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Document overview

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Technical content

Features

  • 1.72% maximum error over 0 °C to 85 °C
  • Specifically designed for intake manifold absolute pressure sensing in engine control systems
  • Temperature compensated over -40 °C to +125 °C
  • Thermoplastic (PPS) surface mount package

Applications

  • Manifold sensing for automotive systems
  • Ideally suited for microprocessor or microcontroller-based system
  • Also ideal for non-automotive applications

Ordering Information

Part number Shipping Package # of Ports Pressure type Device markingNone Single Dual Gauge Differential Absolute Super Small Outline Package MPXH6101A6U Rails 98ARH99066A • • MPXH6101A MPXH6101A6T1 Tape and Reel 98ARH99066A • • MPXH6101A MPXH6101A Super small outline package MPXH6101A6U/6T1 Case 98ARH99066A Top view Pinout VS VOUT GND DNC DNC DNC DNC DNC Pin 1 identification, chamfered corner

The MPXH6101A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. In the Keyword search box at the top of the page, enter the device number MPXH6101A. 3. In the Refine Your Result pane on the left, click on the Documentation link. MPXH6101A Sensors Freescale Semiconductor, Inc. 2

Contents

1 General Description

1.1 Block diagram

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Fully integrated pressure sensor schematic

1.2 Pinout

Figure 2. Device pinout (top view) Table 1. Pin functions 1 DNC Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner.

3 GND Ground

5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground.

4 Freescale Semiconductor, Inc.

2 Mechanical and Electr ical Specifications

2.1 Maximum ratings

2.2 Operating characteristics

Table 2. Maximum ratings(1)

  1. Exposure beyond the specified limits may c ause permanent damage or degradation to the device.

Table 3. Operating characteristics (VS = 5.0 Vdc, TA = 25 °C unless otherwise noted, P1 > P2. Decoupling circuit shown in

  1. 1.0 kPa (kilopascal) equals 0.145 psi.
  2. Device is ratiometric within this specified excitation range.
  3. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  4. Full-scale output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
  5. Full-scale span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relations hip with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. minimum or maximum rated pressure, at 25 °C. TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C. Variation from nominal: The variation fr om nominal values, for offset or full-scale span, as a percent of VFSS, at 25 °C.

  1. Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Warm-up time is defined as the time r equired for the product to meet the specified output voltage after the pressure has been stabilized.
  2. Offset stability is the product's output deviation when subjected to 1000 hours of pul sed pressure, temperature cycling with bias test.

3 On-Chip Temperature Comp ensation and Calibration

Figure 3 illustrates an absolute sensing chip in the super small outline package (case 98ARH99066A). operation over a temperature range of 0 °C to 85 °C. The output will saturate outside of the specified pressure range. sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 3. Cross-sectional diagram SSOP (not to scale) Figure 4. Recommended power supply decoupling and output filtering Figure 5. Output versus absolute pressure

51 K47 pF

6 Freescale Semiconductor, Inc.

4 Package Information

4.1 Pressure (P1)/Vacuum (P2) Side Identification

operate with positive differential pressure applied, P1 > P2.

4.2 Minimum recommended footprint for surface mounted applications

mask layer to avoid bridging and shorting between solder pads. Figure 6. SSOP footprint (case 98ARH99066A) Table 4. Pressure (P1)/vacuum (P2) side identification

0.027 TYP 8X

0.053 TYP 8X

Freescale Semiconductor, Inc. 7

4.3 Package dimensions

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf. Case 98ARH99066A, 8-lead super small outline package

8 Freescale Semiconductor, Inc. Case 98ARH99066A, 8-lead super small outline package

Freescale Semiconductor, Inc. 9 Case 98ARH99066A, 8-lead super small outline package

10 Freescale Semiconductor, Inc.

5 Revision History

Table 5. Revision history

  • Updated format.
  • Corrected pressure range from 105 kPa to 102 kPa.
  • Deleted part numbers MPXH6101AC6U and MPXH6101AC6T1 and all pertaining information.
  • Section 2: Table 2. Updated max value for Pressure range and Supply voltage. Removed V S range in Characteristic column and updated Min, Typ and Max values for Minimum pressure offset, Full-scale output and Full-scale span rows.
  • Updated package drawing with current version.

Document Number: MPXH6101A Rev. 7.1 Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. © 2006, 2008, 2009, 2015 Freescale Semiconductor, Inc.