MPXH6400A NXP | Alldatasheet

Document overview

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Technical content

Features

  • Improved accuracy at high temperature
  • Available in super small outline package
  • 1.5% maximum error over 0 °C to 85 °C
  • Fully calibrated and compensated
  • Ideally suited for microprocessor or microcontroller-based systems
  • Temperature compensated from -40 °C to +125 °C
  • Durable thermoplastic surface mount package
  • Package porting and mounting options enable tube attachment for liquefied natural gas (LPG) or remote sensing applications Typical applications
  • Fuel injected car engines
  • Vehicles powered by green gases (for example LPG and CNG)
  • Small engines
  • Industrial controls

Ordering information

Part number Shipping Package # of Ports Pressure type Device markingNone Single Dual Gauge Differential Absolute Super Small Outline Package (Media resistant gel) MPXH6400AC6U Rail 98ARH99089A • • MPXH6400A MPXH6400AC6T1 Tape and Reel 98ARH99089A • • MPXH6400A MPXHZ6400A6T1 Tape and Reel 98ARH99066A • • MPXHZ6400A MPXHZ6400AC6T1 Tape and Reel 98ARH99089A • • MPXHZ6400A MPXH6400A Super small outline package Top view Pinout Pin 1 identification, chamfered corner. DNC DNC DNC DNC DNC V S GND VOUT MPXH6400AC6U/6T1/ MPXHZ6400AC6T1 Case 98ARH99089A MPXHZ6400A6T1 Case 98ARH99066A

2 NXP B.V. Related Documentation The MPXxx6400A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the MPXx6400 web page at http://www.nxp.com/products/:MPXx6400. 2. Click the Documentation tab.

Contents

1 General Description

1.1 Block diagram

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Integrated pressure sensor block diagram

1.2 Pinout

Figure 2. Device pinout (top view) Table 1. Pin functions 1 DNC Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner.

3 GND Ground

5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground.

2 Mechanical and Electr ical Specifications

2.1 Maximum ratings

2.2 Operating characteristics

Table 2. Maximum ratings(1) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit. Table 3. Operating characteristics (VS = 5.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2.) 1.Device is ratiometric within this specified excitation range. 2.Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C. Variation from Nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C. specified step change in pressure. 7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test.

3 On-chip Temperature Comp ensation and Calibration

Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A). Figure 4 shows a typical application circuit (output source current operation). operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range. Figure 3. Cross-sectional diagram (not-to-scale) Figure 4. Recommended power supply decoupling and output filtering

51 K47 pF

Figure 8. Pressure error band

4 Package Information

4.1 Minimum recommended footprint for surface mounted applications

mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. Figure 9. SSOP footprint

0.027 TYP 8X

0.053 TYP 8X

NXP B.V. 9

4.2 Package Dimensions

This drawing is located at http://cache.nxp.com/assets/documents/data/en/package-information/98ARH99066A.pdf. Case 98ARH99066A, super small outline package, surface mount

10 NXP B.V. Case 98ARH99066A, super small outline package, surface mount

NXP B.V. 11 Case 98ARH99066A, super small outline package, surface mount

12 NXP B.V. This drawing is located at http://cache.nxp.com/assets/documents/data/en/package-information/98ARH99089A.pdf. Case 98ARH99089A, small outline package, surface mount

NXP B.V. 13 Case 98ARH99089A, small outline package, surface mount

5 Revision History

Table 4. Revision history

  • R e v i s e d VS = 10.0 VDC value to VS = 5.0 VDC in Table 3.
  • The format of this data sheet has been redesigned to comply with current identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate.
  • Updated package outlines Section 4.2, “Package Dimensions” to comply with current identity guidelines of NXP Semiconductors. MPXH6400A Rev. 5.0 2015 September Technical data — MPXH64-00A Rev.

Document Number: MPXH6400A Rev. 6 Information in this document is provided solely to enable system and software implementers to use NXP products. There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation, consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each customer application by the customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.nxp.com/terms-of-use.html. How to Reach Us: Home Page: NXP.com Web Support: http://www.nxp.com/support NXP, the NXP logo, Freescale, the Freescale logo, and the Energy Efficient Solutions logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © NXP B.V. 2017.