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Technical content

Features

  • 2.5% Maximum Error over 0  to 85C
  • Ideally Suited for Microprocessor or Microcontroller-Based Systems
  • Available in Absolute, Differential and Gauge Configurations
  • Patented Silicon Shear Stress Strain Gauge
  • Durable Epoxy Unibody Element

ORDERING INFORMATION

No. # of Ports Pressure Type Device NameNone Single Dual Gauge Differential Absolute Unibody Package (MPX5700 Series) MPX5700A 867 • • MPX5700A MPX5700AP 867B • • MPX5700AP MPX5700AS 867E • • MPX5700A MPX5700ASX 867F • • MPX5700A MPX5700D 867 • • MPX5700D MPX5700DP 867C • • MPX5700DP MPX5700GP 867B • • MPX5700GP MPX5700GP1(1) 1. MPX5700GP1 has 90 degree lead form. 867B • • MPX5700GP MPX5700GS 867E • • MPX5700D MPX5700 Series 0 to 700 kPa (0 to 101.5 psi) 15 to 700 kPa (2.18 to 101.5 psi) 0.2 to 4.7 V Output MPX5700A/D CASE 867-08 MPX5700AP/GP/GP1 CASE 867B-04 MPX5700DP CASE 867C-05 MPX5700AS/GS CASE 867E-03 MPX5700ASX CASE 867F-03 UNIBODY PACKAGES

2 Freescale Semiconductor, Inc. Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this specified excitation range.
  3. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  4. Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
  5. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. from the minimum or maximum operating temperature points, with zero differential pressure applied. maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.

  1. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.

Freescale Semiconductor, Inc. 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Part Number Case Type Pressure (P1) Side Identifier MPX5700A/D 867 Stainless Steel Cap MPX5700DP 867C Side with Part Marking MPX5700GP/AP 867B Side with Port Attached MPX5700GS/AS 867E Side with Port Attached MPX5700ASX 867F Side with Port Attached

6 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PIN 1 F G N L R 123456

6 PLD

MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). CASE 867-08 ISSUE N BASIC ELEMENT NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH.R X 123 456 PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) PORT #1 POSITIVE PRESSURE (P1) PIN 1 PORT #2 VACUUM (P2) SEATING PLANESEATING PLANE -T- -T- P G C J N B F D 6 PL W V L U S K -Q- -A-MQM0.25 (0.010) T MAM0.13 (0.005) STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 0.220 0.240 5.59 6.10 CASE 867C-05 ISSUE F PRESSURE AND VACUUM SIDES PORTED (DP)

Freescale Semiconductor, Inc. 7 Pressure PACKAGE DIMENSIONS CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) PAGE 1 OF 2

8 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) PAGE 2 OF 2

Freescale Semiconductor, Inc. 9 Pressure PACKAGE DIMENSIONS NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES

0.100 BSC

2.54 BSC

A B C D E F G J K N S V MIN 0.690 0.245 0.780 0.027 0.178 0.048 0.014 0.345 0.300 0.220 0.182 MAX 0.255 0.820 0.033 0.186 0.064 0.016 0.375 0.310 0.240 0.720 0.194 MIN 17.53 6.22 19.81 0.69 4.52 1.22 0.36 8.76 7.62 5.59 4.62 MAX 18.28 6.48 20.82 0.84 4.72 1.63 0.41 9.53 7.87 6.10 4.93 STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX A 654321 C K N E -B- PORT #1 POSITIVE PRESSURE (P1) J -T- S G F D 6 PL PIN 1 MBM0.13 (0.005) T V CASE 867E-03 ISSUE D PRESSURE SIDE PORTED (AS, GS) C E V J PORT #1 POSITIVE PRESSURE (P1) -T- -P- MQM0.25 (0.010) T D 6 PL F G K PIN 1 U A B R S N -Q- SPM0.13 (0.005) Q ST 65 4321 STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. V EX MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D E F G J K N P Q R S U V MIN 1.080 0.740 0.630 0.027 0.160 0.048 0.014 0.070 0.150 0.150 0.440 0.695 0.840 0.182 0.220 MAX 1.120 0.760 0.650 0.033 0.180 0.064 0.016 0.080 0.160 0.160 0.460 0.725 0.860 0.194 0.240 MIN 27.43 18.80 16.00 0.68 4.06 1.22 0.36 1.78 3.81 3.81 11.18 17.65 21.34 4.62 5.59 MAX 28.45 19.30 16.51 0.84 4.57 1.63 0.41 2.03 4.06 4.06 11.68 18.42 21.84 4.93 6.10 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. CASE 867F-03 ISSUE D PRESSURE SIDE AXIAL PORT (ASX)

10 Freescale Semiconductor, Inc. Table 3. Revision History MPX5700GP1 has 90 degree lead form.

Rev. 10 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale, the Freescale logo, Energy Efficient Solutions logo, are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc.