MPXA6115A FREESCALE | Alldatasheet
Document overview
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- PDF pages: 17
Technical content
Features
- Resistant to High Humidity and Common Automotive Media
- Improved Accuracy at High Temperature
- Available in Small and Super Small Outline Packages
- 1.5% Maximum Error over 0 ° to 85°C
- Ideally suited for Mi croprocessor or Microcontroller-Based Systems
- Temperature Compensated from -40 ° to +125°C
- Durable Thermoplastic ( PPS) Surface Mount Package
ORDERING INFORMATION
No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Small Outline Package (MPXA6115A Series) MPXA6115A6U 482 • • MPXA6115A MPXA6115A6T1 482 • • MPXA6115A MPXA6115AC6U 482A • • MPXA6115A MPXA6115AC6T1 482A • • MPXA6115A MPXA6115AC7U 482C • • MPXA6115A Small Outline Package (Media Gel Resistant) (MPXAZ6115A Series) MPXAZ6115A6U 482 • • MPXAZ6115A MPXAZ6115AC6U 482A • • MPXAZ6115A MPXAZ6115AC6T1 482A • • MPXAZ6115A MPXAZ6115AP 1369 • • MPXAZ6115A MPXAZ6115APT1 1369 • • MPXAZ6115A Super Small Outline Package (MPXH6115A Series) MPXH6115A6U 1317 • • MPXH6115A MPXH6115A6T1 1317 • • MPXH6115A MPXH6115AC6U 1317A • • MPXH6115A MPXH6115AC6T1 1317A • • MPXH6115A MPXA6115A Series MPXH6115A MPXHZ6115A 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.8 V Output Application Examples
- Aviation Altimeters
- Industrial Controls
- Engine Control/Manifold Absolute Pressure (MAP)
- Weather Station and Weather Reporting Device Barometers
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Small Outline Package (Media Gel Resistant) (MPXHZ6115A Series) MPXHZ6115A6U 1317 • • MPXHZ6115A MPXHZ6115A6T1 1317 • • MPXHZ6115A MPXHZ6115AC6U 1317A • • MPXHZ6115A MPXHZ6115AC6T1 1317A • • MPXHZ6115A SUPER SMALL OUTLINE PACKAGES MPXA6115A6U/T1 MPXAZ6115A6U CASE 482-01 MPXA6115AC6U/T1 MPXAZ6115AC6U/T1 CASE 482A-01 MPXH6115A6U/T1 MPXHZ6115A6U/T1 CASE 1317-04 MPXH6115AC6U/T1 MPXHZ6115AC6U/T1 CASE 1317A-04 MPXA6115AC7U CASE 482C-03 MPXAZ6115AP/T1 CASE 1369-01
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
- Device is ratiometric within this specified excitation range.
- Offset (V off) is defined as the output voltage at the minimum rated pressure.
- Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
- Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
- Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. from the minimum or maximum operating temperature points, with zero differential pressure applied. maximum rated pressure at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
- Response Time is defined as the time fo r the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
- Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
- Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
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Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Fully Integrated Pressure Sensor Schematic Table 2. Maximum Ratings(1)
- Exposure beyond the specified limits may cause permanent damage or degradation to the device.
- Maximum Output Current is cont rolled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
Super Small Outline chip carrier (Case 1317). compatibility in your application. Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale) Figure 3. Typical Application Circuit Figure 4. Output vs. Absolute Pressure
51 K47 pF
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Transfer Function (MPXxx6115A) Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXxxA6115A SERIES Break Points Temp Multiplier - 40 3 0 to 85 1 125 1.75 Temperature in Cº 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0
20 Pressure (in kPa)
Pressure Error (kPa) 15 to 115 (kPa) ±1.5 (kPa) 40 60 80 100 120 Pressure Error (Max)
Figure 5. SOP Footprint (Case 482) Figure 6. SSOP Footprint (Case 1317 and 1317A)
0.060 TYP 8X
0.100 TYP
0.100 TYP 8X
0.027 TYP 8X
0.053 TYP 8X
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S D 8 PL G SBM0.25 (0.010) A ST -A- -B- N C M J K PIN 1 IDENTIFIER H SEATING PLANE -T- DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . PIN 1 IDENTIFIER H SEATING PLANE -T- W C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT .S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S
A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.660.0340.026 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 M 0 15 0 15 N 0.444 0.448 11.28 11.38 S 0.540 0.560 13.72 14.22 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. /C0095/C0095 /C0095/C0095PIN 1 K SEATING PLANE–T– S G –A– –B– C N V W M J V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 IDENTIFIER D 8 PL SBM0.25 (0.010) A ST DETAIL X DETAIL X
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Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 2 OF 2
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SUPER SMALL OUTLINE PACKAGE PAGE 1 OF 3
Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE PAGE 2 OF 3
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SUPER SMALL OUTLINE PACKAGE PAGE 3 OF 3
Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE PAGE 1 OF 2
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SUPER SMALL OUTLINE PACKAGE PAGE 2 OF 2
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