MPX53_08 FREESCALE | Alldatasheet

Document overview

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Technical content

Features

  • Low Cost
  • Patented Silicon Shear Stress Strain Gauge Design
  • Ratiometric to Supply Voltage
  • Easy to Use Chip Carrier Package Options
  • 60 mV Span (Typical)
  • Differential and Gauge Options

ORDERING INFORMATION

No. # of Ports Pressure Type None Single Dual Gauge Differential Absolute MPX53D Tape & Reel 344 • • MPX53DP Rail 344C • • MPX53GP Rail 344B • • MPXV53GC7U Rail 482C • • MPX53 Series 0 to 50 kPa (0 to 7.25 psi) 60 mV Full Scale Span (Typical) UNIBODY PACKAGESSMALL OUTLINE PACKAGE MPXV53GC7U CASE 482C-03 MPX53GP CASE 344B-01 MPX53DP CASE 344C-01 MPX53D CASE 344-15 Application Examples

  • Air Movement Control
  • Environmental Control Systems
  • Level Indicators
  • Leak Detection
  • Medical Instrumentation
  • Industrial Controls
  • Pneumatic Control Systems
  • Robotics

2 Freescale Semiconductor

Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional

error due to device self-heating.

  1. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  2. Offset (V OFF) is defined as the output voltage at the minimum rated pressure.
  3. Response Time is defined as the time for the incremental c hange in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
  2. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

4 Freescale Semiconductor

MPX53 series over temperature. silicon diaphragm by the applied pressure. over an extensive temperature range. by designing your system using the MPX2053 series sensors. presented in Freescale Application Note, AN840. calculations required are burdensome. calculations are more straightforward for the user. the pressure signal to be transmitted to the silicon diaphragm. Figure 2. Output vs. Pressure Differential Figure 3. Linearity Specification Comparison Figu re 4. Unibody Package — Cross-Sectional Diagram

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Part Number Case Type Pressure (P1) Side Identifier MPX53D 344 Stainless Steep Cap MPX53DP 344C Side with Port Marking MPX53GP 344B Side with Port Attached MPXV53 Series 482C Side with Port Attached

6 Freescale Semiconductor

NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). MAM0.136 (0.005) T 1234PIN 1 R N L G F D 4 PL SEATING PLANE -T- C M J B -A- DAMBAR TRIM ZONE: F THIS IS INCLUDED WITHIN DIM. "F" 8 PL 1 23 4 Y Z DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 Y 0.048 0.052 1.22 1.32 Z 0.106 0.118 2.68 3.00 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. D 4 PL F U H L PORT #1 POSITIVE PRESSURE (P1) PIN 1 -A- -Q- S K G -P- SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 SEATING PLANE B N R C J -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4 - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10

NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. PORT #2 PORT #1 PORT #2 VACUUM (P2) (P1) SEATING PLANE SEATING PLANE K S W H L U F G D 4 PL PORT #1 POSITIVE PRESSURE -Q- 12 4 3PIN 1 -P- SSM0.13 (0.005) Q ST B N J C V R -A- STYLE 1: PIN 1. GROUND DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 W 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10

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