MPX12_08 FREESCALE | Alldatasheet
Document overview
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Technical content
Features
- Low Cost
- Patented Silicon Shear Stress Strain Gauge Design
- Ratiometric to Supply Voltage
- Easy to Use Chip Carrier Package Options
- Gauge Options
- Durable Epoxy Package
ORDERING INFORMATION
No. # of Ports Pressure Type None Single Dual Gauge Differential Absolute MPX12D Tray 344 • • MPX12DP Tray 344C • • MPX12GP Tray 344B • • MPXV12GW6U Rail 1735 • • MPXV12GW7U Rail 1560 • • MPX12 0 to 10 kPa (0 to 1.45 psi) 55 mV Full Scale Span (Typical) Series SMALL OUTLINE PACKAGE MPXV12GW7U CASE 1560-02 MPXV12GW6U CASE 1735-01 MPX12GP CASE 344B-01 MPX12D CASE 344-15 MPX12DP CASE 344C-01 UNIBODY PACKAGES Application Examples
- Air Movement Control
- Environmental Control Systems
- Level Indicators
- Leak Detection
- Medical Instrumentation
- Industrial Controls
- Pneumatic Control Systems
- Robotics
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Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
- 1.0 kPa (kiloPascal) equals 0.145 psi.
- Device is ratiometric within this specified excitation r ange. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
- Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
- Offset (V OFF) is defined as the output voltage at the minimum rated pressure.
- Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
- Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
- Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
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MPX12 series over temperature. over an extensive temperature range. by designing your system using the MPX2010D series sensor. ranges are presented in Applications Note AN840. calculations required are burdensome. calculations are more straightforward for the user. Figure 2. Output vs. Pressure Differential Figure 3. Linearity Specification Comparison
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Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE
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NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). MAM0.136 (0.005) T 1234PIN 1 R N L G F D 4 PL SEATING PLANE -T- C M J B -A- DAMBAR TRIM ZONE: F THIS IS INCLUDED WITHIN DIM. "F" 8 PL 1 23 4 Y Z STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT STYLE 2: PIN 1. V CC 2. - SUPPL Y 3. + SUPPL Y 4. GROUND STYLE 3: PIN 1. GND 2. -VOUT 3. VS 4. +VOUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 Y 0.048 0.052 1.22 1.32 Z 0.106 0.118 2.68 3.00 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. D 4 PL F U H L PORT #1 POSITIVE PRESSURE (P1) PIN 1 -A- -Q- S K G -P- SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 SEATING PLANE B N R C J -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10
Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 344C-01 ISSUE B UNIBODY PACKAGE NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. PORT #2 PORT #1 PORT #2 VACUUM (P2) (P1) SEATING PLANE SEATING PLANE K S W H L U F G D 4 PL PORT #1 POSITIVE PRESSURE -Q- 12 4 3PIN 1 -P- SSM0.13 (0.005) Q ST B N J C V R -A- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 W 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10
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