MPX5100DP NXP | Alldatasheet

Document overview

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Technical content

Features

  • 2.5% Maximum Error over 0 ° to 85°C
  • Ideally suited for Mi croprocessor or Microcontroller-Based Systems
  • Patented Silicon Shear Stress Strain Gauge
  • Available in Absolute, Differential and Gauge Configuration
  • Durable Epoxy Unibody Element
  • Easy-to-Use Chip Carrier Option

ORDERING INFORMATION

No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Unibody Package (MPX5100 Series) MPX5100A 867 • • MPX5100A MPX5100AP 867B • • MPX5100AP MPX5100D 867 • • MPX5100D MPX5100DP 867C • • MPX5100DP MPX5100GP 867B • • MPX5100GP Small Outline Package (MPXV5100 Series) MPXV5100GC6U 482A • • MPXV5100G MPXV5100GC7U 482C • • MPXV5100G MPXV5100DP 1351 • • MPXV5100DP MPXV5100GP 1369 • • MPXV5100GP MPX5100 0 to 100 kPa (0 to 14.5 psi) 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.7 V Output MPXV5100 Series Typical Applications

  • Patient Monitoring
  • Process Control
  • Pump/Motor Control
  • Pressure Switching

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Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this specified excitation range.
  3. Offset (V OFF) is defined as the output voltage at the minimum rated pressure.
  4. Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
  5. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  6. Accuracy (error budget) consists of the following:
  • Linearity: Output deviation from a straight line relati onship with pressure over the specified pressure range.
  • Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
  • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
  • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
  • TcOffset: Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C.
  • Variation from Nominal: The variation fr om nominal values, for Offset or Full Scale Span, as a percent of V FSS at 25°C. — — — ±2.5 %VFSS Sensitivity V/P — 45 — mV/kPa Response Time(7) 7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. tR — 1.0 — ms Output Source Current at Full Scale Output IO+ — 0.1 — mAdc Warm-Up Time(8) 8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. — — 20 — ms Offset Stability(9) 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. — — ±0.5 — %VFSS

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Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Unibody Package. Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package Devices Figure 2 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Small Outline Package. Figure 2. Fully Integrated Pressure Sensor Schematic for Small Outline Package Devices Table 2. Maximum Ratings(1) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Pins 4, 5, and 6 are NO CONNECTS. Pins 1 and 5-8 are NO CONNECTS.

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Transfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04) ± (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V ± 0.25 V Temperature Error Multiplier MPX5100D/MPX5100G/MPXV5100G Series Temp Multiplier 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 14012010080 - 40 3 0 to 85°C 1 +125° 3 Break Points Temperature in °C Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band Pressure in kPa 3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0 0 20 40 60 80 100 120 Pressure Error (max) 0 to 100 kPa ± 2.5 kPa Error (kPa) Error Limits for Pressure MPX5100D/MPX5100G/MPXV5100G Series

Transfer Function (MPX5100A) Nominal Transfer Value: VOUT = VS (P x 0.009 - 0.095) ± (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V ± 0.25 V Temperature Error Multiplier MPX5100A Temp Multiplier 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 13012010080 140 - 40 3 0 to 85°C 1 +125° 3 Break Points Temperature in °C Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Series Pressure Error Band Pressure in kPa 3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0 0 20 40 60 80 100 130 Pressure Error (max) 15 to 115 kPa ± 2.5 kPa Error (kPa) Error Limits for Pressure MPX5100A Series

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Figure 6. Small Outline Package Footprint

A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S D G 8 PL SBM0.25 (0.010) A ST –A– –B– C M J K PIN 1 IDENTIFIER H SEATING PLANE –T– N V W V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D G J K M N S V W MIN 0.415 0.415 0.500 0.026 0.009 0.100 0.444 0.540 0.245 0.115 MAX 0.425 0.425 0.520 0.034 0.011 0.120 15˚ 0.448 0.560 0.255 0.125 MIN 10.54 10.54 12.70 0.66 0.23 2.54 11.28 13.72 6.22 2.92 MAX 10.79 10.79 13.21 0.864 0.28 3.05 15˚ 11.38 14.22 6.48 3.17 PIN 1 IDENTIFIER K SEATING PLANE-T- W DETAIL X S G -A- -B-N C V M J D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.

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NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. STYLE 1: PIN 1. V OUT2. GROUND 3. V CC4. V1 5. V2 6. V EX R X 123 45 6 DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 PORT #2 VACUUM (P2) PORT #1 POSITIVE PORT #1 PIN 1 PORT #2 POSITIVE VACUUM PRESSURE SEATING PLANE SEATING PLANE –T– –T– P G C J N B F D W V L U 6 PL S K –Q– –A–MQM0.25 (0.010) T MAM0.13 (0.005) PRESSURE (P1) 0.220 0.240 5.59 6.10 (P1) (P2) PIN 1 F G N L R 123456

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MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).

Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS CASE 867B-04 ISSUE G UNIBODY PACKAGE PAGE 1 OF 2

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Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 1 OF 2

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Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 2

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