MPX10 FREESCALE | Alldatasheet

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Features

• Low Cost • Patented Silicon Shear Stress Strain Gauge Design • Ratiometric to Supply Voltage • Easy to Use Chip Carrier Package Options • Differential and Gauge Options • Durable Epoxy Unibody Element or Ther moplastic (PPS) Surface Mount Package Functional Description • Air Movement Control • Environmental Control Systems • Level Indicators • Leak Detection • Medical Instrumentation • Industrial Controls • Pneumatic Control Systems • Robotics ORDERING INFORMATION(1) 1. MPX10 series pressure sensors are avai lable in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. Device Type Options Case No. Order Number Device Marking SMALL OUTLINE PACKAGE (MPXV10G SERIES) Ported Elements Rails 482A MPXV10GC6U MPXV10G Tape and Reel 482A MPXV10GC6T1 MPXV10G Rails 482C MPXV10GC7U MPXV10G UNIBODY PACKAGE (MPX10 SERIES) Basic Element Differential 344 MPX10D MPX10D Ported Elements Differential 344C MPX10DP MPX10DP Gauge 344B MPX10GP MPX10GP Gauge 344E MPX10GS MPX10D MPX10 MPXV10GC SERIES UNCOMPENSATED PRESSURE SENSOR 0 TO 10 kPA (0–1.45 psi) 35 mV FULL SCALE SPAN (TYPICAL) SMALL OUTLINE PACKAGE PIN NUMBERS

1 GND 5 N/C

3 Vs 7 N/C

4 –Vout 8 N/C NOTE: Pin 1 is noted by the notch in the lead. SMALL OUTLINE PACKAGES MPXV10GC6U CASE 482A-01 MPXV10GC7U CASE 482C-03 UNIBODY PACKAGE PIN NUMBERS

1 GND 3 Vs

2 +Vout 4 –Vout NOTE: Pin 1 is noted by the notch in the lead. MPX10DP CASE 344C-01 MPX10D CASE 344-15 MPX10GP CASE 344B-01 MPX10GS CASE 344E-01 UNIBODY PACKAGES

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Figure 1. Uncompensated Pressure Sensor Schematic vacuum side (P2) relative to the pressure side (P1). Table 1. Maximum Ratings(1)

  1. Exposure beyond the specified limits may c ause permanent damage or degradation to the device.

Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this spec ified excitation range. Operating the device above the specified excitation range may induce additional

error due to device self-heating.

  1. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  2. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
  3. Accuracy (error budget) consists of the following:

and from the minimum or maximum operating temperature points, with zero differential pressure applied. or maximum rated pressure at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TCR: Z IN deviation with minimum rated pressure applied, over the temperature range of -40°C to ±125°C, relative to 25°C.

  1. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to

a specified step change in pressure.

  1. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
  2. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

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MPX10 and MPXV10GC series over temperature. over an extensive temperature range. ranges are presented in Application Note AN840. calculations required are burdensome. calculations are more straightforward for the user. Figure 2. Output versus Pressure Differential Figure 3. Linearity Specification Comparison

NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. D 4 PL F U H L PORT #1 POSITIVE PRESSURE (P1) PIN 1 -A- -Q- S K G -P- SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 SEATING PLANE B N R C J -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10 NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). MAM0.136 (0.005) T 1234PIN 1 R N L G F D 4 PL SEATING PLANE -T- C M J B -A- DAMBAR TRIM ZONE: F THIS IS INCLUDED WITHIN DIM. "F" 8 PL 1 23 4 Y Z STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT STYLE 2: PIN 1. V CC 2. - SUPPL Y 3. + SUPPL Y 4. GROUND STYLE 3: PIN 1. GND 2. -VOUT 3. VS 4. +VOUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 Y 0.048 0.052 1.22 1.32 Z 0.106 0.118 2.68 3.00 MPX10 Sensors

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NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. PORT #2 PORT #1 PORT #2 VACUUM (P2) (P1) SEATING PLANE SEATING PLANE K S W H L U F G D 4 PL PORT #1 POSITIVE PRESSURE -Q- 12 4 3PIN 1 -P- SSM0.13 (0.005) Q ST B N J C V R -A- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 W 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. S BACK SIDE VACUUM (P2) PIN 1

4 PLD

PORT #1 POSITIVE PRESSURE (P1) SEATING PLANE 32 1 K A G F MBM0.13 (0.005) T C N R V J -B- -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.690 0.720 17.53 18.28 B 0.245 0.255 6.22 6.48 C 0.780 0.820 19.81 20.82 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.345 0.375 8.76 9.53 N 0.300 0.310 7.62 7.87 R 0.178 0.186 4.52 4.72 S V 0.182 0.194 4.62 4.93 0.220 0.240 5.59 6.10 MPX10 Sensors Freescale Semiconductor 7

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