MPXV2050G NXP | Alldatasheet
Document overview
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- PDF pages: 15
Technical content
Datasheet sections
- 1 General Description
- 2 Features and Benefits
- 3 Applications
- 4 Ordering Information
- 5 Block Diagram
- 6 Pin Information
- 6.1 MPXV2050GP
- 7 Maximum Ratings
- 8 Operating Characteristics
- 9 Characteristics
- 9.1 Voltage output versus applied differential
- 9.2 On-chip temperature compensation and
- 9.3 Linearity
- 9.4 Pressure (P1) / Vacuum (P2) side
- 9.5 Media compatibility
- 10 Package Outlines
- 10.1 Small outline packages
- 11 References
- 12 Revision history
- 13 Legal information
50 kPa Temperature Compensated Pressure Sensors Rev. 2 — 22 April 2021 Product data sheet
1 General Description
The MPXV2050G device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation.
2 Features and Benefits
- Ratiometric to Supply Voltage
- Temperature Compensated over 0 °C to 85 °C
- Gauge Ported
3 Applications
- Level Indicators
- Medical Diagnostics
- Robotics
- Pressure Switching
- Pump/Motor Controllers
- Non-Invasive Blood Pressure Measurement
4 Ordering Information
Table 1. Ordering options
5 Block Diagram
Figure 1. Temperature compensated pressure sensor schematic
6 Pin Information
6.1 MPXV2050GP
Figure 2. Case 1369-01 Table 2. Pin definitions – MPXV2050GP
7 Maximum Ratings
Table 3. Maximum ratings [1]
8 Operating Characteristics
Table 4. Operating Characteristics (VS = 10 Vdc, TA = 25° C unless otherwise noted, P1 > P2) [4] Offset (Voff) is defined as the output voltage at the minimum rated pressure.
- Linearity: Output deviation from a straight line relationship with pressure, using the end point method, over the specified pressure range.
- Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
- Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 °C.
- TcSpan: Output deviation at full rated pressure over the temperature range of 0 °C to 85 °C, relative to 25 °C
- TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C [6] Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. [7] Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. [8] Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure Temperature Cycling with Bias test. Product data sheet Rev. 2 — 22 April 2021
9 Characteristics
9.1 Voltage output versus applied differential pressure
9.2 On-chip temperature compensation and calibration
Figure 3 shows the typical output characteristics of the MPXV2050G series at 25 °C. under Section 8 "Operating Characteristics".
40 VS = 10 Vdc
Figure 3. Output vs. pressure differential
9.3 Linearity
- End point straight line fit
- Least squares best line fit While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Product data sheet Rev. 2 — 22 April 2021
method measured at the midrange pressure. Figure 4. Linearity specification comparison
9.4 Pressure (P1) / Vacuum (P2) side identification
positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using Table 5. Table 5. Pressure (P1) side delineation table
9.5 Media compatibility
to be transmitted to the silicon diaphragm. and qualification tests are based on the use of dry clean air as the pressure medium. For more information, refer to application note AN3728.
Figure 5. Small outline package — cross-sectional diagram (not to scale)
10.1 Small outline packages
Figure 6. SOT1693-3 (Case 1369-01) – Page 1
Figure 7. SOT1693-3 (Case 1369-01) – page 2
11 References
Semiconductors. Adapted legal texts to the new company name where appropriate. guidelines of NXP Semiconductors.
- • Updated the package image on the first page.
- Operating Characteristics: Revised “Non-Linearity” to “Linearity” and added new footnote after Linearity, Pressure Hysteresis, Temperature Hysteresis, Temperature Coefficient of Full Scale and Temperature Coefficient of Offset.
- Updated images for package dimensions MPXV2050 v.0 201511 Product data sheet — — Modifications Initial release
Table 6. Revision history
NXP Semiconductors MPXV2050G 50 kPa Temperature Compensated Pressure Sensors
13 Legal information
13.1 Data sheet status
Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Product data sheet Rev. 2 — 22 April 2021
NXP Semiconductors MPXV2050G 50 kPa Temperature Compensated Pressure Sensors No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — Customer understands that all NXP products may be subject to unidentified or documented vulnerabilities. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. Product data sheet Rev. 2 — 22 April 2021
NXP Semiconductors MPXV2050G 50 kPa Temperature Compensated Pressure Sensors Tables Tab. 4. Operating Characteristics (VS = 10 Vdc, TA Figures Fig. 1. Temperature compensated pressure Fig. 5. Small outline package — cross-sectional Product data sheet Rev. 2 — 22 April 2021