MPX4250A FREESCALE | Alldatasheet
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Technical content
Features
1.5% Maximum Error Over 0 ° to 85°C Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems Patented Silicon Shear Stress Strain Gauge Temperature Compensated Over -40 ° to +125°C Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules Durable Epoxy Unibody Element or Th ermoplastic Small Outline, Surface Mount Package Ideal for Non-Automotive Applications Typical Applications Turbo Boost Engine Control Ideally Suited for Mi croprocessor or Microcontroller-Based Systems
ORDERING INFORMATION
Type Options Case No. MPX Series Order Number Packing Options Device Marking SMALL OUTLINE PACKAGE(1) (MPXA4250A SERIES) 1. The MPXA4250A series pressure sensors are available in the basic element package or with pressure port fitting. Two packing options are offered for each type. Basic Elements
482 MPXA4250A6T1 Tape & Reel MPXA4250A
482A MPXA4250AC6T1 Tape & Reel MPXA4250A UNIBODY PACKAGE(2) (MPX4250A SERIES) 2. The MPX4250A series pressure sensors ar e available in the basic element package or with pressure port fittings providing mounting ease and barbed hose connections. Basic Element Ported Elements MPX4250A MPXA4250A SERIES MPXA4250A6U/6T1 CASE 482-01 INTEGRATED PRESSURE SENSOR 20 TO 250 kPA (2.9 TO 36.3 psi) 0.2 TO 4.9 V OUTPUT SMALL OUTLINE PACKAGES MPXA4250AC6U/C6T1 CASE 482A-01 SMALL OUTLINE PACKAGE PIN NUMBERS
1 N/C(1), (2)
- Pin 1 in noted by the notch in the lead. 2. Pins 1, 5, 6, and 7 are internal device connections. Do not connect to external circuitry or ground. 5(2) N/C
2 VS 6(2) N/C
3 GND 7(2) N/C
4 VOUT 8 N/C
UNIBODY PACKAGE PIN NUMBERS
1 VOUT
(1) 1. Pin 1 in noted by the notch in the lead.
4 N/C(2)
- Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground.
2 GND 5 N/C(2)
3 VS 6 N/C(2)
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Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
- TC = 25°C unless otherwise noted.
- Exposure beyond the specified limits may c ause permanent damage or degradation to the device.
Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.
Table 2. Operating Characteristics (VS = 5.1 VDC, TA = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in
- 1.0 kPa (kiloPascal) equals 0.145 psi.
- Device is ratiometric within this specified excitation range.
- Offset (V OFF) is defined as the output voltage at the minimum rated pressure.
- Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
- Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
- Accuracy (error budget) consists of the following:
and from the minimum or maximum operating temperature points, with zero differential pressure applied. minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, fo r Offset or Full Scale Span, as a percent of VFSS, at 25°C.
- Response Time is defined as the time form the incremental c hange in the output to go from 10% to 90% of its final value when subjected
to a specified step change in pressure.
- Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.
- Offset stability is the products output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. Mechanical Characteristics
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Figure 2. Cross Sectional Diagram (Not to Scale) sensor performance and long-term reliability. Figure 3. Recommended Power Supply Decoupling and compatibility in your application. of a microprocessor or microcontroller. output will saturate outside of the specified pressure range. Figure 4. Output vs. Absolute Pressure
Nominal Transfer Value: VOUT = VS (P × 0.004 - 0.04) ± (Pressure Error × Temp. Factor × 0.004 × VS) VS = 5.1 V ± 0.25 VDC Temperature Error Band Temp Multiplier - 40 3 0 to 85 1 +125 3 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 14012010080 Temperature Error Factor Temperature in C° NOTE: The Temperature Multiplier is a linear response from 0× to -40°C and from 85° to 125°C. Pressure Error (Max) 20 to 250 kPa ±3.45 (kPa) Pressure (kPa)75 100 125 150 175 200 22525 50 250 4.0 3.0 2.0 1.0 -1.0 -2.0 -3.0 -4.0 -5.0 5.0 Pressure Error (kPa) Pressure Error Band
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shorting between solder pads. Figure 5. SOP Footprint (Case 482)
0.060 TYP 8X
0.100 TYP 8X
S D 8 PL G SBM0.25 (0.010) A ST -A- -B- N C M J K PIN 1 IDENTIFIER H SEATING PLANE -T- DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE PIN 1 IDENTIFIER H SEATING PLANE -T- W C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT .S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPX4250A Sensors Freescale Semiconductor 7
F G N L R 123456
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MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). CASE 867-08 ISSUE N UNIBODY PACKAGE MPX4250A Sensors
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