MPX5100 FREESCALE | Alldatasheet
Document overview
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Technical content
Features
- 2.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Available in Absolute, Differential and Gauge Configurations Durable Epoxy Unibody Element Easy-to-Use Chip Carrier Option Typical Applications Patient Monitoring Process Control Pump/Motor Control Pressure Switching
ORDERING INFORMATION
No. MPX Series Order Number Device Marking UNIBODY PACKAGE (MPX5100 SERIES) Basic Elements Differential 867 MPX5100D MPX5100D Ported Elements Differential Dual Ports 867C MPX5100DP MPX5100DP Gauge, Single Port 867B MPX5100GP MPX5100GP Gauge, Axial PC Mount 867F MPX5100GSX MPX5100D Gauge, Axial Port, SMT 482A MPXV5100GC6U MPXV5100G Gauge, Axial Port, DIP 482C MPX5V100GC7U MPXV5100G Gauge, Dual Port, SMT 1351 MPXV5100DP MPXV5100 MPX5100/MPXV5100 SERIES INTEGRATED PRESSURE SENSOR 0 to 100 kpa (0 to 14.5 psi) 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.7 V Output PIN NUMBER(1) 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead.
1 N/C 5 N/C
2 VS 6 N/C
3 GND 7 N/C
4 VOUT 8 N/C
PIN NUMBER(1) 1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
1 VOUT 4 N/C
2 GND 5 N/C
3 VS 6 N/C
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Figure 1. Fully Integrated Pressure Sensor Schematic TABLE 1. Maximum Ratings(1)
- Exposure beyond the specified limits may caus e permanent damage or degradation to the device.
TABLE 2. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
- 0.1 kPa (kiloPascal) equals 0.145 psi.
- Device is ratiometric within this specified excitation range.
- Offset (V OFF) is defined as the output voltage at the minimum rated pressure.
- Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
- Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
- Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relati onship with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. or maximum rated pressure at 25°C. TcSpan: Output deviation over the temperatur e range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with mi nimum pressure applied over the temperatur e range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS at 25°C.
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Transfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04) ± (Pressure Error x Temp. Mult. x 0.009 x V S) VS = 5.0 V ±5% P kPa Temperature Error Multiplier MPX5100D/MPX5100G/MPXV5100G Series Temp Multiplier 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 14012010080 - 40 3 0 to 85°C 1 +125° 3 Break Points Temperature in °C Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band Pressure in kPa 3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0 02 04 0 6 0 8 0 1 0 0 120 Pressure Error (max) 0 to 100 kPa ± 2.5 kPa Error (kPa) Error Limits for Pressure MPX5100D/MPX5100G/MPXV5100G Series
Transfer Function (MPX5100A) Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.095) ± (Pressure Error x Temp. Mult. x 0.009 x V S) VS = 5.0 V ±5% P kPa Temperature Error Multiplier MPX5100A Temp Multiplier 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 13012010080 140 - 40 3 0 to 85°C 1 +125° 3 Break Points Temperature in °C Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Series Pressure Error Band Pressure in kPa 3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0 02 04 0 6 0 8 0 1 0 0 130 Pressure Error (max) 15 to 115 kPa ± 2.5 kPa Error (kPa) Error Limits for Pressure MPX5100A Series
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Figure 5. Small Outline Package Footprint TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
H SEATING PLANE -T- W C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT .S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D G J K M N S V W MIN 0.415 0.415 0.500 0.026 0.009 0.100 0.444 0.540 0.245 0.115 MAX 0.425 0.425 0.520 0.034 0.011 0.120 15˚ 0.448 0.560 0.255 0.125 MIN 10.54 10.54 12.70 0.66 0.23 2.54 11.28 13.72 6.22 2.92 MAX 10.79 10.79 13.21 0.864 0.28 3.05 15˚ 11.38 14.22 6.48 3.17 PIN 1 IDENTIFIER K SEATING PLANE-T- W DETAIL X S G -A- -B-N C V M J D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX5100 Sensors Freescale Semiconductor 7
F G N L R 123456
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MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). CASE 867-08 ISSUE N UNIBODY PACKAGE SEATING PLANE R N C J PIN 1 MQM0.25 T B 6X DG F S K V SPM0.173 Q ST L U A 2 34 5 T P P Q Q STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX MILLIMETERS
2.54 BSC
23.11 BSC
A B C D F G J K L N P Q R S U V MIN 29.08 17.4 7.75 0.68 1.22 0.36 17.65 7.37 10.67 3.89 3.89 5.84 5.59 4.62 MAX 29.85 18.16 8.26 0.84 1.63 0.41 18.42 7.62 11.18 4.04 4.04 6.35 6.1 4.93 NOTES: DIMENSIONS ARE IN MILLIMETERS. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CASE 867B-04 ISSUE F UNIBODY PACKAGE MPX5100 Sensors
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NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH.R X 123 456 PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) PORT #1 POSITIVE PRESSURE (P1) PIN 1 PORT #2 VACUUM (P2) SEATING PLANESEATING PLANE -T- -T- P G C J N B F D 6 PL W V L U S K -Q- -A-MQM0.25 (0.010) T MAM0.13 (0.005) STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 0.220 0.240 5.59 6.10 CASE 867C-05 ISSUE F UNIBODY PACKAGE C E V J PORT #1 POSITIVE PRESSURE (P1) -T- -P- MQM0.25 (0.010) T D 6 PL F G K PIN 1 U A B R S N -Q- SPM0.13 (0.005) Q ST 65 4321 STYLE 1: PIN 1. VOUT 2. GROUND 3. V CC 4. V1 5. V2 6. V EX MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D E F G J K N P Q R S U V MIN 1.080 0.740 0.630 0.027 0.160 0.048 0.014 0.070 0.150 0.150 0.440 0.695 0.840 0.182 0.220 MAX 1.120 0.760 0.650 0.033 0.180 0.064 0.016 0.080 0.160 0.160 0.460 0.725 0.860 0.194 0.240 MIN 27.43 18.80 16.00 0.68 4.06 1.22 0.36 1.78 3.81 3.81 11.18 17.65 21.34 4.62 5.59 MAX 28.45 19.30 16.51 0.84 4.57 1.63 0.41 2.03 4.06 4.06 11.68 18.42 21.84 4.93 6.10 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. CASE 867F-03 ISSUE D UNIBODY PACKAGE MPX5100 Sensors Freescale Semiconductor 9
NOTES: CONTROLLING DIMENSION: INCH. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. N A C 0.004 (0.1) DETAIL G SEATING PLANE P D E e/2 e AM0.004 (0.1) B C A B A0.006 (0.15) BC 8X b
2 PLACES 4 TIPS
F MIN MAX MIN MAX MILLIMETERSINCHES 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0.100 BSC 2.54 BSC 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0˚ 7˚ 0˚ 7˚ DIM A b D E e M N P T F K L θ K M GAGE PLANE DETAIL G L A1 θ.014 (0.35) STYLE 1: PIN 1. GND 2. +Vout 3. Vs 4. -Vout 5. N/C 6. N/C 7. N/C 8. N/C STYLE 2: PIN 1. N/C 2. Vs 3. GND 4. Vout 5. N/C 6. N/C 7. N/C 8. N/C CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE MPX5100 Sensors
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