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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

Features

  • Integrated temperature compensation and calibration
  • Ratiometric to supply voltage
  • Polysulfone case material (ISO 10993)
  • Provided in easy-to-use tape and reel Typical applications
  • Respiratory diagnostics
  • Air movement control
  • Controllers
  • Pressure switching NOTE The die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes.

Ordering Information

Device Name Shipping Package Pressure Type Device Marking Gauge Differential Absolute MPXC2011DTI Tape and Reel 98ASB13355C • XXXX = Device code XXX = Trace code 1234GND +VOUT +VS –VOUT MPXC2011DT1 Chip Pak package Back view MPXC2011DT1 Case 98ASB13355C Front view Pinout

2 Freescale Semiconductor, Inc. Related Documentation The MPXC2011DT1 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. In the Keyword search box at the top of the page, enter the device number MPXC2011DT1. 3. In the Refine Your Result pane on the left, click on the Documentation link.

Contents

1 General Description

performance of Freescale Semiconductor's shear stress pressure sensor design and the use of biomedically approved materials. sensor that are required to be biomedically approved are the rigid housing and the gel coating.

1.1 Block diagram

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Block diagram

1.2 Pinout

Figure 2. Device pinout (front view) Table 1. Pin functions

1 GND Ground

4 Freescale Semiconductor, Inc.

2 Mechanical and Electr ical Specifications

2.1 Maximum ratings

2.2 Operating characteristics

Table 2. Maximum ratings(1)

  1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Table 3. Operating characteristics (VS = 10 VDC, TA = 25 °C unless otherwise noted, P1 > P2)

  1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
  2. Device is ratiometric within this s pecified excitation range. Operating the device above the specified excitation range may induce additional

error due to device self-heating.

  1. Full-scale span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  2. Offset (V OFF) is defined as the output voltage at the minimum rated pressure.
  3. Accuracy (error budget) consists of the following:

from the minimum or maximum operating temperature points, with zero differential pressure applied. or maximum rated pressure, at 25 °C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C.

  1. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Offset stability is the product's output deviation when subjected to 1000 hours of Pu lsed Pressure, Temperature Cycling with Bias Test.

Freescale Semiconductor, Inc. 5

3 Package Dimensions

3.1 Package description

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB13355C.pdf. Case 98ASB1335C, Chip Pak package DIM A MIN MAX MIN MAX MILLIMETERS 6.10 6.600.240 0.260 INCHES B 8.89 9.400.350 0.370 C 3.56 3.810.140 0.150 D1 0.30 0.510.012 0.020 E 2.24 2.590.088 0.102 F 3.12 3.250.123 0.128 G 1.14 1.400.045 0.055 H 0.94 1.190.037 0.047 J 0.18 0.280.007 0.011 K 3.05 3.560.120 0.140 L 2.41 2.670.095 0.105 M 4.19 4.450.165 0.175 N 5.66 6.070.223 0.239 V 2.67 2.920.105 0.115 AA 2.41 2.720.095 0.107 AB 0.38 0.890.015 0.035 AC 3.05 4.450.120 0.175 AD 2.54 2.920.100 0.115 NOTES: 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. AB AD AA F AC BACK VIEW G V N FRONT VIEW M A 12 4 3 C L B F K H E J –T– END VIEW DETAIL A DETAIL A D2 0.36 0.560.014 0.022

6 Freescale Semiconductor, Inc.

4 Revision History

Table 4. Revision history 9 10/2012 • Deleted references to device number MPXC2012DT (a no-gel option) throughout the document. 10 08/2014 • Added pin descriptions and pin numbers. 11 09/2015 • Corrected Block Diagram.

  • Updated format.

Document Number: MPXC2011DT1 Rev. 11 Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Freescale and the Freescale logos are trademarks of Freescale Semiconductor, Inc., respective owners. © 2010, 2012, 2014, 2015 Freescale Semiconductor, Inc.