MPXV4006 FREESCALE | Alldatasheet
Document overview
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- PDF pages: 22
Technical content
Features
- 2.5% Maximum Error over +10 °C to +60°C with Auto Zero
- 5% Maximum Error over +10 °C to +60°C without Auto Zero
- Durable Thermopl astic (PPS) Package
- Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations
- Available with Standard Fluorosilicone Gel or Media Resistant Gel
ORDERING INFORMATION
No. # of Ports Pressure Type Option Device MarkingNone Single Dual Gauge Differential Absolute Surface Mount Through- Hole Small Outline Package (Media Resistant Gel) (MPVZ4006 Series) MPVZ4006GW6U Rail 1735 • • • MZ4006GW MPVZ4006GW7U Rail 1560 • • • MZ4006GW MPVZ4006G6U Rail 482 • • • MPVZ4006G MPVZ4006G6T1 Tape and Reel 482 • • • MPVZ4006G MPVZ4006G7U Rail 482B • • • MPVZ4006G Small Outline Package (MPXV4006 Series) MPXV4006GC6U Rail 482A • • • MPXV4006G MPXV4006GC6T1 Tape and Reel 482A • • • MPXV4006G MPXV4006GC7U Rail 482C • • • MPXV4006G MPXV4006GP Tray 1369 • • • MPXV4006GP MPXV4006DP Tray 1351 • • • MPXV4006DP MPXV4006 0 to 6 kPa (0 to 0.87 psi) 0.2 to 4.8 V Output Integrated Pressure Sensor Series Application Examples
- Washing Machine Water Level Measurement (Reference AN1950)
- Ideally Suited for Microprocessor or Microcontroller-Based Systems
- Appliance Liquid Level and Pressure Measurement
- Respiratory Equipment
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SMALL OUTLINE PACKAGE SURFACE MOUNT SMALL OUTLINE PACKAGE THROUGH-HOLE MPVZ4006GW6U CASE 1735-01 MPVZ4006G6U/T1 CASE 482-01 J MPVZ4006G7U CASE 482B-03 MPVZ4006GW7U CASE 1560-02 MPXV4006GC6U/C6T1 CASE 482A-01 MPXV4006GC7U CASE 482C-03 MPXV4006DP CASE 1351-01 MPXV4006GP CASE 1369-01
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
- Device is ratiometric within this specified excitation range.
- Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
- Offset (V off) is defined as the output voltage at the minimum rated pressure.
- Accuracy (error budget) c onsists of the following:
Linearity: Output deviation from a straight line relations hip with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. or maximum rated pressure, at 25°C. minimum rated pressure applied. TcSpan: Output deviation over the temperature range of 10 ° to 60°C, relative to 25°C. TcOffset: Output deviation with minimum pressu re applied, over the temperature range of 10° to 60°C, relative to 25°C.
- Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006, external mechanical stresses and mounting position can affect the
accuracy assumes a maximum temperature change of ±5°C between autozero and measurement.
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Figure 1. Fully Integrated Pressure Sensor Schematic Table 2. Maximum Ratings(1)
- Exposure beyond the specified limits may cause permanent damage or degradation to the device.
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shorting between solder pads. Figure 6. SOP Footprint (Case 482) Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table
0.060 TYP 8X
0.100 TYP 8X
0.100 TYP
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Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS S D 8 PL G SBM0.25 (0.010) A ST -A- -B- N C M J K PIN 1 IDENTIFIER H SEATING PLANE -T- DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D G J K M N S MIN 0.415 0.415 0.210 0.026 0.009 0.100 0.405 0.540 MAX 0.425 0.425 0.220 0.034 0.011 0.120 15˚ 0.415 0.560 MIN 10.54 10.54 5.33 0.66 0.23 2.54 10.29 13.72 MAX 10.79 10.79 5.59 0.864 0.28 3.05 15˚ 10.54 14.22 PIN 1 IDENTIFIER K SEATING PLANE-T- DETAIL X S G -A- -B- C M J N D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE
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A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. /C0095/C0095 /C0095/C0095 S D G 8 PL SBM0.25 (0.010) A ST –A– –B– C M J K PIN 1 IDENTIFIER H SEATING PLANE –T– N V W V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE
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Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE
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Freescale Semiconductor 17 Pressure PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE
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Freescale Semiconductor 19 Pressure PACKAGE DIMENSIONS DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.660.0340.026 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 M 0 15 0 15 N 0.444 0.448 11.28 11.38 S 0.540 0.560 13.72 14.22 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. /C0095/C0095 /C0095/C0095PIN 1 K SEATING PLANE–T– S G –A– –B– C N V W M J V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 IDENTIFIER D 8 PL SBM0.25 (0.010) A ST DETAIL X DETAIL X CASE 482C-03 ISSUE A SMALL OUTLINE PACKAGE
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NOTES: CONTROLLING DIMENSION: INCH. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. N A C 0.004 (0.1) DETAIL G SEATING PLANE P D E e/2 e AM0.004 (0.1) B C A B A0.006 (0.15) BC 8X b
2 PLACES 4 TIPS
F MIN MAX MIN MAX MILLIMETERSINCHES 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0.100 BSC 2.54 BSC 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0˚ 7˚ 0˚ 7˚ DIM A b D E e M N P T F K L θ K M GAGE PLANE DETAIL G L A1 θ.014 (0.35) STYLE 1: PIN 1. GND 2. +Vout 3. Vs 4. -Vout 5. N/C 6. N/C 7. N/C 8. N/C STYLE 2: PIN 1. N/C 2. Vs 3. GND 4. Vout 5. N/C 6. N/C 7. N/C 8. N/C CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE
Freescale Semiconductor 21 Pressure PACKAGE DIMENSIONS NOTES: CONTROLLING DIMENSION: INCH. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. N A C 0.004 (0.1) DETAIL G SEATING PLANE P D E e/2 e AM0.004 (0.1) B C A B A0.008 (0.20) BC 8X b F DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.300 0.330 7.11 7.62 A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E E1 0.465 0.485 11.81 12.32 e M 0.270 0.290 6.86 7.36 N 0.080 0.090 2.03 2.28 P 0.009 0.011 0.23 0.28 T 0.115 0.125 2.92 3.17 0.100 BSC 2.54 BSC F 0.245 0.255 6.22 6.47 K 0.120 0.130 3.05 3.30 L 0.061 0.071 1.55 1.80 0˚ 7˚ 0˚ 7˚θ 0.717 BSC 18.21 BSC K M GAGE PLANE DETAIL G L A1θ.014 (0.35) CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE
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