MPX5050 FREESCALE | Alldatasheet

Document overview

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Technical content

Features

  • 2.5% Maximum Error over 0 ° to 85°C
  • Ideally suited for Mi croprocessor or Microcontroller-Based Systems
  • Temperature Compensated Over –40 ° to +125°C
  • Patented Silicon Shear Stress Strain Gauge
  • Durable Epoxy Unibody Element
  • Easy-to-Use Chip Carrier Option

ORDERING INFORMATION

No. MPX Series Order No. Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV5050G SERIES) Ported Element Side Port 1369 MPXV5050GP Trays MPXV5050G Dual Port 1351 MPXV5050DP Trays MPXV5050G Axial Port 482A MPXV5050GC6U Trays MPXV5050G 482A MPXV5050GC6T1 Tape & Reel MPXV5050G UNIBODY PACKAGE (MPX5050 SERIES) Basic Element Differential 867 MPX5050D — MPX5050D Ported Element Differential Dual Ports 867C MPX5050DP — MPX5050DP Gauge 867B MPX5050GP — MPX5050GP MPX5050 MPXV5050G SERIES INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 V Output SMALL OUTLINE PACKAGE MPXV5050GP CASE 1369-01 MPXV5050DP CASE 1351-01 SURFACE MOUNT SMALL OUTLINE PACKAGE PIN NUMBERS(1) 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.

1 N/C 5 N/C

2 VS 6 N/C

3 Gnd 7 N/C

4 Vout 8 N/C

UNIBODY PACKAGE PIN NUMBERS(1) 1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.

1 Vout 4 N/C

2 Gnd 5 N/C

3 VS 6 N/C

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Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)

  1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Table 2. . Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this specified excitation range.
  3. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  4. Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
  5. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  6. Accuracy (error budget) consists of the following:
  • Linearity: Output deviation from a straight line relati onship with pressure over the specified pressure range.
  • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
  • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25°C.
  • TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
  • TcOffset: Output deviation with minimum pres sure applied, over the temperature range of 0° to 85°C, relative to 25°C.
  • Variation from Nominal: T he variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. ——— ±2.5 %V FSS Sensitivity V/P — 90 —- mV/kPa Response Time(7) 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. tR —1 . 0 — - m s Output Source Current at Full Scale Output I o+ —0 . 1 — - m A d c Warm-Up Time(8) 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. ——2 0 — - m s Offset Stability(9) 9. Offset Stability is the product's output deviation when subjec ted to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. —— ±0.5 —- %V FSS

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0× to 85×C using the decoupling circuit shown in Figure 4. the power supply is recommended. Figure 2. Output versus Pressure Differential Figure 3. Cross-Sectional Diagram Figure 4. Recommended Power Supply Decoupling Table 3. Mechanical Characteristics

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04) ± (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V ± 0.25 Vdc Transfer Function MPX5050/MPXV5050G SERIES Temp Multiplier –40 3 0 to 85 1 +125 3Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Temperature Error Band Pressure Error (Max) Pressure Error Band 0 to 50 (kPa) ±1.25 (kPa) Error Limits for Pressure Pressure (in kPa) 3.0 2.0 1.0 –1.0 –2.0 –3.0 0.0 0 1 0 2 03 0 4 05 0 60 Pressure Error (kPa) Part Number Case Type Pressure (P1) Side Identifier MPX5050D 867 Stainless Steel Cap MPX5050DP 867C Side with Part Marking MPX5050GP 867B Side with Port Attached MPXV5050GP 1369 Side with Port Attached MPXV5050DP 1351 Side with Part Marking MPXV5050GC6U/T1 482A Vertical Port Attached

F G N L R 123456

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MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). CASE 867-08 ISSUE N UNIBODY PACKAGE MPX5050 Sensors

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NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH.R X 123 456 PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) PORT #1 POSITIVE PRESSURE (P1) PIN 1 PORT #2 VACUUM (P2) SEATING PLANESEATING PLANE -T- -T- P G C J N B F D 6 PL W V L U S K -Q- -A-MQM0.25 (0.010) T MAM0.13 (0.005) STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 0.220 0.240 5.59 6.10 CASE 867C-05 ISSUE F UNIBODY PACKAGE

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Freescale Semiconductor 11 PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 2

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Freescale Semiconductor 13 PACKAGE DIMENSIONS PIN 1 IDENTIFIER H SEATING PLANE -T- W C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT .S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE

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