MPX5100 MOTOROLA | Alldatasheet

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Technical content

Features

  • 2.5% Maximum Error over 0 ° to 85°C
  • Ideally suited for Microproce ssor or Microcontroller-Based Systems
  • Patented Silicon Shear Stress Strain Gauge
  • Available in Absolute, Differential and Gauge Configurations
  • Ideal for Automotive and Non-Automotive Applications

Figure 1. Fully Integrated Pressure Sensor Schematic

1 N/C 5 N/C

2 VS 6 N/C

3 GND 7 N/C

4 Vout 8 N/C

1 Vout 4 N/C

2 GND 5 N/C

3 VS 6 N/C

Freescale Semiconductor, Inc.

2 Motorola Sensor Device Data MOTOROLA

NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.

  1. 1.0kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this specified excitation range.
  3. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  4. Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
  5. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  6. Accuracy (error budget) consists of the following:
  • Linearity: Output deviation from a straight line relati onship with pressure over the specified pressure range.
  • Temperature Hysteresis: Output deviation at any temperature wi thin the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
  • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
  • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
  • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
  • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

Table 1. MAXIMUM RATINGS(NOTE) Table 2. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit Table 3. MECHANICAL CHARACTERISTICS Freescale Semiconductor, Inc.

4 Motorola Sensor Device Data MOTOROLA

Nominal Transfer Value: Vout = VS (P x 0.009 + 0.04) ± (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V ± 5% P kPa Transfer Function (MPX5100D, MPX5100G, MPXV5100G) Temperature Error Multiplier Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 13012010080 MPX5100D/MPX5100G/MPXV5100G Series Pressure Error Band Pressure in kPa 3.0 2.0 1.0 –1.0 –2.0 –3.0 0.0 0 20 40 60 80 100 120 Pressure Error (max) 0 to 100 kPa ± 2.5 kPa NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. 140 Error (kPa) Error Limits for Pressure MPX5100D/MPX5100G/MPXV5100G Series Temp Multiplier –40 3 0 to 85 1 +125 3 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MOTOROLA Motorola Sensor Device Data 5 Nominal Transfer Value: Vout = VS (P x 0.009 – 0.095) ± (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V ±5% P kPa Transfer Function (MPX5100A) Temperature Error Multiplier Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 13012010080 MPX5100A Series Pressure Error Band 140 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure in kPa 3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0 0 20 40 60 80 100 130 Error (kPa) Error Limits for Pressure Temp Multiplier –40 3 0 to 85 1 +125 3 Pressure Error (max) 15 to 115 kPa ± 2.5 kPa MPX5100A Series Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

6 Motorola Sensor Device Data MOTOROLA

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the Table below:

ORDERING INFORMATION

The MPX5100/MPXV5100 pressure sensor is available in absolute, differential, gauge, and vacuum configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mount- ing ease and barbed hose pressure connections. INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. Figure 5. SOP Footprint (Case 482)

0.060 TYP 8X

0.100 TYP 8X

Freescale Semiconductor, Inc.

MOTOROLA Motorola Sensor Device Data 7 PACKAGE DIMENSIONS PIN 1 F G N L R 123456

6 PLD

MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). CASE 867-08 ISSUE N BASIC ELEMENT DATE 09/20/99 CASE 867B-04 ISSUE F SEATING PLANE R N C J PIN 1 MQM0.25 T B 6X DG F S K V SPM0.173 Q ST L U A 2 34 5 T P P Q Q STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX MILLIMETERS

2.54 BSC

23.11 BSC

A B C D F G J K L N P Q R S U V MIN 29.08 17.4 7.75 0.68 1.22 0.36 17.65 7.37 10.67 3.89 3.89 5.84 5.59 4.62 MAX 29.85 18.16 8.26 0.84 1.63 0.41 18.42 7.62 11.18 4.04 4.04 6.35 6.1 4.93 NOTES: DIMENSIONS ARE IN MILLIMETERS. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CASE 867B-04 ISSUE F PRESSURE SIDE PORTED (AP, GP) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

8 Motorola Sensor Device Data MOTOROLA

NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. R X 123 456 PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) PORT #1 POSITIVE PRESSURE (P1) PIN 1 PORT #2 VACUUM (P2) SEATING PLANESEATING PLANE -T- -T- P G C J N B F D 6 PL W V L U S K -Q- -A-MQM0.25 (0.010) T MAM0.13 (0.005) STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 0.220 0.240 5.59 6.10 PRESSURE AND VACUUM SIDES PORTED (DP) CASE 867C-05 ISSUE F DATE 12/12/96 CASE 867F-03 ISSUE D C E V J PORT #1 POSITIVE PRESSURE (P1) -T- -P- MQM0.25 (0.010) T D 6 PL F G K PIN 1 U A B R S N -Q- SPM0.13 (0.005) Q ST 65 4321 STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D E F G J K N P Q R S U V MIN 1.080 0.740 0.630 0.027 0.160 0.048 0.014 0.070 0.150 0.150 0.440 0.695 0.840 0.182 0.220 MAX 1.120 0.760 0.650 0.033 0.180 0.064 0.016 0.080 0.160 0.160 0.460 0.725 0.860 0.194 0.240 MIN 27.43 18.80 16.00 0.68 4.06 1.22 0.36 1.78 3.81 3.81 11.18 17.65 21.34 4.62 5.59 MAX 28.45 19.30 16.51 0.84 4.57 1.63 0.41 2.03 4.06 4.06 11.68 18.42 21.84 4.93 6.10 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. PRESSURE SIDE AXIAL PORT (GSX) CASE 867F-03 ISSUE D Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MOTOROLA Motorola Sensor Device Data 9 PIN 1 IDENTIFIER H SEATING PLANE -T- W CASE 482A-01 ISSUE A DATE 05/13/98 C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S SMALL OUTLINE PACKAGE SURFACE MOUNT CASE 482A-01 ISSUE A DATE 06/12/98 CASE 482C-03 ISSUE B MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D G J K M N S V W MIN 0.415 0.415 0.500 0.026 0.009 0.100 0.444 0.540 0.245 0.115 MAX 0.425 0.425 0.520 0.034 0.011 0.120 15˚ 0.448 0.560 0.255 0.125 MIN 10.54 10.54 12.70 0.66 0.23 2.54 11.28 13.72 6.22 2.92 MAX 10.79 10.79 13.21 0.864 0.28 3.05 15˚ 11.38 14.22 6.48 3.17 PIN 1 IDENTIFIER K SEATING PLANE-T- W DETAIL X S G -A- -B-N C V M J D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. SMALL OUTLINE PACKAGE THROUGH-HOLE CASE 482C-03 ISSUE B Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

10 Motorola Sensor Device Data MOTOROLA

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MOTOROLA Motorola Sensor Device Data 11 NOTES Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center Motorola Literature Distribution 3-20-1 Mi nami-Azabu. Minato-ku, Tokyo 106-8573, Japan P.O. Box 5405, Denver, Colorado 80217 81-3-3440-3569 1-800-521-6274 or 480-768-2130 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong 852-26668334 HOME PAGE: http://motorola.com/semiconductors MPX5100/D Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notic e to any products herein. Motorola makes no warranty, represen tation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or spec ifications can and do vary in different applications and actual performance may var y over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as compon ents in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, s ubsidiaries, affiliates, and di stributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of persona l injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufa cture of the part. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are t he property of their respective owners. © Motorola, Inc. 2004 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...