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Technical content

Features

  • Temperature Compensated Over 0 C to +85C
  • Easy-to-Use Chip Carrier Package Options
  • Available in Absolute, Differential and Gauge Configurations
  • Ratiometric to Supply Voltage
  • Available in Easy-to-Use Tape and Reel

ORDERING INFORMATION

No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Unibody Package (MPX2202 Series) MPX2202A 344 • • MPX2202A MPX2202DP 344C • • MPX2202DP MPX2202AP 344B • • MPX2202AP MPX2202GP 344B • • MPX2202GP MPX2202ASX 344F • • MPX2202A Small Outline Package (MPXV2202 Series) MPXV2202GP 1369 • • MPXV2202GP MPXV2202DP 1351 • • MPXV2202DP MPXV2202GC6TI 482A • • MPXV2202G MPXM2202D 1320 • • MPXM2202D MPXM2202DT1 1320 • • MPXM2202D MPXM2202A 1320 • • MPXM2202A MPXM2202GS 1320A • • MPXM2202GS MPXM2202GST1 1320A • • MPXM2202GS MPXM2202AS 1320A • • MPXM2202AS MPX2202 Series 0 to 200 kPa (0 to 29 psi) 40 mV Full Scale (Typical) Application Examples

  • Pump/Motor Controllers
  • Robotics
  • Level Indicators
  • Medical Diagnostics
  • Pressure Switching
  • Barometers
  • Altimeters

2 Freescale Semiconductor, Inc. Pressure MPX2202AP/GP CASE 344B-01 MPX2202DP CASE 344C-01 UNIBODY PACKAGES MPX2202A CASE 344-15 SMALL OUTLINE PACKAGES MPXV2202GP CASE 1369-01 MPX2202ASX CASE 344F-01 MPXM2202A CASE 1320-02 MPXM2202GS/AS CASE 1320A-02 MPAK MPXV2202DP CASE 1351-01 MPXV2202GC6T1 CASE 482A-01

Table 1. Operating Characteristics

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional

error due to device self-heating.

  1. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  2. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  3. Accuracy (error budget) c onsists of the following:

Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. from the minimum or maximum operating temperature points, with zero differential pressure applied. maximum rated pressure, at 25C. TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C.

  1. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Offset stability is the product's output deviation when subjec ted to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

6 Freescale Semiconductor, Inc. differential pressure applied, P1 > P2. Table 3. Pressure (P1) Side Delineation

Freescale Semiconductor, Inc. 7 Pressure PACKAGE DIMENSIONS CASE 482A–01 ISSUE A DATE 05/13/98 DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S D G 8 PL SBM0.25 (0.010) A ST –A– –B– C M J K PIN 1 IDENTIFIER H SEATING PLANE –T– N V W V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17

8 Freescale Semiconductor, Inc. Pressure NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). MAM0.136 (0.005) T 1234PIN 1 R N L G F D 4 PL SEATING PLANE -T- C M J B -A- DAMBAR TRIM ZONE: F THIS IS INCLUDED WITHIN DIM. "F" 8 PL 1 23 4 Y Z STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT STYLE 2: PIN 1. VCC 2. - SUPPL Y 3. + SUPPL Y 4. GROUND STYLE 3: PIN 1. GND 2. -VOUT 3. VS 4. +VOUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 Y 0.048 0.052 1.22 1.32 Z 0.106 0.118 2.68 3.00 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. D 4 PL F U H L PORT #1 POSITIVE PRESSURE (P1) PIN 1 -A- -Q- S K G -P- SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 SEATING PLANE B N R C J -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10 CASE 344-15 ISSUE AA UNIBODY PACKAGE CASE 344B-01 ISSUE B UNIBODY PACKAGE PACKAGE DIMENSIONS

Freescale Semiconductor, Inc. 9 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. PORT #2 PORT #1 PORT #2 VACUUM (P2) (P1) SEATING PLANE SEATING PLANE K S W H L U F G D 4 PL PORT #1 POSITIVE PRESSURE -Q- 12 4 3PIN 1 -P- SSM0.13 (0.005) Q ST B N J C V R -A- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 W 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10 CASE 344C-01 ISSUE B UNIBODY PACKAGE NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. D 4 PL F U L HPORT #2 VACUUM (P2) POSITIVE PRESSURE (P1) PIN 1 -A- -Q- S K G-P- SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 SEATING PLANE B N R C J -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.158 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10 CASE 344D-01 ISSUE B UNIBODY PACKAGE Pressure

10 Freescale Semiconductor, Inc. Pressure PAGE 1 OF 2 PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE

Freescale Semiconductor, Inc. 11 Pressure CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 2 OF 2

12 Freescale Semiconductor, Inc. Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE

Freescale Semiconductor, Inc. 13 Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PACKAGE DIMENSIONS

14 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK

Freescale Semiconductor, Inc. 15 Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK

16 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK

Freescale Semiconductor, Inc. 17 Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK

Freescale Semiconductor, Inc. 18 Pressure

REVISION HISTORY

date Description of changes 7 01/2012 • In Table 1. Operating Char acteristics, in the Characteristic column under Pressure Range, added rows for Absolute Pressure Range MPX2202A and Differential Pressure Range MPX2202D devices 8 10/2012  Deleted references to device nu mber MPXV2022GC6U throughout the document

Rev. 8 Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. All rights reserved. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support