MPXS4100A MOTOROLA | Alldatasheet
Document overview
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- PDF pages: 6
Technical content
Features
- 1.8% Maximum Error Over 0° to 85°C
- Surface Mount Package
- Available Tape and Reeled or in Sleeves
- Ideally Suited for Direct Microprocessor Interfacing
- Patented Silicon Shear Stress Strain Gauge
- Temperature Compensated Over –40 to +125°C
- Ideal for Non–automotive applications
- Also Available in Unibody Package (see MPX4100A/D data sheet) Application
- Barometric Absolute Pressure for Engine Control
Figure 1. Fully Integrated Pressure Sensor Schematic
4 Vout
- TC = 25°C unless otherwise noted.
- Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Senseon and X–ducer are trademarks of Motorola, Inc.
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2 Motorola Sensor Device Data
OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Pressure Range POP 20 — 105 kPa Supply Voltage(1) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(2) (0 to 85°C) Voff 0.225 0.306 0.388 Vdc Full Scale Output(3) (0 to 85°C) VFSO 4.816 4.897 4.978 Vdc Full Scale Span(4) (0 to 85°C) VFSS — 4.591 — Vdc Accuracy(5) (0 to 85°C) — — — ±1.8 %V FSS Sensitivity ΔV/ΔP — 54 — mV/kPa Response Time(6) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–up Time(7) — — 20 — ms Offset Stability(8) — — ±/C02570.65 — %V FSS MECHANICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit Weight, Basic Element (Case 432) — — 1.5 — Grams NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:
- Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
- Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with minimum specified pressure applied.
- Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
- TcSpan: Span deviation per °C over the temperature range of 0° to 85°C, as a percent of span at 25°C.
- TcOffset: Output deviation per °C with minimum pressure applied, over the temperature range of 0° to 85°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage. 8. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 9. Decoupling circuit shown in Figure 2 required to meet specification.
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4 Motorola Sensor Device Data
Transfer Function (MPXS4100A) Nominal Transfer Value:Vout = VS (P x 0.01059 – 0.1518) +/– (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V ± 0.25 Vdc Temperature Error Band MPXS4100A Series Break Points Temp Multiplier – 40 3 0 to 85 1 125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0 20 40 60 80 100 120 Pressure (in kPa) Pressure Error (kPa) Pressure Error (Max) 20 to 105 (kPa)± 1.5 (kPa)
ORDERING INFORMATION
The MPXS4100A series BAP silicon pressure sensors are available shipped in sleeves or tape and reeled. Device Type Options Case No MPX Series Order No MarkingD evice Type O ptions C ase N o. MPX Series O rder N o. M arking Sleeve Pack 471–01 MPXS4100A6U MPXS4100A Tape and Reel 471–01 MPXS4100A6T1 MPXS4100A Device Reel Size Tape Width QuantityD evice R eel Size Tape W idth Q uantity MPXS4100A6T1 13” dia. 44 mm 250
/C0077/C0080/C0088/C0083/C0052/C0049/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 5Motorola Sensor Device Data INFORMATION FOR USING THE SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.835
0.060 TYP 8X
0.080 TYP 8X
0.100 TYP
0.300NOT TO SCALE SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of this device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device damage and/or failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected.
- Always preheat the device.
- The delta temperature between the preheat and soldering zones should be 100°C or less.*
- When preheating and soldering, the temperature of the leads and the case, including the port, must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference between the leads and the case shall be a maximum of 10°C.
- Wave soldering is not recommended for the pressure sensor surface mount package due to the exposure of the die to the environment.
- The soldering temperature and time shall not exceed 240°C for more than 5 seconds.
- When shifting from preheating to soldering zones, the maximum temperature gradient or rise rate shall be 2°C/second or less.
- After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used since the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
- Mechanical stress or shock should not be applied during cooling.
- Recommend usage of a no–clean solder paste to avoid circuit board cleaning. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
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6 Motorola Sensor Device Data
CASE 471–01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. DIM A MIN MAX MIN MAX MILLIMETERS 0.658 0.668 16.71 16.97 INCHES B 0.541 0.551 13.74 13.99 C 0.209 0.231 5.31 5.87 D 0.046 0.054 1.17 1.37 F 0.037 0.053 0.94 1.34 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 Y 0.002 0.010 0.05 0.25 M P 0.856 0.880 21.74 22.35 R 0.503 0.523 12.78 13.28 0 7 0 7 /C0095/C0095/C0095/C0095 A0.25 (0.010)M TB SS G P J R F C M SEATING PLANE Y –A– –B– –T– D 8 PL STYLE 1: PIN 1. NC 2. VSUPPLY 3. GROUND 4. VOUT 5. NC 6. NC 7. NC 8. NC Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;JAPAN : Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET : http://motorola.com/sps MPXS4100A/D◊