MPX4250A NXP | Alldatasheet
Document overview
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Technical content
1 General description
measurement can be used to compute the amount of fuel required for each cylinder. sensor a logical and economical choice for the automotive system engineer.
2 Features
- 1.5 % maximum error over 0 °C to 85 °C
- Specifically designed for intake manifold absolute pressure sensing in engine control systems
- Patented silicon shear stress strain gauge
- Temperature compensated over –40 °C to +125 °C
- Offers reduction in weight and volume compared to existing hybrid modules
- Durable epoxy unibody element or thermoplastic small outline, surface mount package
- Ideal for non-automotive applications
- Available in three small outline packages and two unibody packages MPXA4250A6U 98ASB17756C MPXA4250AC6U/C6T1 98ASB17757C MPX4250A 98ASB42793B MPX4250AP 98ASB42796BCASE 482-01 CASE 482A-01 CASE 867-08 CASE 867B-04
Figure 1. Small outline and unibody packages
3 Typical applications
- Turbo boost engine control
- Ideally suited for microprocessor or microcontroller-based systems
4 Ordering information
Table 1. Ordering information
5 Block diagram
Pins 4, 5 and 6 are NO CONNECTS for unibody package devices. 3 (Small outline package)Pins 1, 5, 6, 7, and 8 are NO CONNECTSfor small outline package devices. Figure 2. Block diagram
6 Pinning information
6.1 Pinning
Figure 3. Pinning diagram
6.2 Pin description
Table 2. Pin descriptions — Unibody package Table 3. Pin descriptions — Small outline package
7 Mechanical and electrical specifications
7.1 Maximum ratings
Table 4. Maximum ratings damage or degradation to the device.
7.2 Operating characteristics
Table 5. Operating characteristics [1] 1.0 kPa (kiloPascal) equals 0.145 psi. [2] Device is ratiometric within this specified excitation range. [3] Offset (Voff) is defined as the output voltage at the minimum rated pressure. [4] Full scale output (VFSO) is defined as the output voltage at the maximum or full rated pressure. output voltage at the minimum rated pressure.
- Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
- Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero pressure applied.
- Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 °C.
- TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.
- TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C. Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25 °C. [7] Response time is defined as the time for the incremental change in the output to go from 10 % to 90 % of its final value when subjected to a specified step change in pressure. [8] Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. [9] Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test.
8 On-chip temperature compensation and calibration
reliability and qualification tests are based on use of dry air as the pressure media.
Figure 7. Transfer function Note: The temperature multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Figure 8. Temperature error band Figure 9. Pressure error band
9 Package information
9.1 Minimum recommended footprint for surface mounted applications
0.060 TYP 8X
0.100 TYP 8X
Figure 10. SOP footprint (Case 482)
9.2 Package description
Figure 11. Package name 98ASB15576C, Case 482-01 Issue O, Small outline package
NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Data sheet: technical data Rev. 8.0 — 25 July 2017
Figure 14. Package name 98ASB42796B, Case 867B-04, Issue J
Table 6. Revision history
- Legal texts have been adapted to the new company name where appropriate.
- Updated the document title from "Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated" to "0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated."
- Added Figure 1 "Small outline and unibody packages" in Section 2 "Features".
- Updated Table 1 "Ordering information" in Section 4 "Ordering information".
- Revised Figure 2 "Block diagram " in Section 5 "Block diagram" as follows: – Changed VS to VCC
- Added pinning illustration as Figure 3 "Pinning diagram" in Section 6.1
- Added pin descriptions in Table 2 "Pin descriptions — Unibody package" and Table 3 "Pin descriptions — Small outline package" in Section 6.2.
- Changed VS to VCC in the description and within the body of Table 5 "Operating characteristics" in Section 7.2 "Operating characteristics".
- Updated the figures in Section 8 "On-chip temperature compensation and calibration" as follows: – Figure 4 "Cross sectional diagram (not to scale)" – Figure 5 "Recommended power supply decoupling and output filtering" – Figure 6 "Output versus absolute pressure" – Figure 7 "Transfer function" – Figure 9 "Pressure error band"
- Updated the figures and figure titles in Section 9.2 "Package description" as follows: – Figure 11 "Package name 98ASB15576C, Case 482-01 Issue O, Small outline package" – Figure 12 "Package name 98ASB17757C, Case 482A-01, Issue A, small outline package" – Figure 13 "Package name 98ASB42793B, Case 867-08, Issue N, unibody package" – Figure 14 "Package name 98ASB42796B, Case 867B-04, Issue J" MPX4250A v.7.0 20090131 Technical data — MPX4250A v.6.0
NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Data sheet: technical data Rev. 8.0 — 25 July 2017
11 Legal information
11.1 Data sheet status
Document status[1][2] Product status[3] Definition [short] Data sheet: product_preview Development This document contains certain information on a product under development. NXP reserves the right to change or discontinue this product without notice. {short] Data sheet: advance information Qualification This document contains information on a new product. Specifications and information herein are subject to change without notice. [short] Data sheet: technical data Production This document contains the product specification. NXP Semiconductors reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a technical data data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the technical data data sheet.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive
NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Data sheet: technical data Rev. 8.0 — 25 July 2017 applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Freescale — is a trademark of NXP B.V. NXP — is a trademark of NXP B.V.
NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Data sheet: technical data Rev. 8.0 — 25 July 2017 Tables Figures Fig. 5. Recommended power supply decoupling Fig. 11. Package name 98ASB15576C, Case Fig. 12. Package name 98ASB17757C, Case Fig. 13. Package name 98ASB42793B, Case Fig. 14. Package name 98ASB42796B, Case
NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2017. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 July 2017 Document identifier: MPx4250A