPXV5010GC6U Rails MPXV5010G Gauge, Axial Port, DIP 482C MPXV5010GC7U Rails MPXV5010G Gauge, Axial Port, SMT 482A MPXV5010GC6T1 Tape & Reel MPXV5010G Gauge, Side Port, SMT 1369 MPXV5010GP Trays MPXV5010G Gauge, Dual Port, SMT 1351 MPXV5010DP Trays MPXV5010G UNIBODY PACKAGE (MPX2202 SERIES) Basic Element Differential 867 MPX5010D MPXV5010D Ported Elements Differential, Gauge 867C MPX5010DP MPXV5010DP Gauge 867B MPX5010GP MPXV5010GP Gauge, Axial 867E MPX5010GS MPXV5010D Gauge, Axial PC Mount 867F MPX5010GSX MPXV5010D MPX5010 MPXV5010G SERIES INTEGRATED PRESSURE SENSOR 0 to 10 kPa (0 to 1.45 psi) 0.2 to 4.7 V OUTPUT UNIBODY PACKAGE PIN NUMBERS(1) 1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
1 Vout 4 N/C
2 Gnd 5 N/C
3 VS 6 N/C
PIN NUMBERS(1) 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
1 N/C 5 N/C
2 VS 6 N/C
3 Gnd 7 N/C
4 Vout 8 N/C
J SMALL OUTLINE PACKAGE UNIBODY PACKAGES MPX5010GSX CASE 867F-03 MPX5010GP CASE 867B-04 MPX5010DP CASE 867C-05 MPX5010D CASE 867-08 MPX5010GS CASE 867E-03
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Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
- Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
- 1.0 kPa (kiloPascal) equals 0.145 psi.
- Device is ratiometric within this specified excitation range.
- Offset (V off) is defined as the output voltage at the minimum rated pressure.
- Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
- Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
- Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relati onship with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C. Variation from Nominal: T he variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
- Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
- Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
- Offset Stability is the product's output deviation when subjec ted to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. Mechanical Characteristics
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onto a single monolithic chip. power supply is recommended. output will saturate outside of the specified pressure range. Figure 2. Cross-Sectional Diagram SOP Figure 3. Recommended Power Supply Decoupling Figure 4. Output versus Pressure Differential
Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04) ± (Pressure Error x Temp. Factor x 0.09 x VS) VS = 5.0 V ± 0.25 Vdc Transfer Function (MPX5010, MPXV5010G) MPX5010, MPXV5010G SERIES Temp Multiplier 40 3 0 to 85 1 +125 3 Temperature in °C 4.0 3.0 2.0 0.0 1.0 40 20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0° to 40°C and from 85° to 125°C. Temperature Error Band Pressure Error (Max) Pressure Error Band 0 to 10 (kPa) ±0.5 (kPa) Pressure (kPa) 0.5 0.4 0.2 0.3 0.4 0.5 0 123456 7 890 0.3 0.1 0.2 0.1 Pressure Error (kPa)
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shorting between solder pads. Figure 5. SOP Footprint (Case 482)
0.060 TYP 8X
0.100 TYP 8X
S D 8 PL G SBM0.25 (0.010) A ST -A- -B- N C M J K PIN 1 IDENTIFIER H SEATING PLANE -T- DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE PIN 1 IDENTIFIER H SEATING PLANE -T- W C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT .S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor 7
0.100 BSC 2.54 BSC DIM A B C D G J K M N S MIN 0.415 0.415 0.210 0.026 0.009 0.100 0.405 0.540 MAX 0.425 0.425 0.220 0.034 0.011 0.120 15˚ 0.415 0.560 MIN 10.54 10.54 5.33 0.66 0.23 2.54 10.29 13.72 MAX 10.79 10.79 5.59 0.864 0.28 3.05 15˚ 10.54 14.22 PIN 1 IDENTIFIER K SEATING PLANE-T- DETAIL X S G -A- -B- C M J N D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D G J K M N S V W MIN 0.415 0.415 0.500 0.026 0.009 0.100 0.444 0.540 0.245 0.115 MAX 0.425 0.425 0.520 0.034 0.011 0.120 15˚ 0.448 0.560 0.255 0.125 MIN 10.54 10.54 12.70 0.66 0.23 2.54 11.28 13.72 6.22 2.92 MAX 10.79 10.79 13.21 0.864 0.28 3.05 15˚ 11.38 14.22 6.48 3.17 PIN 1 IDENTIFIER K SEATING PLANE-T- W DETAIL X S G -A- -B-N C V M J D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors
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F G N L R 123456
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MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). CASE 867-08 ISSUE N UNIBODY PACKAGE
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Freescale Semiconductor 11 CASE 867B-04 ISSUE G UNIBODY PACKAGE PAGE 2 OF 2
NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH.R X 123 456 PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) PORT #1 POSITIVE PRESSURE (P1) PIN 1 PORT #2 VACUUM (P2) SEATING PLANESEATING PLANE -T- -T- P G C J N B F D 6 PL W V L U S K -Q- -A-MQM0.25 (0.010) T MAM0.13 (0.005) STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 0.220 0.240 5.59 6.10 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES
0.100 BSC
2.54 BSC
A B C D E F G J K N S V MIN 0.690 0.245 0.780 0.027 0.178 0.048 0.014 0.345 0.300 0.220 0.182 MAX 0.255 0.820 0.033 0.186 0.064 0.016 0.375 0.310 0.240 0.720 0.194 MIN 17.53 6.22 19.81 0.69 4.52 1.22 0.36 8.76 7.62 5.59 4.62 MAX 18.28 6.48 20.82 0.84 4.72 1.63 0.41 9.53 7.87 6.10 4.93 STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX A 654321 C K N E -B- PORT #1 POSITIVE PRESSURE (P1) J -T- S G F D 6 PL PIN 1 MBM0.13 (0.005) T V CASE 867C-05 ISSUE F UNIBODY PACKAGE CASE 867E-03 ISSUE D UNIBODY PACKAGE MPX5010 Sensors
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Freescale Semiconductor 13 PACKAGE DIMENSIONS C E V J PORT #1 POSITIVE PRESSURE (P1) -T- -P- MQM0.25 (0.010) T D 6 PL F G K PIN 1 U A B R S N -Q- SPM0.13 (0.005) Q ST 65 4321 STYLE 1: PIN 1. VOUT 2. GROUND 3. V CC 4. V1 5. V2 6. V EX MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D E F G J K N P Q R S U V MIN 1.080 0.740 0.630 0.027 0.160 0.048 0.014 0.070 0.150 0.150 0.440 0.695 0.840 0.182 0.220 MAX 1.120 0.760 0.650 0.033 0.180 0.064 0.016 0.080 0.160 0.160 0.460 0.725 0.860 0.194 0.240 MIN 27.43 18.80 16.00 0.68 4.06 1.22 0.36 1.78 3.81 3.81 11.18 17.65 21.34 4.62 5.59 MAX 28.45 19.30 16.51 0.84 4.57 1.63 0.41 2.03 4.06 4.06 11.68 18.42 21.84 4.93 6.10 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. CASE 867F-03 ISSUE D UNIBODY PACKAGE
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Freescale Semiconductor 15 PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 2 OF 2
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Freescale Semiconductor 17 PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 2 OF 2
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