MPXC2011DT1 MOTOROLA | Alldatasheet
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Technical content
Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub- -module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductors unique sensor die with its piezoresistive technology, along with the added feature of on- -chip, thin- -film temperature compensation and calibration. NOTE: Freescale Semiconductor is also offering the Chip Pak package in application- -specific configurations, which will have an SPX prefix, followed by a four- -digit number, unique to the specific customer. Features:
- Low Cost
- Integrated Temperature Compensation and Calibration
- Ratiometric to Supply Voltage
- Polysulfone Case Material (Medical, Class V Approved)
- Provided in Easy- -to- -Use Tape and Reel Application Examples
- Respiratory Diagnostics
- Air Movement Control
- Controllers
- Pressure Switching NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customers housing. Use caution when handling the devices during all processes. Freescale Semiconductors MPXC2011DT1/ MPXC2012DT1 Pressure Sensor has been designed for medical usage by combining the performance of Freescale Semiconductors shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: tissue culture test, rabbit implant, hemolysis, intracutaneous test in rabbits, and system toxicity, USP . The MPXC2011DT1 contains a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uni- formly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure trans- ducers. A biomedically approved opaque filler in the gel pre- vents bright operating room lights from affecting the performance of the sensor. The MPXC2012DT1 is a no- -gel option. Preferred devices are Freescale Semiconductor recommendedchoices for future use and best overall value. MPXC2011DT1 Rev. 3, 10/2004 Freescale Semiconductor Technical Data © Freescale Semiconductor, Inc., 2004. All rights reserved. MPXC2011DT1 MPXC2012DT1 PRESSURE SENSORS 0t o7 5m m H g( 0t o1 0k P a ) PIN NUMBER MPXC2011DT1/MPXC2012DT1 CASE 423A Gnd VS S- - CHIP PAK PACKAGE Freescale Semiconductor Preferred Device
MAXIMUM RATINGS(NOTE) Rating Symbol Value Unit Maximum Pressure (Backside) Pmax 75 kPa Storage Temperature Tstg -- 2 5 t o + 8 5 °C Operating Temperature TA + 1 5t o+ 4 0 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS(VS =1 0V d c ,TA =2 5°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 10 kPa Supply Voltage(2) VS 3 10 Vdc Supply Current Io 6.0 mAdc Full Scale Span(3) VFSS 24 25 26 mV Offset(4) Voff -- 1 . 0 1.0 mV Sensitivity ∆V/∆P 2.5 mV/kPa Linearity(5) -- 1 . 0 1.0 %VFSS Pressure Hysteresis(5) (0 to 10 kPa) ±0.1 %VFSS Temperature Hysteresis(5) (+15°Ct o+ 4 0°C) ±0.1 %VFSS Temperature Effect on Full Scale Span(5) TCVFSS -- 1 . 0 1.0 %VFSS Temperature Effect on Offset(5) TCVoff -- 1 . 0 1.0 mV Input Impedance Zin 1300 2550 Ω Output Impedance Zout 1400 3000 Ω Response Time(6) (10% to 90%) tR 1.0 ms Warm- -Up 20 ms Offset Stability(7) ±0.5 %VFSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self- -heating. 3. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:
- Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
- Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximumoperating temperature points, with zero differential pressure applied.
- Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure iscycled to and from the minimum or maximum rated pressure, at 25°C.
- TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85 °C, relative to 25°C.
- TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the products output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
ORDERING INFORMATION
The MPXC2011DT1/MPXC2012DT1 silicon pressuresensors are available in tape and reel. Device Type/Order No. Case No. Device Description Marking MPXC2011DT1 423A Chip Pak, 1/3 Gel Date Code, Lot ID MPXC2012DT1 423A Chip Pak, No Gel Date Code, Lot ID Packaging Information Reel Size Tape Width Quantity Tape and Reel 330 mm 24 mm 1000 pc/reel PACKAGE DIMENSIONS CASE 423A- -03 ISSUE C DIM A MIN MAX MIN MAX MILLIMETERS 6.10 6.600.240 0.260 INCHES B 8.89 9.400.350 0.370 C 3.56 3.810.140 0.150 D1 0.30 0.510.012 0.020 E 2.24 2.590.088 0.102 F 3.12 3.250.123 0.128 G 1.14 1.400.045 0.055 H 0.94 1.190.037 0.047 J 0.18 0.280.007 0.011 K 3.05 3.560.120 0.140 L 2.41 2.670.095 0.105 M 4.19 4.450.165 0.175 N 5.66 6.070.223 0.239 V 2.67 2.920.105 0.115 AA 2.41 2.720.095 0.107 AB 0.38 0.890.015 0.035 AC 3.05 4.450.120 0.175 AD 2.54 2.920.100 0.115 NOTES: 8. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 9. CONTROLLING DIMENSION: INCH. AB AD AA F AC BACK VIEW G V N FRONT VIEW M A 12 4 3 C L B F K H E J -- T -- END VIEW DETAIL A DETAIL A D2 0.36 0.560.014 0.022
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Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1- -800- -441- -2447 or 303- -675- -2140 Fax: 303- -675- -2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPXC2011DT1 Rev. 3