MPXH6300A_12 FREESCALE | Alldatasheet
Document overview
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- PDF pages: 13
Technical content
Features
- Improved Accuracy at High Temperature
- Available in Super Small Outline Packages
- 1.5% Maximum Error over 0 ° to 85°C
- Ideally suited for Microprocessor or Microcontroller-Based Systems
- Temperature Compensated from –40 ° to +125°C
- Durable Thermoplastic ( PPS) Surface Mount Package
ORDERING INFORMATION
No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Super Small Outline Package (MPXH6300A Series) MPXH6300A6U Rail 1317 • • MPXH6300A MPXH6300A6T1 Tape & Reel 1317 • • MPXH6300A MPXH6300AC6U Rail 1317A • • MPXH6300A MPXH6300AC6T1 Tape & Reel 1317A • • MPXH6300A MPXH6300A 20 to 304 kPa (3.0 to 42 psi) 0.3 to 4.9 V Output Series MPXH6300A6U/6T1 CASE 1317 MPXH6300AC6U/6T1 CASE 1317A SUPER SMALL OUTLINE PACKAGES Application Examples
- Industrial Controls
- Engine Control/Manifold Absolute Pressure (MAP)
2 Freescale Semiconductor, Inc. Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.
- Device is ratiometric within this specified excitation range.
- Offset (V off) is defined as the output voltage at the minimum rated pressure.
- Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
- Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
- Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a perc ent of span
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. Variation from Nominal: The variation fr om nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
- Response Time is defined as the time for t he incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
- Warm-up Time is defined as the time r equired for the product to meet the specified output voltage after the Pressure has been stabilized.
- Offset Stability is the product's output deviation when subjected to 1000 hours of Pu lsed Pressure, Temperature Cycling with Bias Test.
4 Freescale Semiconductor, Inc. compatibility in your application. Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 3. Typical Application Circuit Figure 4. Output vs. Absolute Pressure
51 K47 pF
Freescale Semiconductor, Inc. 5 Pressure Nominal Transfer Value: Vout = VS x (0.00318 x P - 0.00353) ± (Pressure Error x Temp Factor x 0.00318 x VS) VS = 5.1 ± 0.36 Vdc Transfer Function (MPXH6300A) Temp Multiplier -40 3 0 to 85 1 125 3 Temperature in °C 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 140 120 10080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C. Temperature Error Band Pressure Error (Max) Pressure Error Band 20 to 304 (kPa) ±4.0 (kPa) MPXH6300A Series Pressure (in kPa) Error Limits for Pressure Break Points Pressure Error (kPa) 3.0 2.0 1.0 -1.0 -2.0 -4.0 0.0 4.0 -3.0 20 60 100 140 180 220 260 300
6 Freescale Semiconductor, Inc. Figure 5. SSOP Footprint (Case 1317 and 1317A)
0.027 TYP 8X
0.053 TYP 8X
Freescale Semiconductor, Inc. 7 Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE PAGE 1 OF 3
8 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE PAGE 2 OF 3
Freescale Semiconductor, Inc. 9 Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE PAGE 3 OF 3
10 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE
Freescale Semiconductor, Inc. 11 Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE
12 Freescale Semiconductor, Inc. Table 3. Revision History 5.1 05/2012 • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H.
Rev. 5.1 Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.reg.net/v2/webservices/Freescale/Docs/TermsandConditions.htm. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support