MPXV5004G FREESCALE | Alldatasheet
Document overview
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Technical content
Features
Temperature Compensated over 10 ° to 60°C Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations Durable Thermopl astic (PPS) Package Typical Applications Washing Machine Water Level Ideally Suited for Mi croprocessor or Microcontroller-Based Systems ORDERING INFORMATION(1) 1. MPXV5004G series pressure sensors are av ailable in the basic element package or with a pressure port. Two packing options are offered for the surface mount configuration. Device Type Case No. MPXV Series Order No. Packing Options Device Marking Through- Hole 482B MPXV5004G7U Rails MPXV5004G 482C MPXV5004GC7U Rails MPXV5004G Surface Mount
482 MPXV5004G6U Rails MPXV5004G
482 MPXV5004G6T1 Tape & Reel MPXV5004G
482A MPXV5004GC6U Rails MPXV5004G 482A MPXV5004GC6T1 Tape & Reel MPXV5004G
1351 MPXV5004DP Trays MPXV5004G
1368 MPXV5004GVP Trays MPXV5004G
1369 MPXV5004GP Trays MPXV5004G
J MPXV5004G SERIES PIN NUMBERS(1) 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
1 N/C 5 N/C
2 VS 6 N/C
3 GND 7 N/C
4 VOUT 8 N/C
0 TO 3.92 kPA (0 TO 400 mm H2O) 1.0 TO 4.9 V OUTPUT SMALL OUTLINE PACKAGES MPXV5004GC7U CASE 482C-03 MPXV5004G7U CASE 482B-03 THROUGH-HOLE SMALL OUTLINE PACKAGES MPXV5004GVP CASE 1368-01 MPXV5004GP CASE 1369-01 MPXV5004GC6U CASE 482A-01 MPXV5004DP CASE 1351-01 MPXV5004G6U CASE 482-01 SURFACE MOUNT
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Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
- Exposure beyond the specified limits may c ause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
- Device is ratiometric within this specified excitation range.
- Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
- Offset (V off) is defined as the output voltage at the minimum rated pressure.
- Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relations hip with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 10 to 60 °C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60 °C, relative to 25°C. Variation from Nominal: The variation from nominal val ues, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
- Auto Zero at Factory Installation: Due to the sensitivity of the MPXV5004G, external mechanical stresses and mounting position can affect
change of ± 5°C between autozero and measurement. for small outline package device.
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operate with positive differential pressure applied, P1 > P2. shorting between solder pads. Figure 5. SOP Footprint (Case 482)
0.060 TYP 8X
0.100 TYP 8X
S D 8 PL G SBM0.25 (0.010) A ST -A- -B- N C M J K PIN 1 IDENTIFIER H SEATING PLANE -T- DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT PIN 1 IDENTIFIER H SEATING PLANE -T- W C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT .S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT
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0.100 BSC 2.54 BSC DIM A B C D G J K M N S MIN 0.415 0.415 0.210 0.026 0.009 0.100 0.405 0.540 MAX 0.425 0.425 0.220 0.034 0.011 0.120 15˚ 0.415 0.560 MIN 10.54 10.54 5.33 0.66 0.23 2.54 10.29 13.72 MAX 10.79 10.79 5.59 0.864 0.28 3.05 15˚ 10.54 14.22 PIN 1 IDENTIFIER K SEATING PLANE-T- DETAIL X S G -A- -B- C M J N D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D G J K M N S V W MIN 0.415 0.415 0.500 0.026 0.009 0.100 0.444 0.540 0.245 0.115 MAX 0.425 0.425 0.520 0.034 0.011 0.120 15˚ 0.448 0.560 0.255 0.125 MIN 10.54 10.54 12.70 0.66 0.23 2.54 11.28 13.72 6.22 2.92 MAX 10.79 10.79 13.21 0.864 0.28 3.05 15˚ 11.38 14.22 6.48 3.17 PIN 1 IDENTIFIER K SEATING PLANE-T- W DETAIL X S G -A- -B-N C V M J D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE
NOTES: CONTROLLING DIMENSION: INCH. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. N A C 0.004 (0.1) DETAIL G SEATING PLANE P D E e/2 e AM0.004 (0.1) B C A B A0.006 (0.15) BC 8X b
2 PLACES 4 TIPS
F MIN MAX MIN MAX MILLIMETERSINCHES 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0.100 BSC 2.54 BSC 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0˚ 7˚ 0˚ 7˚ DIM A b D E e M N P T F K L θ K M GAGE PLANE DETAIL G L A1 θ.014 (0.35) STYLE 1: PIN 1. GND 2. +Vout 3. Vs 4. -Vout 5. N/C 6. N/C 7. N/C 8. N/C STYLE 2: PIN 1. N/C 2. Vs 3. GND 4. Vout 5. N/C 6. N/C 7. N/C 8. N/C
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N A C 0.004 (0.1) DETAIL G SEATING PLANE P D E e/2 e AM0.004 (0.1) B C A B A0.006 (0.15) BC 8X b F NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. INCHES
0.100 BSC
A b D E e M N P R F K L θ T MIN 0.280 0.002 0.038 0.465 0.465 0.035 0.075 0.009 0.405 0.240 0.115 0.040 0.110 MAX 0.300 0.010 0.042 0.485 0.485 0.055 0.095 0.011 0.415 0.260 0.135 0.060 0.130 MIN 7.11 0.05 0.96 11.81 11.81 1.90 0.89 0.23 10.28 6.10 2.92 1.02 2.79 MAX 7.62 0.25 1.07 12.32 12.32 2.41 1.39 0.28 10.54 6.60 3.43 1.52 3.30
0.690 BSC
2.54 BSC
17.52 BSC
K M GAGE PLANE DETAIL G L A1 θ.014 (0.35) STYLE 1: PIN 1. GND 2. +Vout 3. Vs 4. -Vout 5. N/C 6. N/C 7. N/C 8. N/C STYLE 2: PIN 1. N/C 2. Vs 3. GND 4. Vout 5. N/C 6. N/C 7. N/C 8. N/C
NOTES: CONTROLLING DIMENSION: INCH. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. N A C 0.004 (0.1) DETAIL G SEATING PLANE P D E e/2 e AM0.004 (0.1) B C A B A0.008 (0.20) BC 8X b F DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.300 0.330 7.11 7.62 A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E E1 0.465 0.485 11.81 12.32 e M 0.270 0.290 6.86 7.36 N 0.080 0.090 2.03 2.28 P 0.009 0.011 0.23 0.28 T 0.115 0.125 2.92 3.17 0.100 BSC 2.54 BSC F 0.245 0.255 6.22 6.47 K 0.120 0.130 3.05 3.30 L 0.061 0.071 1.55 1.80 0˚ 7˚ 0˚ 7˚θ 0.717 BSC 18.21 BSC K M GAGE PLANE DETAIL G L A1θ.014 (0.35) CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT
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Freescale Semiconductor 11 MPXV5004G NOTES
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